JPH10107400A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH10107400A JPH10107400A JP26289196A JP26289196A JPH10107400A JP H10107400 A JPH10107400 A JP H10107400A JP 26289196 A JP26289196 A JP 26289196A JP 26289196 A JP26289196 A JP 26289196A JP H10107400 A JPH10107400 A JP H10107400A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- die attach
- tab component
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ダイアタッチ剤な
どの接着部剤を用いて半導体ベアチップ等の電子部品を
搭載するプリント配線板に係り、特に、放熱を必要とす
る電子部品を搭載するのに好適なプリント配線板に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board on which electronic components such as semiconductor bare chips are mounted by using an adhesive such as a die attach agent, and more particularly, to a method for mounting electronic components requiring heat radiation. The present invention relates to a printed wiring board suitable for the present invention.
【０００２】[0002]
【従来の技術】近年のプリント配線板においては、表面
実装部品や半導体ベアチップ等を基板に直接搭載するこ
とにより、実装密度を大きくすることが図られている。
このようなプリント配線板に実装される半導体ベアチッ
プ等の部品には、放熱を必要とするものがあり、それに
対応する従来技術として、例えば、特開平６−８５４２
７号公報に記載のものがある。この技術では、半導体パ
ッケージの下部が対応するプリント配線板にスルーホー
ルを設け、半導体パッケージと基板を密接して配置する
ことで、半導体部品の放熱を図っている。2. Description of the Related Art In recent printed wiring boards, mounting density is increased by directly mounting surface mount components, semiconductor bare chips, and the like on a substrate.
Some components such as a semiconductor bare chip mounted on such a printed wiring board require heat radiation, and as a corresponding prior art, for example, Japanese Patent Application Laid-Open No. 6-8542.
There is one described in JP-A-7. In this technique, a through hole is provided in a printed wiring board corresponding to a lower portion of a semiconductor package, and the semiconductor package and the substrate are arranged in close contact with each other to achieve heat dissipation of the semiconductor component.
【０００３】しかし、ＴＡＢ（Tape Automated Bondin
g）部品等を搭載するプリント配線板においては、ＴＡ
Ｂ部品の半導体チップとプリント配線板を、ダイアタッ
チ剤等の接着剤を用いて接合するので、このようなスル
ーホールを設けた場合、このスルーホールからダイアタ
ッチ剤が流出したり、ボイド等が発生する可能性があ
る。このようなスルーホールからのダイアタッチ剤の流
出や、ボイドの発生は、接合強度および放熱特性を低下
させる原因となる。このような問題に対処するために
は、ダイアタッチ剤の塗布量の厳密な管理等が必要とな
ってくる。However, TAB (Tape Automated Bondin)
g) For printed wiring boards on which components are mounted, TA
Since the semiconductor chip of the B component and the printed wiring board are joined using an adhesive such as a die attach agent, when such a through hole is provided, the die attach agent flows out of the through hole, voids, etc. Can occur. Such outflow of the die attach agent from the through holes and generation of voids cause a reduction in bonding strength and heat radiation characteristics. In order to deal with such a problem, it is necessary to strictly control the application amount of the die attach agent.
【０００４】このように、プリント配線板上のスルーホ
ールにより、ダイアタッチ剤を塗布する際の塗布量コン
トロールが困難となり、ダイアタッチ剤の均一塗布およ
び放熱特性が低下する原因となる。また、スルーホール
を設けない場合には、放熱効果が得られず、かつ、過剰
なダイアタッチ剤が、半導体チップとプリント配線板の
間から押し出され、ＴＡＢ部品等のはんだ付け接続個所
やインナーリードに接触し、短絡する原因となる。As described above, the through-holes on the printed wiring board make it difficult to control the amount of the die-attaching agent applied, thereby causing a uniform application of the die-attaching agent and a reduction in heat radiation characteristics. If no through hole is provided, the heat dissipation effect cannot be obtained, and excessive die attach agent is pushed out from between the semiconductor chip and the printed wiring board, and comes into contact with the soldering connection points such as TAB parts and the inner leads. And cause a short circuit.
