JPWO2009025016A1 - 部品実装装置及び方法 - Google Patents
部品実装装置及び方法 Download PDFInfo
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- JPWO2009025016A1 JPWO2009025016A1 JP2009528890A JP2009528890A JPWO2009025016A1 JP WO2009025016 A1 JPWO2009025016 A1 JP WO2009025016A1 JP 2009528890 A JP2009528890 A JP 2009528890A JP 2009528890 A JP2009528890 A JP 2009528890A JP WO2009025016 A1 JPWO2009025016 A1 JP WO2009025016A1
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- 238000000034 method Methods 0.000 title claims description 69
- 239000000758 substrate Substances 0.000 claims abstract description 128
- 238000005286 illumination Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 6
- 239000012780 transparent material Substances 0.000 claims description 5
- 238000012937 correction Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 description 215
- 230000008569 process Effects 0.000 description 39
- 230000007246 mechanism Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 230000002706 hydrostatic effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
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- Y10T29/49—Method of mechanical manufacture
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
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Abstract
Description
22 XYステージ
22a 載置台
24,29 Zステージ
24a 貫通孔
25,30 ヘッド
26,28 カメラ
27,31 Z軸移動機構
32 位置合わせ機構
33 移動機構
34 位置合わせ板
35 位置合わせ用マーク
40 部品トレイ
41 カメラ視野
Claims (13)
- 複数の実装部品を基板に実装するための部品実装装置であって、
該基板を載置する載置台と、
第1の実装部品を支持する第1の部品支持部と、
第2の実装部品を支持する第2の部品支持部と、
前記第1の部品支持部に支持された前記第1の実装部品を上方から画像認識すると共に、前記載置台に載置された基板の実装面を前記第1の部品支持部の上方から画像認識する第1のカメラと、
前記第2の部品支持部に支持された第2の実装部品を下方から画像認識する第2のカメラと
を有することを特徴とする部品実装装置。 - 請求項1記載の部品実装装置であって、
前記第1の部品支持部は透明な材料で形成された吸着装置であり、前記第1のカメラは該吸着装置を透過して前記第1の実装部品及び前記基板の前記実装面を撮像することを特徴とする部品実装装置。 - 請求項1記載の部品実装装置であって、
前記第1のカメラで撮像した画像における位置と、前記第2のカメラで撮像した画像における前記第1のカメラの画像の位置とが整合するように画像認識結果を補正するための位置合わせ用マークを有することを特徴とする部品実装装置。 - 請求項3記載の部品実装装置であって、
前記第1のカメラと前記第2のカメラの各々は同軸照明装置を有し、
前記位置合わせ用マークは位置合わせ部材に形成された所定の形状の貫通孔あるいは所定の形状に光を透過しない部分を形成した透明部材であることを特徴とする部品実装装置。 - 請求項4記載の部品実装装置であって、
前記位置合わせ部材は前記第2のカメラの上方に移動可能であり、且つ前記第1のカメラは前記位置合わせ部材の上方に移動可能であり、前記1のカメラと前記第2のカメラは前記位置合わせ用マークを間に挟んで対向して整列するよう構成されたことを特徴とする部品実装装置。 - 第1の実装部品及び第2の実装部品を基板に実装する部品実装方法であって、
該第2の実装部品の形状を撮像して画像認識し、
前記第2の実装部品の形状の画像認識結果に基づいて、前記第1の実装部品を前記基板に実装し、
前記基板に実装された前記第1の実装部品の画像認識結果に基づいて、前記第2の実装部品を前記基板に実装する
ことを特徴とする部品実装方法。 - 請求項6記載の部品実装方法であって、
複数の前記第1の実装部品と一つの前記第2の実装部品とを対応した位置に実装する際、
画像認識により検出した前記第2の実装部品の形状に基づいて、前記基板上の複数の前記第1の実装部品の互いの位置を決定しながら実装することを特徴とする部品実装方法。 - 請求項7記載の部品実装方法であって、
