JPS5847722Y2 - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS5847722Y2 JPS5847722Y2 JP1979048663U JP4866379U JPS5847722Y2 JP S5847722 Y2 JPS5847722 Y2 JP S5847722Y2 JP 1979048663 U JP1979048663 U JP 1979048663U JP 4866379 U JP4866379 U JP 4866379U JP S5847722 Y2 JPS5847722 Y2 JP S5847722Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- hole
- transistor
- printed circuit
- dissipation surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案は電力用トランジスタ等の電子部品の放熱面を熱
的に接続せしめるプリント基板に関し、簡単な構造にし
て上記放熱面からの放熱を確実に促進できるようにする
ことを目的とする。[Detailed Description of the Invention] The present invention relates to a printed circuit board that thermally connects the heat dissipation surfaces of electronic components such as power transistors, and has a simple structure that can surely promote heat dissipation from the heat dissipation surfaces. With the goal.
従来、プリント基板に装備される部品例えば電力用トラ
ンジスタの放熱を促進する方法の一つとして、トランジ
スタの放熱面に熱拡散コンパウンドを塗り、そのコンパ
ウンドを介してプリント基板に設けた放熱用金属箔部に
上記放熱面を重ね、留め金具でトランジスタをプリント
基板に向けて押えながらトランジスタのリードを半田付
けすることによりトランジスタを固定するとともに、そ
の放熱面をプリント基板の金属箔部に熱的に接続してい
た。Conventionally, one method of promoting heat dissipation of parts installed on printed circuit boards, such as power transistors, is to apply a heat dissipation compound to the heat dissipation surface of the transistor, and then apply the compound to the heat dissipation metal foil section provided on the printed circuit board. Place the heat dissipation surface on top of the transistor, hold the transistor toward the printed circuit board with a fastener, and solder the transistor leads to fix the transistor, and thermally connect the heat dissipation surface to the metal foil part of the printed circuit board. was.
ところで一般にプリント基板に備わる金属箔の表面は微
細な凹凸があって面精度に劣り、このためトランジスタ
の放熱面との密着性に欠けることが多く、さらに重要な
ことは放熱面とメッキ箔との間に介在している熱拡散コ
ンパウンドが樹脂を成分の一つとして含むなどの理由に
より経年劣化して放熱面からメッキ箔への熱伝導性が低
下し、このためトランジスタの放熱促進が充分に図れな
いようになるといった問題が生じていた。By the way, the surface of the metal foil on printed circuit boards generally has minute irregularities and poor surface precision, and as a result, it often lacks adhesion with the heat dissipation surface of the transistor, and more importantly, the bond between the heat dissipation surface and the plated foil is poor. Due to factors such as the presence of resin as one of the components in the heat diffusion compound interposed between the two, the thermal conductivity from the heat dissipation surface to the plated foil deteriorates over time, and as a result, the heat dissipation of the transistor cannot be sufficiently promoted. There was a problem that it became impossible to do so.
また前述のように熱拡散コンパウンドを放熱面に塗った
り、また留め金具で押えながらリードの半田付けをする
工程が含まれていることは自動化を進める上で支障にな
っていた。Additionally, as mentioned above, the process of applying heat diffusion compound to the heat dissipating surface and soldering the leads while holding them in place with fasteners was an obstacle to further automation.
本考案は上述のような従来における欠点を除こうとする
もので以下に図面を用いその実施例を説明する。The present invention is intended to eliminate the above-mentioned drawbacks of the conventional art, and embodiments thereof will be described below with reference to the drawings.
図面は本考案の一実施例を示し、１はトランジスタ、１
′は同トランジスタ放熱面、２は同トランジスタのリー
ド、３はプリント基板、４はプリント基板４に備わる銅
箔、４′は銅箔４の一部をなしトランジスタの放熱面１
′を熱的に接続せしめてトランジスタの放熱を促進する
放熱用銅箔部である。The drawings show an embodiment of the present invention, in which 1 is a transistor;
' is a heat dissipation surface of the transistor, 2 is a lead of the transistor, 3 is a printed circuit board, 4 is a copper foil provided on the printed circuit board 4, and 4' is a part of the copper foil 4 and is a heat dissipation surface 1 of the transistor.