【０００５】[0005]
【発明が解決しようとする課題】解決しようとする問題
点は、従来の技術では、放熱が必要なＴＡＢ部品等の半
導体チップをダイアタッチ剤等の接着剤を用いて接合す
る場合、放熱効果の維持と、接着剤の供給量の管理の簡
便化を図ることができない点である。本発明の目的は、
これら従来技術の課題を解決し、半導体チップの実装工
程の高効率化、および、実装装置の高信頼化を可能とす
るプリント配線板を提供することである。The problem to be solved is that, in the prior art, when a semiconductor chip such as a TAB component which needs heat radiation is bonded by using an adhesive such as a die attach agent, the heat radiation effect is reduced. It is a point that maintenance and the management of the supply amount of the adhesive cannot be simplified. The purpose of the present invention is
An object of the present invention is to provide a printed wiring board that solves the problems of the related art and that can increase the efficiency of a semiconductor chip mounting process and increase the reliability of a mounting device.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明のプリント配線板は、ダイアタッチ剤等の接
着部剤を用いて半導体ベアチップ等の電子部品を搭載す
るプリント配線板であって、電子部品（ＴＡＢ部品３）
の接着部剤（ダイアタッチ剤２）で接着される部分（半
導体チップ部３ａ）の範囲内にスリット７を設け、余分
に塗布されたダイアタッチ剤２をスリット７に流し込む
と共に、スリット７を介して挿入された放熱用部材（金
属片５）をＴＡＢ部品３の半導体チップ部３ａに当接さ
せる構成としたことを特徴とする。In order to achieve the above object, a printed wiring board of the present invention is a printed wiring board on which electronic components such as semiconductor bare chips are mounted using an adhesive such as a die attach agent. , Electronic parts (TAB parts 3)
A slit 7 is provided in the area of the portion (semiconductor chip portion 3a) to be bonded with the bonding agent (die attach agent 2), and the excess die attach agent 2 is poured into the slit 7 and passed through the slit 7. The heat-dissipating member (metal piece 5) inserted into contact with the semiconductor chip portion 3 a of the TAB component 3 is characterized in that the heat-dissipating member (metal piece 5) is brought into contact with the semiconductor chip portion 3 a of the TAB component 3.
【０００７】[0007]
【発明の実施の形態】放熱が必要な半導体チップ部を下
部に有するＴＡＢ部品の実装を例に、本発明のプリント
配線板の実施の形態を説明する。本実施例では、ＴＡＢ
部品の放熱を要する半導体チップ部とプリント配線板と
をダイアタッチ剤で接合する場合に、スルーホールから
のダイアタッチ剤流出やボイド等の発生を抑制し、ＴＡ
Ｂ部品に対するダイアタッチ剤の安定塗布と放熱構造を
図るために、プリント配線板の、ＴＡＢ部品の半導体チ
ップ部の実装位置より一回り小さい位置にスリットを設
ける。このことにより、ＴＡＢ部品を接合した場合に余
分となるダイアタッチ剤をスリット内に流し込むことが
でき、ＴＡＢ部品とプリント配線板間のダイアタッチ剤
の量を安定させることができると共に、余分なダイアタ
ッチ剤がＴＡＢ部品のインナーリードやはんだ付け部に
短絡することを防止できる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a printed wiring board according to the present invention will be described by taking as an example the mounting of a TAB component having a semiconductor chip portion requiring heat radiation at the bottom. In this embodiment, TAB
When joining a semiconductor chip portion requiring heat radiation of a component and a printed wiring board with a die attach agent, the die attach agent is prevented from flowing out of through holes and the occurrence of voids and the like is suppressed.
In order to stably apply the die attach agent to the B component and achieve a heat dissipation structure, a slit is provided on the printed wiring board at a position slightly smaller than the mounting position of the semiconductor chip portion of the TAB component. As a result, an excess die attach agent when the TAB component is joined can be poured into the slit, the amount of the die attach agent between the TAB component and the printed wiring board can be stabilized, and an extra die attach agent can be obtained. It is possible to prevent the touch agent from being short-circuited to the inner lead or the soldered portion of the TAB component.
【０００８】また、このスリットを介して、ＴＡＢ部品
を実装するプリント配線板の反対面から、放熱用の金属
片を通し、直接、半導体チップ部に接合することによ
り、放熱効果を向上させることができる。以下、本発明
の実施例を、図面により詳細に説明する。図１は、本発
明のプリント配線板の本発明に係る構成の一実施例を示
すブロック図である。In addition, the heat radiation effect can be improved by passing a metal piece for heat radiation through the slit from the opposite surface of the printed wiring board on which the TAB component is mounted and directly joining the semiconductor chip portion. it can. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the configuration of the printed wiring board of the present invention according to the present invention.
【０００９】本図１において、１はＴＡＢリード、２は
ダイアタッチ剤、３はＴＡＢ部品、３ａは放熱を必要と
する半導体チップ部、４は本発明のプリント配線板、５
は放熱部材、６はサーマルビア、７は本発明に係るスリ
ット、８はポリイミドフィルム、９はインナーリードで
ある。本発明のプリント配線板４においては、ＴＡＢ部
品の実装面から裏面まで貫通したスリット７を設けてい
る。そして、このスリット７の位置は、ＴＡＢ部品３の
放熱を必要とする半導体チップ部３ａのサイズより一回
り小さいサイズとする。さらに、スリット７は、ＴＡＢ
部品の実装面と裏面とで導通が得られるように、導電性
のめっきがなされている。In FIG. 1, 1 is a TAB lead, 2 is a die attach agent, 3 is a TAB component, 3a is a semiconductor chip portion requiring heat radiation, 4 is a printed wiring board of the present invention,
Denotes a heat radiating member, 6 denotes a thermal via, 7 denotes a slit according to the present invention, 8 denotes a polyimide film, and 9 denotes an inner lead. In the printed wiring board 4 of the present invention, a slit 7 penetrating from the mounting surface of the TAB component to the back surface is provided. The position of the slit 7 is set to a size slightly smaller than the size of the semiconductor chip portion 3a that needs to dissipate the heat of the TAB component 3. Furthermore, the slit 7 is TAB
Conductive plating is performed so that electrical continuity can be obtained between the component mounting surface and the back surface.
