JPS58105556A - Mounting method of lsi package module to printed circuit board - Google Patents
Mounting method of lsi package module to printed circuit boardInfo
- Publication number
- JPS58105556A JPS58105556A JP56204289A JP20428981A JPS58105556A JP S58105556 A JPS58105556 A JP S58105556A JP 56204289 A JP56204289 A JP 56204289A JP 20428981 A JP20428981 A JP 20428981A JP S58105556 A JPS58105556 A JP S58105556A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- heat sink
- hole
- package module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、高密度ICのプリント板への取付は方法、特
にシートシンクの形成されたL日エパッケージモジー−
ルのプリント板への取付は方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for mounting a high-density IC on a printed circuit board, and more particularly, a method for mounting a high-density IC on a printed circuit board.
The method of attaching the module to the printed circuit board is related to the method.
高書度工0として、第1図に示すごときL8エバ、ケー
ジ1上にヒートシンク2を取付けたものがある。かかる
LSIのプリント板(第1図ではその一部を示しである
)3への取付けはL8エバツケー〇elの周囲に延びた
リード端子4をプリント板3のブリ、ント配線へ半田付
けして行われる。As a high-quality work 0, there is an L8 Eva as shown in FIG. 1, in which a heat sink 2 is mounted on a cage 1. The LSI is attached to the printed circuit board 3 (part of which is shown in FIG. 1) by soldering the lead terminals 4 extending around the L8 battery to the printed wiring on the printed circuit board 3. be exposed.
ここで、ヒートン/り2を含め九プリント板3への取付
は後の高さは、Aである。したがってLSIの実装され
たプリント板を重ねる場合、プリント板間隔は最低Aだ
け必要である。同時に、強制空冷のための空気の流れは
、プリント板の間を流れることにより、LSIの発熱を
ヒートシンク2の取付けられた側のみで冷却することに
なる0かかる点から本発明では、プリント板を重ねて実
装される場合のプリント板間隔の減少と、!+8工の発
熱に対し1両面から空気の流れを当てることにより冷却
効果を高めるようにしたL日エバッケージモジ為−ルの
プリント板への実装方法を提供することを目的とするも
のである。そしてその特徴は、ヒートV/りがLSIパ
ッケージ上に形成されたIIBXパッケージ毫ジ為−ル
のプリント板への取付方法において、シートシンクをL
8エパッケージの裏面に設け、且つプリント板に、該シ
一トシンクが貫通する穴を形成するようにしたことにあ
る。Here, the height after mounting to the nine printed board 3 including Heaton/Li 2 is A. Therefore, when stacking printed boards on which LSIs are mounted, a minimum interval of A is required between the printed boards. At the same time, the air flow for forced air cooling flows between the printed boards, so that the heat generated by the LSI is cooled only on the side where the heat sink 2 is attached.From this point of view, in the present invention, the printed boards are overlapped. Reduction in printed board spacing when implemented, and! The object of the present invention is to provide a method for mounting an L-day package module on a printed board, which enhances the cooling effect by applying air flow from one side to the heat generated by +8cm. The feature is that the heat V/R is used to attach the sheet sink to the printed board of the IIBX package wall formed on the LSI package.
The seat sink is provided on the back side of the 8-e package, and a hole is formed in the printed board through which the seat sink passes.
以上本発明実施例について詳細に説明する。The embodiments of the present invention will be described in detail above.
第2図が本発明の実施例であり、第1図と同部分には同
一の番号を付しである。第2図で((イ)がプリント板
3へL8工1を取付は後の斜視図であり、c c’面で
の断面図が第2図(ロ)である。第1図の取付は方法と
異なる点は、プリント板(ここでは多鳩配線基板)3に
シートシンク2が貫通する穴を設け、L8工1の裏面に
かかるヒートシンク2が取付けられるようにしている0
このようにすることにより、ヒートシンク2を含めた嶌
さはBの大きさとなり、従来の方法に較ベリード端子4
の高さ分だけ小さく、Bくムの関係が成立つ。したがり
て、プリント板を重ねて実装する場合もプリント板間隔
を小さくすることができ、実装密度を上げることが可能
である。FIG. 2 shows an embodiment of the present invention, and the same parts as in FIG. 1 are given the same numbers. In Fig. 2, ((A) is a later perspective view of installing L8 work 1 to printed board 3, and Fig. 2(B) is a cross-sectional view on the c-c' plane.The installation in Fig. 1 is The difference from the method is that a hole is provided in the printed board (here, a multi-circuit board) 3 through which the sheet sink 2 passes, so that the heat sink 2 on the back side of the L8 workpiece 1 can be attached.
By doing this, the size including the heat sink 2 becomes the size B, and compared to the conventional method, the buried terminal 4
It is smaller by the height of , and the relationship B is established. Therefore, even when printed boards are stacked and mounted, the interval between printed boards can be reduced, and the packaging density can be increased.
