JPS63124498A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS63124498A JPS63124498A JP27068186A JP27068186A JPS63124498A JP S63124498 A JPS63124498 A JP S63124498A JP 27068186 A JP27068186 A JP 27068186A JP 27068186 A JP27068186 A JP 27068186A JP S63124498 A JPS63124498 A JP S63124498A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal plate
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 27
- 239000002184 metal Substances 0.000 description 27
- 239000012212 insulator Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、実装した電子部品から発生する熱を放熱す
る放熱機能を有する印刷配線基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board having a heat dissipation function for dissipating heat generated from mounted electronic components.
第２図は、例えば特開昭５３−３５１６３号公報および
研究実用化報告（１９６９年）にて示された従来の印刷
配線基板の構造を示す図である。FIG. 2 is a diagram showing the structure of a conventional printed wiring board disclosed in, for example, Japanese Unexamined Patent Publication No. 53-35163 and the Research and Practical Application Report (1969).
図において、（１）は発熱する電子部品、（２）は熱を
伝導する金属板、（３）は金属板を絶縁する絶縁物、（
４）はスルーホールメッキ穴、（５）ははんだ行部分で
ある０
また、第３図は、ＡＤＨＥ８工ＶＩＳ ＡＧＫ １９６
Ｂにて示された従来の印刷配線基板の構造を示す図であ
る。In the figure, (1) is an electronic component that generates heat, (2) is a metal plate that conducts heat, (3) is an insulator that insulates the metal plate, (
4) is a through-hole plating hole, and (5) is a solder line part.
FIG. 3 is a diagram showing the structure of the conventional printed wiring board shown in FIG.
図において、（１） ｊ （２） 、 （４） 、 （
５）Ｆｉ！ ２図のものに相当するものであシ、（力は
プリント基板、（８）は金属板（２）とプリント基板（
７）とを接着する接着剤である０
このような構成において、電子部品（１）はＩＣやトラ
ンジスタや抵抗であシ、これらは通常プリント基板には
んだ付けされる。そして、この電子部品において発生す
る熱を放熱するため、第２図の場合はアルミや銅などの
熱伝導率の良好な金属板（２）を内芯となし、その全面
を樹脂等の絶縁物（３）により被覆している。プリント
基板として用いるため、スルーホールメッキ穴（４）ヲ
施し、このスルーホールメッキ穴（４）に電子部品（１
）のリードを挿入してはんだ（５）によシ固定、電気的
に接続、固定している。In the figure, (1) j (2) , (4) , (
5) Fi! It corresponds to the one in Figure 2 (the force is the printed circuit board, (8) is the metal plate (2) and the printed circuit board (
7) is an adhesive for bonding 0. In such a configuration, the electronic component (1) is an IC, a transistor, or a resistor, and these are usually soldered to a printed circuit board. In order to dissipate the heat generated in this electronic component, in the case of Figure 2, a metal plate (2) with good thermal conductivity such as aluminum or copper is used as the inner core, and the entire surface is covered with an insulating material such as resin. (3). In order to use it as a printed circuit board, a through-hole plated hole (4) is provided, and an electronic component (1) is inserted into this through-hole plated hole (4).
) is inserted and fixed with solder (5), electrically connected and fixed.
また、第３図の場合は、第２図の場合と同様に放熱のた
め、金属板（２）ヲプリント基板（７）上に配設し、金
属板（２）はプリント基板（７）との界面が絶縁される
ように、接着剤（８）によ多接合される。In addition, in the case of Fig. 3, the metal plate (2) is placed on the printed circuit board (7) for heat dissipation as in the case of Fig. 2, and the metal plate (2) is placed on the printed circuit board (7). It is bonded with adhesive (8) so that the interface is insulated.
従来の印刷配線板は以上のように構成されておＥ’ Ｓ
第”図の場合は、金属板（２）とその表面に皮膜形成さ
れた絶縁物（３）によりプリント基板を形成しているの
で、スルーホールメッキ部（４）の信頼性を通常のプリ
ント基板と同等に確保するのが困難であシ、金属（２）
と絶縁物（３）との線膨張係数の差により、はんだ付は
時にクラックや界面剥離が発生したシ、スルーホールメ
ッキ部（４）のエツジ部の絶縁不良が発生するなどの問
題があった。Conventional printed wiring boards are constructed as described above.
In the case of Figure 1, the printed circuit board is made up of a metal plate (2) and an insulator (3) with a film formed on its surface. Metals (2) that are difficult to secure at the same level as
Due to the difference in coefficient of linear expansion between the insulator (3) and the insulator (3), problems such as cracks and interfacial peeling sometimes occurred during soldering, as well as poor insulation at the edges of the through-hole plated part (4). .