【００１０】また、図１（ｂ）において示すように、Ｔ
ＡＢ部品３の半導体チップ部３ａに対して、その裏面か
ら、放熱用の金属片５を、スリット７を介して直接接触
させる。このことにより、プリント配線板４と金属片５
の両方から放熱することができる。またこの時、放熱用
の金属片５を接着固定するのに、スリット内にある余分
のダイアタッチ剤にて接合することもできる。次に、こ
のようなプリント配線板４へのＴＡＢ部品３の実装工程
を、図２を用いて説明する。Further, as shown in FIG.
The metal piece 5 for heat radiation is brought into direct contact with the semiconductor chip portion 3a of the AB component 3 from the back surface through the slit 7. As a result, the printed wiring board 4 and the metal pieces 5
Heat can be radiated from both. At this time, in order to adhere and fix the metal piece 5 for heat radiation, it is also possible to join with an extra die attach agent in the slit. Next, a process of mounting the TAB component 3 on the printed wiring board 4 will be described with reference to FIG.
【００１１】図２は、図１におけるプリント配線板に対
するＴＡＢ部品の一般的な実装プロセスを示す説明図で
ある。本図２（ａ）〜図２（ｃ）の順で、本発明のプリ
ント配線板４に対して、ＴＡＢ部品３が実装される。す
なわち、まず図２（ａ）に示すように、プリント配線板
４にダイアタッチ剤２を塗布する。この時、ダイアタッ
チ剤２は、本発明のスリット７の内側の範囲に塗布す
る。その後、プリント配線板４にはんだ付け用のフラッ
クスを塗布し、切断・成形されたＴＡＢ部品３をプリン
ト配線板４に加熱接続する。FIG. 2 is an explanatory view showing a general mounting process of a TAB component on the printed wiring board in FIG. 2A to 2C, the TAB component 3 is mounted on the printed wiring board 4 according to the present invention. That is, first, as shown in FIG. 2A, the die attach agent 2 is applied to the printed wiring board 4. At this time, the die attach agent 2 is applied to the area inside the slit 7 of the present invention. Thereafter, a flux for soldering is applied to the printed wiring board 4, and the cut and formed TAB component 3 is heated and connected to the printed wiring board 4.
【００１２】ＴＡＢ部品３の半導体チップ部３ａとプリ
ント配線板４との間には、わずかな隙間ができるよう設
計されており、ダイアタッチ剤２は、ＴＡＢ部品３の半
導体チップ部３ａに押され、プリント配線板４との隙間
に充填される。この時、余分となるダイアタッチ剤２
は、スリット７部よりプリント配線板４の裏側に流れ出
る。このことにより、インナーリード９やＴＡＢリード
１などのＴＡＢ部品３のはんだ付け部に接触することな
くＴＡＢ部品３を接続することができる。The TAB component 3 is designed so that there is a slight gap between the semiconductor chip portion 3a of the TAB component 3 and the printed wiring board 4, and the die attach agent 2 is pressed by the semiconductor chip portion 3a of the TAB component 3. Is filled in the gap with the printed wiring board 4. At this time, extra die attach agent 2
Flows out of the slit 7 to the back side of the printed wiring board 4. Thus, the TAB component 3 can be connected without contacting the soldered portions of the TAB component 3 such as the inner lead 9 and the TAB lead 1.
【００１３】以上、図１、および、図２を用いて説明し
たように、本実施例のプリント配線板４では、スリット
７を設けることにより、ダイアタッチ剤２を余分に塗布
してＴＡＢ部品３を実装した場合でも、余分なダイアタ
ッチ剤２が、ＴＡＢ部品３のはんだ付け部（ＴＡＢリー
ド１）やインナーリード９に短絡することを回避でき
る。また、ＴＡＢ部品３の放熱を要する半導体チップ部
品３ａに直接、スリット７を介して放熱用の金属片５を
取り付けることができ、放熱特性を向上させることがで
きる。As described above with reference to FIGS. 1 and 2, in the printed wiring board 4 of this embodiment, the slit 7 is provided so that the die attach Can be prevented from being short-circuited to the soldered portion (TAB lead 1) of the TAB component 3 or the inner lead 9 by the extra die attach agent 2. Further, the heat dissipating metal piece 5 can be directly attached to the semiconductor chip component 3a requiring heat dissipation of the TAB component 3 through the slit 7, and the heat dissipation characteristics can be improved.
