JPH01302796A - Through hole structure of circuit board and method for leaving through hole in soldering process - Google Patents
Through hole structure of circuit board and method for leaving through hole in soldering processInfo
- Publication number
- JPH01302796A JPH01302796A JP1535888A JP1535888A JPH01302796A JP H01302796 A JPH01302796 A JP H01302796A JP 1535888 A JP1535888 A JP 1535888A JP 1535888 A JP1535888 A JP 1535888A JP H01302796 A JPH01302796 A JP H01302796A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit board
- solder
- plating
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 8
- 238000005476 soldering Methods 0.000 title abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 15
- 238000007654 immersion Methods 0.000 claims 1
- 230000009545 invasion Effects 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は９回路基板のスルーホールの構造。[Detailed description of the invention] [Industrial application field] This invention has a through-hole structure on 9 circuit boards.
及び゛ｈ田付は作業時におけるスルーホールの残置方法
に関する。and ゛h tag relate to the method of leaving through holes during work.
［従来の技術］
回路１５板には、それがとくに両面回路基板の場合１回
路部品を実装するためのスルーホールが設けられている
。[Prior Art] The circuit board 15 is provided with through holes for mounting one circuit component, especially if it is a double-sided circuit board.
従来、このスルーホールの構造は第１図に示したように
１回路基板！に設けたスルーホール２に１回路基板の上
面、と下面に広がるスルーホールメッキ３が施されてお
り、このスルーホール２を介して回路部品４のリード線
５が挿通され。Conventionally, the structure of this through hole was one circuit board as shown in Figure 1! A through hole 2 provided in the circuit board is plated with through hole plating 3 extending over the upper and lower surfaces of the circuit board, and the lead wire 5 of the circuit component 4 is inserted through the through hole 2.
１ｍ付けされるものである。この場合回路部品が多（、
実装密度が高い場合には、一つ一つ手作業で゛＋ａ田付
けしていたのでは煩雑であり、加工代も高くなることか
ら、第２図に示したように、半田バスや自動半田付は装
置のソルダー６に回路基板１を浸して、−挙に半田付け
をしてしまうことが行われている。It is attached at a length of 1m. In this case, there are many circuit components (,
When the mounting density is high, soldering each piece manually is complicated and increases processing costs, so solder buses and automatic soldering are used as shown in Figure 2. For attachment, the circuit board 1 is immersed in the solder 6 of the device and soldered all at once.
しかるに、端子や熱に弱いトンネルダイオードのような
部品は後付けとなるため、かかる部品を取り付けるため
に設けられた上述したような構造のスルーホール２は、
Ｌ述したような半田付は作業時においては、部品を取り
付けられることなくそのままの状態で残されているので
、これをそのまま゛ｔａ■バスやソルダー６内に浸すと
、第３図に示したように半田７がスルーホールメッキと
ｌａ １１間の親和力、即ち濡れ現象によりスルーホー
ル２内に侵入してこれを塞いでしまう。However, since components such as terminals and heat-sensitive tunnel diodes are installed later, the through-hole 2 with the above-mentioned structure is provided for attaching such components.
During work, soldering as described above is left as it is without parts being attached, so if it is immersed in a bath or solder 6 as shown in Figure 3. As shown, the solder 7 enters into the through hole 2 and blocks it due to the affinity between the through hole plating and the la 11, that is, the wetting phenomenon.
そのため従来は、ｒりびこの塞がれたスルーホールに穴
をあけるか、或いはＹ・しめマスキング用治具やマスキ
ングテープを残置すべきスルーホールを塞ぎ、上述した
ようなＩＡＩＩＩ付は作業の後でこのマスキングテープ
等を取り外すというｐ間を要しており、煩雑てあり丁間
がかかるという問題があった。Therefore, in the past, holes were drilled into the blocked through holes of the r rib, or the through holes where the Y/shime masking jig and masking tape were to be left were blocked, and the above-mentioned IAIII attachment was done after the work. The problem is that it takes time to remove the masking tape and the like, which is complicated and time consuming.
このＮＩＩＩの目的は、、１［ｌバスやソルダーを用い
ての半田付は作業時に、残置させるスルーホールをマス
キング用治具やマスキングテープ簀を用いて予め保護し
なくとも、半Ｉｌｌで埋められることなく、そのまま残
すことのできるスルーホールの構造、及び上述した！ト
田付は作業時におけるその残１ｉ！２方法を提供せんと
するにある。The purpose of this NIII is: 1. When soldering using l bus or solder, the through holes left behind can be semi-filled with Ill without having to protect them in advance using a masking jig or masking tape. Through-hole structure that can be left intact without any problems, and as mentioned above! Todasuke is the remainder of the work! I would like to offer two methods.