This is a heat dissipation copper foil section that thermally connects the transistors and promotes heat dissipation from the transistor.
なおここで放熱部４′は放熱のみでなく配線導体として
の機能も兼ね備えることはもちろんである。Incidentally, the heat dissipating section 4' has the function of not only heat dissipation but also as a wiring conductor.
５はトランジスタのリード２挿入用の穴、６は放熱用銅
箔部４′が設けられた部分に穿設されトランジスタの放
熱面１′を半田付けするための半田付は穴で壁面にはス
ルーホールメッキが施され銅箔部４′の一部をなしてい
る。5 is a hole for inserting the lead 2 of the transistor, 6 is a hole drilled in the part where the heat dissipating copper foil part 4' is provided, and a soldering hole for soldering the heat dissipating surface 1' of the transistor, and a through hole on the wall surface. It is hole-plated and forms part of the copper foil section 4'.
なおリード挿入用の穴５の壁面にもスルーホールメッキ
が施されている。The wall surface of the lead insertion hole 5 is also plated through-hole.
半田付は穴６の径はトランジスタの放熱面１′のそれよ
りも小さくしである。For soldering, the diameter of the hole 6 should be smaller than that of the heat radiation surface 1' of the transistor.
７は一端が半田付は穴６に連なるようにして長方形に穿
設され半田付は時に穴６から空気を外部に逃すための空
気逃げ穴である。7 is bored in a rectangular shape so that one end is soldered and continues to the hole 6, and the soldered hole is sometimes an air escape hole for letting air escape from the hole 6 to the outside.
なお空気逃げ穴７は後述のようにトランジスタ１をその
放熱面１′が半田付は穴６を塞ぐようにして取付けたと
き、空気逃げ穴７の他端が放熱面１′の外側に出ている
ように設計されている。As will be described later, when the transistor 1 is mounted so that its heat dissipation surface 1' covers the soldering hole 6, the other end of the air escape hole 7 protrudes outside the heat dissipation surface 1'. It is designed to be.
以上のような構造を有するプリント基板３に、第１図に
示すようにトランジスタ１をその放熱面１′が半田付は
穴６を塞ぐようにして仮取付けし自動半田付は装置（図
示せず）に送り込むと、リード挿入用の穴５および半田
付は穴６に半田が流れ込み、第３図に示すようにプリン
ト基板３にトランジスタ１が半田８により取付は固定さ
れる。As shown in Fig. 1, the transistor 1 is temporarily mounted on the printed circuit board 3 having the above structure so that its heat dissipation surface 1' covers the soldering hole 6. ), the solder flows into the lead insertion hole 5 and the solder hole 6, and the transistor 1 is fixedly attached to the printed circuit board 3 by the solder 8, as shown in FIG.
なお半田付けに際しては前述のように半田付は穴６に連
なるようにして空気逃げ穴７を設けているので、半田が
流れ込むことにより穴６に閉じ込められようとする空気
は空気逃げ穴７を通って外部に放出され、したがって閉
じ込められた空気のためにトランジスタ１が浮き上がり
そのまま固定されてしまうというような現象は生じない
。When soldering, as mentioned above, since the air escape hole 7 is provided so that the solder is connected to the hole 6, the air that tends to be trapped in the hole 6 due to the solder flowing in will pass through the air escape hole 7. Therefore, a phenomenon such as the transistor 1 floating up and being fixed as it is due to the trapped air does not occur.
このようにして放熱面１′の中央部においては隙間なく
充填された半田８を介しまた放熱面１′の周縁部におい
ては直接に密着された状態であるいは放熱面１′と放熱
用銅箔部４′との間に隙間があるときにはその隙間に半
田８が流れ込んだ状態で放熱面１′と放熱用銅箔部４′
は互いに熱的に接続される。In this way, the central part of the heat dissipation surface 1' is in close contact with the heat dissipation surface 1' through the solder 8 filled without any gaps, and the heat dissipation surface 1' and the heat dissipation copper foil are in close contact with each other at the peripheral edge of the heat dissipation surface 1'. 4', the solder 8 flows into the gap between the heat dissipating surface 1' and the heat dissipating copper foil section 4'.
are thermally connected to each other.