また、第３図の場合は、金属板（２）の形状において、
部品のリード部を逃げる必要があるため、金属板（２）
の熱伝導経路が狭くなり、ＬＳＩのパッケージ形状であ
るＰＧＡ（Ｐ工Ｎ ＧＲより ＡＲＲＡＹ）等を搭載す
る場合には、熱伝導経路がなくなシ、所要の放熱性能を
満足でき々いなどの問題点があった。In addition, in the case of Fig. 3, in the shape of the metal plate (2),
Metal plate (2) as it is necessary to escape the lead part of the component.
The heat conduction path becomes narrower, and when mounting an LSI package shape such as PGA (ARRAY from PNG), there is no heat conduction path and the required heat dissipation performance cannot be satisfied. There was a problem.
この発明は上記のような問題点を解消するためにたされ
たもので、スルーホールメッキ部の信頼性を確保できる
とともに、ＬＳＩパッケージ等を搭載しても熱伝導が充
分で、所要の放熱性能を有する印刷配線基板を得ること
を目的とする。This invention was made to solve the above-mentioned problems, and not only can the reliability of the through-hole plating part be ensured, but even when an LSI package, etc. is mounted, heat conduction is sufficient, and the required heat dissipation performance can be achieved. The object of the present invention is to obtain a printed wiring board having the following properties.
この発明に係る印刷配線基板は、プリント基板の部品リ
ード挿入穴に対応する位置に貫通穴が設けられ、その穴
壁を含む表面が樹脂にて絶縁皮膜形成された放熱板をプ
リント基板上に接合配設したものである。In the printed wiring board according to the present invention, a through hole is provided at a position corresponding to the component lead insertion hole of the printed circuit board, and a heat sink whose surface including the hole wall is coated with an insulating film of resin is bonded onto the printed circuit board. This is what was installed.
この発明における放熱板は、穴部や表面部が樹脂皮膜等
により絶縁被覆されておシ、この放熱板を従来より用い
ているプリント基板上に接合配設したことにより、スル
ーホールメッキ部の信頼性は確保され、電子部品の熱は
放熱板を伝導して効果的に放熱される。In the heat sink of this invention, the holes and surface portions are insulated with a resin film, etc., and the heat sink is bonded and arranged on a conventional printed circuit board, making the through-hole plating part reliable. The heat of the electronic components is conducted through the heat sink and radiated effectively.
以下、この発明の一実施例を図について説明する０
第１図において、（１）は発熱する電子部品、（ｌａ）
は電子部品のリード、（２）は熱を伝導する金属板、（
４）はスルーホールメッキ部、（５）ははんだ行部分、
（６）は金属板（２）全絶縁する絶縁皮膜、（７）はプ
リント基板、（８ンは金属板（２）とプリント基板（７
）とを接合するための接着剤、（９）は必要によフ充て
んする熱伝導性絶縁物、σＱは金属板（２）およびその
表面に形成された絶縁皮膜（６）からなる放熱板である
。Hereinafter, one embodiment of the present invention will be explained with reference to the drawings. In Fig. 1, (1) is an electronic component that generates heat, (la)
is a lead for an electronic component, (2) is a metal plate that conducts heat, (
4) is the through-hole plating part, (5) is the solder line part,
(6) is a metal plate (2) with a fully insulated insulating film, (7) is a printed circuit board, (8) is a metal plate (2) and a printed circuit board (7).
), (9) is a thermally conductive insulator to be filled if necessary, and σQ is a heat sink consisting of a metal plate (2) and an insulating film (6) formed on its surface. be.
まず、熱伝導率の良好な材料を所要放熱性能からその物
質と厚みを定めた金属板（２）Ｋ電子部品（１）のリー
ド（１ａ）を貫通する際、所要の間隙が得られるように
、金属板（２）に穴明けし、電着塗装又は粉体塗装によ
りエポキシ系の樹脂等で金属板（２）全被覆し、絶縁膜
（６） ｔｌ−形成する。なお、この絶縁厚さは１００
μｍ〜３００μｍの範囲が望ましい。First, a metal plate (2) whose material and thickness are determined based on the required heat dissipation performance is made of a material with good thermal conductivity, so that the required gap is obtained when passing through the lead (1a) of the electronic component (1). A hole is made in the metal plate (2), and the metal plate (2) is completely covered with an epoxy resin or the like by electrodeposition coating or powder coating, and an insulating film (6) is formed. Note that this insulation thickness is 100
A range of μm to 300 μm is desirable.
次に、この絶縁処理した金属板（２）とプリント基板（
７）とを接着剤（８）にて接合した後、電子部品（１）
のリード（１ａ）を金属板（２）とプリント基板（７）
を貫通させ、スルーホール部（４）にはんだ付けする。Next, this insulated metal plate (2) and the printed circuit board (
After joining 7) with adhesive (8), electronic parts (1)
Connect the lead (1a) to the metal plate (2) and printed circuit board (7).
through the hole and solder it to the through-hole part (4).
なお、この場合、はんだ付けの際の熱によるストレスは
金属板（２）やプリント基板（７）において、クラック
を生じる程には発生しない。In this case, stress due to heat during soldering does not occur to the extent that cracks occur in the metal plate (2) or the printed circuit board (7).