［３厘を解決するだめの手段］
ヒ運した目的を達成するためにこの発明は１回路基板に
スルーホールを設け、このスルーホールが開口する前記
回路基板の少なくとも一方の側に前記スルーホールに達
するスルーホールメッキを省略させたものである、
この発明はまた１回路基板へ回路部品を実装するにあた
り、スルーホールのメツキを省略した側を下にして゛ｉ
田ババスソルダー内へ浸すことによって、′ト田付は時
に後付は用のスルーホールをそのまま残置させるもので
ある。[Means for Solving Problems 3] In order to achieve the desired object, the present invention provides a through hole in one circuit board, and a through hole in at least one side of the circuit board where the through hole opens. This invention also eliminates the plating of through-holes when mounting circuit components on one circuit board, with the side on which through-hole plating is omitted facing down.
By immersing it in a tababus solder, it sometimes leaves the through hole intact for later installation.
［作用］
スルーホールの一方の開口部がある回路基板の少なくと
も一方の面には、該スルーホールに達するスルーホール
メッキを施していないので、このメツキを施していない
側を下にして゛ｉ田ババスソルダー内へ浸すと１表面張
力によってｈ田が該スルーホール内に侵入することを阻
止できるので。[Function] At least one surface of the circuit board on which one of the openings of the through-holes is located is not plated with through-holes that reach the through-holes. When immersed in the through-hole, surface tension can prevent the metal from entering the through-hole.
これを塞いでしまうことがない。It never gets blocked.
［実施例］
以下にこの発明の実施例を図面に基づいて詳細に説明す
ると、第４図において１回路基板１１に設けたところの
１回路部品Ｉ４を自動半田付は装置で半田付けさせるス
ルーホール１５の構造は、従来のものと同じであるが、
該回路基板１１に設けたところの、自動’ｔａ １１１
付は時にはそのまま残すスルーホール１２には、該回路
基板１１の下面側を残して、その内側と上面側にのみス
ルーホールメッキ１３が施されている。尚、このスルー
ホールメッキは１通゛帛は銅やアルミニウム等の金属箔
でＦＭ成されるのが一般である。[Embodiment] An embodiment of the present invention will be described below in detail based on the drawings. In FIG. 4, one circuit component I4 provided on one circuit board 11 is automatically soldered using a through hole that is soldered by an apparatus. The structure of No. 15 is the same as the conventional one, but
The automatic 'ta 111 provided on the circuit board 11
Through-hole plating 13 is applied only to the inside and top surface of the circuit board 11, leaving the bottom surface of the circuit board 11 intact. Incidentally, this through-hole plating is generally performed by FM using metal foil such as copper or aluminum.
第５図は第４図に示したスルーホール１２をそのまま残
して回路基板１１にｈ１［１パス、！Ｊ１２いはフロー
ソルダリングマシン（自動半田付装置ｆｆ）を用いて回
路部品の半田付け（実装）を行う場合を示し１図面によ
れば回路基板１１は、各種回路部品１７を取り付けた後
、スルーホール１２にメツキを施してない下面側をｌ′
、［ＴＩｌバス或いはソルダー１６に浸して回路部品１
４のＦ−Ｅｌｌ付けを行うものである。In FIG. 5, h1 [1 pass, ! J12 or flow soldering machine (automatic soldering device ff) is used to solder (mount) circuit components. The bottom side where hole 12 is not plated is l'
, [Circuit component 1 immersed in TIl bath or solder 16]
4 F-Ell attachment is performed.
尚、この゛ｉ半田付工程において、残１２２されたスル
ーホール１２へは、後になって端子やその他の回路部品
が取り付けられ、手作業で半田付けがなされるものであ
る。In this "i" soldering process, terminals and other circuit components will later be attached to the remaining 122 through holes 12 and soldered manually.
第７図はスルーホールの他の実施例を示し、回路基板２
１に設けたところの、自動半田付は時に半田１付けされ
ることなく残置されるスルーホール２２は、譲回路基板
２１の上面と接触する部分のみがスルーホールメッキ２
３を施してあり、該スルーホール２２の内側と回路基板
２１の下面と接触する部分にはメツキが施されていない
。FIG. 7 shows another embodiment of the through hole, and the circuit board 2
The through-holes 22, which are provided in 1, are sometimes left without being soldered during automatic soldering, and only the portion that contacts the top surface of the circuit board 21 is plated with the through-holes 2.
3, and the portion that contacts the inside of the through hole 22 and the lower surface of the circuit board 21 is not plated.
尚１図示はしないが、スルーホールメッキは回路基板の
いづれかの側のほか、スルーホールの内側の一部に設け
ても良い。Although not shown, through-hole plating may be provided not only on either side of the circuit board but also on a part of the inside of the through-hole.
［効果］
Ｌ述したように構成したスルーホール１２は、スルーホ
ールメッキを施してない面を下側にして゛１５田バスや
ソルダー内に浸すと、半田は表面張力でスルーホールメ
ッキを登って来てこれを埋めてしまうことなく、第６図
に示したように残１ａされる。[Effect] When the through-hole 12 configured as described above is immersed in a bath or solder with the surface without through-hole plating facing downward, the solder will climb up the through-hole plating due to surface tension. Without filling it up, the remaining 1a is left as shown in FIG.