更に冷却空気について考察すると第3図に示すように本
発明方法によって、1で示す流れが得られる。したがっ
て、L81の両面に均等に冷却空気が接触することがで
きるので、冷却効果が良好となる。Further considering the cooling air, as shown in FIG. 3, the flow indicated by 1 is obtained by the method of the present invention. Therefore, the cooling air can come into contact with both surfaces of L81 evenly, resulting in a good cooling effect.
以上述べえように本発明方法によりて、LANの高密度
実装が可能となり、且つ冷却効果が良好となるので、電
算機のハード構成に極めて有用な技術となる。As described above, the method of the present invention enables high-density packaging of LAN and provides a good cooling effect, making it an extremely useful technique for the hardware configuration of computers.
第1図は従来の方法の説明図、第2図は本発明の実施例
、第3図は本発明実施例の効果説明図を示す。
図において、lはL8工、2はヒートシンク、(111
1)
特許庁長官殿
1・l IQの表示
昭和56年特許願第204289号
3 補11゛をする者
+ll I↑−との関係 特許出硬人住所 神
奈川県用崎市中原区11小田中1015番地(522)
名称富士通株式会社
4 代 理 人 Ir:所 神奈川県用崎
市中廃区I−/1・H]中1015番j也8補正の内容
別紙O過り
1)本願明細書特許請求の範囲を次の様に文字修正する
。
「ヒートシンクがL8エパッケージ上に形成さnたLB
エパッケージモジュールのプリント板への取付方法にお
いて、ヒートシンクt−I、81パッケージの裏面に設
け、且つ、プリント板に該ヒートシンクが貫通する孔を
形成するようにしたことを特徴とするLSIバックージ
モジュールのプリント板への取付方法。」
2)本願明細書第3頁第15行、第2頁第19行と第2
0行および第3頁第9行の「ンートシンク」ヲ「ヒート
シンク」と修正する。
3)本願明細書第3頁第1行と第9行の「穴」を「孔」
と修正する□
4)本願明細書図面における第3図を説明文字を削除し
た適正な図面とさしかえる。FIG. 1 is an explanatory diagram of a conventional method, FIG. 2 is an embodiment of the present invention, and FIG. 3 is an explanatory diagram of the effect of the embodiment of the present invention. In the figure, l is L8, 2 is heat sink, (111
1) Mr. Commissioner of the Japan Patent Office 1.l Indication of IQ Patent Application No. 204289 of 1982 Supplement 11 Relationship with +ll I↑- Patent issuer Address 1015 Odanaka, 11, Nakahara-ku, Yozaki City, Kanagawa Prefecture (522)
Name: Fujitsu Limited 4 Representative: Ir: Address: I-/1/1/H, Nakausei-ku, Yozaki City, Kanagawa Prefecture] Naka 1015 No. jya 8 Contents of the amendment Attachment O 1) The scope of the present specification and claims is as follows: Correct the text like this. LB where the heat sink is formed on the L8 package.
A method for attaching an e-package module to a printed circuit board, characterized in that a heat sink t-I is provided on the back surface of the 81 package, and a hole is formed in the printed board through which the heat sink passes. How to attach the module to the printed board. 2) Page 3, line 15, page 2, line 19 and 2 of the specification of the present application
0 line and 3rd page, 9th line, "Heat sink" is corrected to "Heat sink". 3) The "hole" in the first and ninth lines of page 3 of the specification of the present application is changed to "hole".
□ 4) Replace Figure 3 in the drawings of this specification with an appropriate drawing with explanatory characters deleted.
Claims (1)
パッケージモジ、−ルのプリント板への取付方法にシい
て、シートシンクをL8エパッケージの裏面に設け、且
つ、プリント板に該シートシンクが貫通する穴を形成す
るようにしたことを特徴とするL8エパッケージモジ為
−ルのプリント板への取付は方法。According to the method of attaching the L8 package module to the printed board, in which the heat sink is formed on the LSI package, a sheet sink is provided on the back side of the L8 package, and the sheet sink penetrates the printed board. This is a method for attaching the L8 package module to a printed board, which is characterized by forming holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56204289A JPS58105556A (en) | 1981-12-17 | 1981-12-17 | Mounting method of lsi package module to printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56204289A JPS58105556A (en) | 1981-12-17 | 1981-12-17 | Mounting method of lsi package module to printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58105556A true JPS58105556A (en) | 1983-06-23 |
Family
ID=16488009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56204289A Pending JPS58105556A (en) | 1981-12-17 | 1981-12-17 | Mounting method of lsi package module to printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58105556A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7443687B2 (en) | 2006-03-14 | 2008-10-28 | Nec Corporation | Heat sink mounting device and mounting method, and server blade using the same |
-
1981
- 1981-12-17 JP JP56204289A patent/JPS58105556A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7443687B2 (en) | 2006-03-14 | 2008-10-28 | Nec Corporation | Heat sink mounting device and mounting method, and server blade using the same |
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