前記第2の実装部品を支持してその裏面の形状を第2のカメラで撮像して形状を検出し、
前記第1の実装部品の一つを支持してその上面を第1のカメラで撮像して画像認識し、
前記基板の実装面を前記第1のカメラで画像認識し、
前記画像認識した前記第1の実装部品の一つを前記基板に実装し、
前記第1の実装部品の他の一つを支持してその上面を前記第1のカメラで撮像して画像認識し、
前記第2のカメラで検出した前記第2の実装部品の形状に基づいて、前記前記第1の実装部品の他の一つを前記基板に実装し、
前記基板上における前記第1の実装部品の位置の画像認識結果に基づいて、前記第2の実装部品を前記基板に実装する
ことを特徴とする部品実装方法。 - 請求項8記載の部品実装方法であって、
前記第1の実装部品の前記一つを前期基板に実装した後に、実装位置を前記第1のカメラで検出し、
前記前記第1の実装部品の他の一つを前記基板に実装した後に、実装位置を前記第1のカメラで検出し、
該実装位置の検出結果を前記第2の実装部品の実装に反映することを特徴とする部品実装方法。 - 請求項6記載の部品実装方法であって、
前記第1の実装部品を第1のカメラで撮像した画像における位置と、前記第2の実装部品を第2のカメラで撮像した画像における位置とが整合するように画像認識結果の補正を行うことを特徴とする部品実装方法。 - 請求項10記載の部品実装方法であって、
前記第1のカメラと前記第2のカメラを対向させて、その間に位置合わせマークを配置し、該位置合わせマークを前記第1のカメラと前記第2のカメラとで画像認識することで前記補正を行うことを特徴とする部品実装方法。 - 請求項6記載の部品実装方法であって、
前記第2の実装部品を支持してその裏面の形状を第2のカメラで撮像して形状を検出した結果をデータで保存し、その後の他の第2の実装部品の実装の際に該データを用いることを特徴とする部品実装方法。 - 請求項6記載の部品の実装方法であって、
前記第1の実装部品又は前記第2の実装部品を部品トレイから拾い上げる際に、該部品トレイの領域を分割して部分毎に撮像して画像データを取得し、該画像データを合成して前記部品トレイの全体画像を作成し、該全体画像から前記第1の実装部品又は前記第2の実装部品の位置を検出することを特徴とする部品実装方法。
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JP5562659B2 (ja) * | 2010-01-21 | 2014-07-30 | オリンパス株式会社 | 実装装置および実装方法 |
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US9756230B2 (en) | 2012-05-10 | 2017-09-05 | Fuji Machine Mfg. Co., Ltd. | Mounting and inspection data creation device and mounting and inspection data creation method |
US20140082935A1 (en) * | 2012-09-27 | 2014-03-27 | Volex Plc | Method for passive alignment of optical components to a substrate |
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JP5837015B2 (ja) * | 2013-09-30 | 2015-12-24 | 沖電気工業株式会社 | 半導体レーザモジュール及びその製造方法 |
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KR102238649B1 (ko) * | 2014-09-16 | 2021-04-09 | 삼성전자주식회사 | 반도체 칩 본딩 장치 |
US10223589B2 (en) | 2015-03-03 | 2019-03-05 | Cognex Corporation | Vision system for training an assembly system through virtual assembly of objects |
KR102050477B1 (ko) * | 2017-02-13 | 2019-11-29 | 시바우라 메카트로닉스 가부시끼가이샤 | 전자 부품의 실장 장치와 표시용 부재의 제조 방법 |
JP6663939B2 (ja) * | 2017-02-13 | 2020-03-13 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置と表示用部材の製造方法 |
JP6767333B2 (ja) * | 2017-09-28 | 2020-10-14 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
KR102122038B1 (ko) * | 2018-05-28 | 2020-06-11 | 세메스 주식회사 | 본딩 툴과 이를 포함하는 다이 본딩 장치 및 이를 이용하는 다이 본딩 방법 |
JP7343891B2 (ja) * | 2019-06-07 | 2023-09-13 | 株式会社ブイ・テクノロジー | 貼り合わせ装置、貼り合わせ方法及び表示装置の製造方法 |
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