そしてこのことは、第７図に示したスルーホール２２の
場合にも同じことがこえる。したがって、従来のものの
ように、自動”ｌ’−ＩＴＪ付は時に残１２？ずべきス
ルーホールに、マスキングｒａ！’１やマスキングテー
プを取り付けて自動ｔ ｍ １１けの後でこれを取り外
すか、或いは半田付は工程の後で穴あけをするといった
工程を省略でき、大幅なコストダウンを図ることができ
るものである。The same thing applies to the through hole 22 shown in FIG. Therefore, like the conventional type, when automatic "l'-ITJ is attached, it is sometimes necessary to attach masking ra!'1 or masking tape to the remaining through hole and remove it after automatic tm11. Alternatively, soldering can omit the process of drilling holes after the process, which can significantly reduce costs.
第１図は回路基板における従来のスルーホールの構造を
示す断面図、第２図は従来のスルーホールをそのままの
状態で半田バスやフローソルダマシンのソルダー内に池
の回路部品なＶ、田付けするため浸した場合を説明する
ための説明図、第二３図は従来のスルーホールを設けた
ものにそのまま−１−述した゛ト田付は作業を行った場
合を説明するための説明図、第４図はこの発明に係るス
ルーホールの構造を示す断面図、第５図と第６図はこの
発明に係るスルーホールを設けた回路基板を半田バスや
ソルダー内に他の回路部品な゛詐田付けするために浸し
た場合を説明するための説明図、第７図はスルーホール
の曲の実施例を示す断面図である。
１、１＋、 ２１・・・回路基板
２、１２．２２・・・スルーホール
コ３、Ｉ３．２３・・・メツキ
４．１４・・・回路部品 ６．１６・・・ソルダ実用新
案登録出願人 株式会社ミニパイロ電機ブ
ー６７＋
Ｎ
■Figure 1 is a cross-sectional view showing the structure of a conventional through-hole in a circuit board, and Figure 2 is a cross-sectional view showing the structure of a conventional through-hole in a circuit board. Figure 2-3 is an explanatory diagram to explain the case where the conventional through-hole is provided and the above-mentioned ``totatsuki'' is applied as it is. FIG. 4 is a sectional view showing the structure of the through hole according to the present invention, and FIGS. 5 and 6 are cross-sectional views showing the structure of the through hole according to the present invention. FIG. 7 is an explanatory diagram for explaining the case where the material is immersed for plating, and FIG. 7 is a cross-sectional view showing an example of a through-hole curve. 1, 1+, 21...Circuit board 2, 12.22...Through hole code 3, I3.23...Metsuki 4.14...Circuit parts 6.16...Solder utility model registration applicant Minipyro Electric Co., Ltd. 67+ N ■
Claims (2)
が開口する前記回路基板の少なくとも一方の側に前記ス
ルーホールに達するスルーホールメッキを省略させたこ
とを特徴とする、スルーホールの構造。1. A through-hole structure, characterized in that a through-hole is provided in a circuit board, and through-hole plating reaching the through-hole is omitted on at least one side of the circuit board where the through-hole opens.
の範囲第１項に記載したスルーホ ールの、スルーホールメッキを省略した側を下にして、
半田バスやソルダー内へ浸すことを特徴とする、スルー
ホールの残置方法。2. When mounting circuit components on a circuit board, the side of the through-hole described in claim 1 on which through-hole plating is omitted is facing down,
A method of leaving through holes, characterized by immersion in a solder bath or solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1535888A JPH01302796A (en) | 1988-01-26 | 1988-01-26 | Through hole structure of circuit board and method for leaving through hole in soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1535888A JPH01302796A (en) | 1988-01-26 | 1988-01-26 | Through hole structure of circuit board and method for leaving through hole in soldering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01302796A true JPH01302796A (en) | 1989-12-06 |
Family
ID=11886578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1535888A Pending JPH01302796A (en) | 1988-01-26 | 1988-01-26 | Through hole structure of circuit board and method for leaving through hole in soldering process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01302796A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100435690B1 (en) * | 2001-11-20 | 2004-06-12 | 현대자동차주식회사 | Method of pilot fuel quatity control at end of line for the vehicle equipped common rail diesel engine |
| JP2015012159A (en) * | 2013-06-28 | 2015-01-19 | 株式会社デンソー | Electronic device and manufacturing method therefor |
-
1988
- 1988-01-26 JP JP1535888A patent/JPH01302796A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100435690B1 (en) * | 2001-11-20 | 2004-06-12 | 현대자동차주식회사 | Method of pilot fuel quatity control at end of line for the vehicle equipped common rail diesel engine |
| JP2015012159A (en) * | 2013-06-28 | 2015-01-19 | 株式会社デンソー | Electronic device and manufacturing method therefor |
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