以上のように本考案においてはトランジスタ等電子部品
の放熱面がプリント基板の金属箔に直接半田付けされる
ようになっているので放熱面から金属箔への熱伝性にす
すれたものとすることができ、したがって放熱面からの
放熱を確実に促進することができる。As described above, in the present invention, the heat dissipation surface of electronic components such as transistors is directly soldered to the metal foil of the printed circuit board, so that heat conduction from the heat dissipation surface to the metal foil is improved. Therefore, heat radiation from the heat radiation surface can be reliably promoted.
また放熱面と金属箔との接続に熱拡散コンパウンドでな
く半田を用いているために経年劣化がみられず熱伝導性
を常に安定に維持することができる。In addition, since solder is used instead of a thermal diffusion compound to connect the heat dissipation surface and the metal foil, there is no deterioration over time, and thermal conductivity can always be maintained stably.
さらに熱拡散コンパウンド塗布のような工程が含まれな
いために電子部品取付を自動化する上で有利である。Furthermore, since a process such as applying a heat diffusion compound is not included, it is advantageous in automating the mounting of electronic components.
またリード挿入用の穴におけると同様プリント基板の裏
面側から半田を充填すればよいので、リードの半田付は
工程において同時に放熱面の半田付けもでき、電子部品
取付の自動化を一層有利にする。Furthermore, since it is only necessary to fill the solder from the back side of the printed circuit board in the same way as in the hole for inserting the leads, the heat dissipation surface can be soldered at the same time as the soldering of the leads, making the automation of electronic component mounting even more advantageous.
また本考案においては前述のように空気逃げ穴を設けて
いるので半田を放熱面に隙間なく密着せしめて熱伝導性
を一層高めることができる。Furthermore, in the present invention, since the air escape hole is provided as described above, the solder can be brought into close contact with the heat radiation surface without any gaps, thereby further increasing thermal conductivity.
図は本考案の一実施例を示し、第１図はプリント基板に
トランジスタを仮取付けした状態を示す断面図、第２図
は同プリント基板の平面図、第３図は同基板にトランジ
スタを半田付けした状態を示す断面図である。
１・・・・・・トランジスタ、１′・・・・・・トラン
ジスタの放熱面、３・・・・・・プリント基板、４・・
・・・・銅箔、４′・・・・・・放熱用銅箔部、６・・
・・・・半田付は穴、７・・・・・・空気抜は穴、８・
・・・・・半田。The figures show an embodiment of the present invention; Fig. 1 is a cross-sectional view showing a state in which a transistor is temporarily attached to a printed circuit board; Fig. 2 is a plan view of the printed circuit board; and Fig. 3 shows a transistor soldered to the same board. FIG. 1...Transistor, 1'...Transistor heat dissipation surface, 3...Printed circuit board, 4...
...Copper foil, 4'...Copper foil part for heat dissipation, 6...
...For soldering, use the hole, 7...For air venting, use the hole, 8.
·····solder.
Claims (1)
る導体を備えるプリント基板において、上記放熱面が接
続される部分に、スルーホールメッキが施され上記放熱
面を半田付けするための半田付は穴と上記穴に連接し上
記放熱面を半田付けしたとき上記穴内の空気を逃がすた
めの空気逃げ穴とを設けたことを特徴とするプリント基
板。In a printed circuit board equipped with a conductor that is thermally connected to the heat dissipation surface of an electronic component such as a transistor, through-hole plating is applied to the part where the heat dissipation surface is connected, and the soldering for soldering the heat dissipation surface is done through holes. and an air escape hole connected to the hole and for allowing air in the hole to escape when the heat radiation surface is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979048663U JPS5847722Y2 (en) | 1979-04-11 | 1979-04-11 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979048663U JPS5847722Y2 (en) | 1979-04-11 | 1979-04-11 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55147793U JPS55147793U (en) | 1980-10-23 |
| JPS5847722Y2 true JPS5847722Y2 (en) | 1983-10-31 |
Family
ID=28932811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979048663U Expired JPS5847722Y2 (en) | 1979-04-11 | 1979-04-11 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847722Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008282830A (en) * | 2007-05-08 | 2008-11-20 | Opt Design:Kk | Printed board structure |
-
1979
- 1979-04-11 JP JP1979048663U patent/JPS5847722Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55147793U (en) | 1980-10-23 |
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