【００１４】尚、本発明は、図１および図２を用いて説
明した実施例に限定されるものではなく、その要旨を逸
脱しない範囲において種々変更可能である。例えば、本
実施例では、一つのＴＡＢ部品３のためのスリット７を
設ける構成で説明したが、それぞれサイズの異なる複数
のＴＡＢ部品のために、サイズの異なるスリットを余分
に設けることもできる。The present invention is not limited to the embodiment described with reference to FIGS. 1 and 2, but can be variously modified without departing from the gist thereof. For example, in the present embodiment, the configuration in which the slit 7 is provided for one TAB component 3 has been described, but an extra slit having a different size can be additionally provided for a plurality of TAB components having different sizes.
【００１５】[0015]
【発明の効果】本発明によれば、放熱が必要なＴＡＢ部
品等の半導体チップをダイアタッチ剤等の接着剤を用い
て接合する場合にも、放熱効果の維持と、接着剤の供給
量の管理の簡便化を図ることができ、半導体チップの実
装工程の高効率化、および、実装装置の高信頼化が可能
である。According to the present invention, even when a semiconductor chip such as a TAB component which requires heat radiation is bonded using an adhesive such as a die attach agent, the heat radiation effect can be maintained and the amount of adhesive supplied can be reduced. The management can be simplified, the efficiency of the semiconductor chip mounting process can be increased, and the reliability of the mounting device can be increased.
【図１】本発明のプリント配線板の本発明に係る構成の
一実施例を示すブロック図である。FIG. 1 is a block diagram showing one embodiment of a configuration according to the present invention of a printed wiring board of the present invention.
【図２】図１におけるプリント配線板に対するＴＡＢ部
品の一般的な実装プロセスを示す説明図である。FIG. 2 is an explanatory view showing a general mounting process of a TAB component on the printed wiring board in FIG. 1;
１：ＴＡＢリード、２：ダイアタッチ剤、３：ＴＡＢ部
品、３ａ：半導体チップ部、４：プリント配線板、５：
放熱用金属片、６：サーマルビア、７：スリット、８：
ポリイミドフィルム、９：インナーリード。1: TAB lead, 2: die attach agent, 3: TAB component, 3a: semiconductor chip part, 4: printed wiring board, 5:
Heat dissipation metal piece, 6: thermal via, 7: slit, 8:
Polyimide film, 9: inner lead.
Claims (1)
リント配線板であって、上記電子部品の上記接着部剤で
接着される部分の範囲内にスリットを設け、余分に塗布
された上記接着部材を上記スリットに流し込むと共に、
上記スリットを介して挿入された放熱用部材を上記電子
部品の上記接着部剤で接着される部分に当接させる構成
としたことを特徴とするプリント配線板。1. A printed wiring board on which an electronic component is mounted using an adhesive, wherein a slit is provided in a range of a portion of the electronic component which is bonded by the adhesive, and the electronic component is excessively applied. While pouring the adhesive member into the slit,
A printed wiring board, wherein a heat radiation member inserted through the slit is brought into contact with a portion of the electronic component to be bonded with the bonding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26289196A JPH10107400A (en) | 1996-10-03 | 1996-10-03 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26289196A JPH10107400A (en) | 1996-10-03 | 1996-10-03 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10107400A true JPH10107400A (en) | 1998-04-24 |
Family
ID=17382061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26289196A Pending JPH10107400A (en) | 1996-10-03 | 1996-10-03 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10107400A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006318986A (en) * | 2005-05-10 | 2006-11-24 | Sumitomo Electric Printed Circuit Inc | Flexible printed circuit board and its manufacturing method |
| JP2006339588A (en) * | 2005-06-06 | 2006-12-14 | Nitto Denko Corp | Wiring circuit substrate |
| JP2007019078A (en) * | 2005-07-05 | 2007-01-25 | Shindo Denshi Kogyo Kk | Printed circuit board, flexible printed circuit board, and manufacturing method thereof |
-
1996
- 1996-10-03 JP JP26289196A patent/JPH10107400A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006318986A (en) * | 2005-05-10 | 2006-11-24 | Sumitomo Electric Printed Circuit Inc | Flexible printed circuit board and its manufacturing method |
| JP2006339588A (en) * | 2005-06-06 | 2006-12-14 | Nitto Denko Corp | Wiring circuit substrate |
| JP2007019078A (en) * | 2005-07-05 | 2007-01-25 | Shindo Denshi Kogyo Kk | Printed circuit board, flexible printed circuit board, and manufacturing method thereof |
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