このように、金属板（２）への穴明けにおいて、電子部
品（１）のリード（ｌａ）と金属板（２）の間に絶縁膜
（６）を設けたので、金属板（２）の穴径を小さくでき
、隣接リード間に熱伝導のための金属部分ｔｌ−残すこ
とが可能になＪ、ＬＳＩパッケージ等の放熱を充分でき
るようになった。In this way, when drilling holes in the metal plate (2), since the insulating film (6) was provided between the lead (la) of the electronic component (1) and the metal plate (2), the metal plate (2) The diameter of the hole can be made smaller, and it is now possible to leave a metal part for heat conduction between adjacent leads, allowing for sufficient heat dissipation in J, LSI packages, etc.
放熱をさらに良好にするために、電子部品のす−ド（１
ａ）と金属板（２）との間に熱伝導性の絶縁物（９）を
充てんすることも可能である。To further improve heat dissipation, the electronic components are
It is also possible to fill the space between a) and the metal plate (2) with a thermally conductive insulator (9).
また、上記実施例では、従来から広く用いられているプ
リント基板（７）にて説明したが、全く新しいプロセス
による、新しい基材による基板であっても、金属板（２
）との接合が所要の機械的性能を満足できるならば、上
記実施例と同様の効果を奏する０
〔発明の効果〕
以上のように、この発明によれば、その穴壁を含む表面
を絶縁皮膜形成した放熱板と、プリント基板とを接合す
るように構成したので、各々別の工程にて並列に製作す
ることができると共にその製作期間の短縮化ができ、ま
た、最近のＬＳＩ化されたパッケージの部品を放熱性を
損うことなく実装できるので、大がかシなＬＳＩの放熱
手段が不要となり、装置の小型、軽量、高信頼性化が可
能となる効果がある。Furthermore, in the above embodiment, the printed circuit board (7) which has been widely used in the past has been explained, but even if the board is made of a new base material using a completely new process, it is also possible to use a metal plate (2).
) can satisfy the required mechanical performance, the same effect as the above embodiment can be achieved. [Effects of the Invention] As described above, according to the present invention, the surface including the hole wall can be insulated. Since the film-formed heat dissipation plate and the printed circuit board are bonded together, they can be manufactured in parallel in separate processes, and the manufacturing period can be shortened. Since the components of the package can be mounted without impairing the heat dissipation properties, there is no need for large heat dissipation means for the LSI, which has the effect of making it possible to make the device smaller, lighter, and more reliable.
第１図はこの発明の一実施例による印刷配線基板を示す
断面図、第２図および第３図は従来の印刷配線基板を示
す断面図である。
図において、（１）は電子部品、（２）は金属板、（４
）はスルーホールメッキ部、（５）ははんだ打部、（６
）は絶縁皮膜、（７）はプリント基板、（８）は接着剤
である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a sectional view showing a printed wiring board according to an embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing conventional printed wiring boards. In the figure, (1) is an electronic component, (2) is a metal plate, and (4) is an electronic component.
) is the through-hole plating part, (5) is the soldering part, (6
) is an insulating film, (7) is a printed circuit board, and (8) is an adhesive. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (3)
する印刷配線基板において、所要の導体パターンと共に
上記電子部品のリードが実装挿入される挿入穴を有する
プリント基板と、このプリント基板のリード挿入穴に対
応する位置に貫通穴が設けられ、その穴壁を含む表面が
樹脂皮膜にて絶縁形成された放熱板を備え、上記基板と
上記放熱板を接合配設してなる印刷配線基板。(1) A printed circuit board having a heat dissipation function for electronic components mounted on its surface, including a printed circuit board having an insertion hole into which the lead of the electronic component is mounted and inserted together with a required conductor pattern, and the lead of this printed circuit board. A printed wiring board comprising a heat sink having a through hole provided at a position corresponding to the insertion hole and a surface including the hole wall insulated with a resin film, the substrate and the heat sink being bonded together.
とを特徴とする特許請求の範囲第１項記載の印刷配線基
板。(2) The printed wiring board according to claim 1, characterized in that the heat dissipation plate and the printed circuit board are bonded together with an adhesive.
伝導性の絶縁物質を充てんしたことを特徴とする特許請
求の範囲第１項または第２項記載の印刷配線基板。(3) The printed wiring board according to claim 1 or 2, wherein the through holes of the heat sink are filled with a thermally conductive insulating material after the electronic component leads are inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27068186A JPS63124498A (en) | 1986-11-12 | 1986-11-12 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27068186A JPS63124498A (en) | 1986-11-12 | 1986-11-12 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124498A true JPS63124498A (en) | 1988-05-27 |
Family
ID=17489463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27068186A Pending JPS63124498A (en) | 1986-11-12 | 1986-11-12 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124498A (en) |
-
1986
- 1986-11-12 JP JP27068186A patent/JPS63124498A/en active Pending
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