JPS6146998B2 - - Google Patents
Info
- Publication number
- JPS6146998B2 JPS6146998B2 JP53066669A JP6666978A JPS6146998B2 JP S6146998 B2 JPS6146998 B2 JP S6146998B2 JP 53066669 A JP53066669 A JP 53066669A JP 6666978 A JP6666978 A JP 6666978A JP S6146998 B2 JPS6146998 B2 JP S6146998B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- circuit board
- lead
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 11
- 238000005476 soldering Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は複数個のフラツトリードを有する実装
部品をプリント基板に実装する場合の位置決め方
法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in the positioning method when mounting components having a plurality of flat leads on a printed circuit board.
従来よりプリント基板に実装部品を搭載するに
は、第１図に示すようにプリント基板１に設けら
れたパツド２を貫通する孔３又はスルーホール４
にリード５を挿入して半田付けする場合と、第２
図に示すようにプリント基板１に設けられたパツ
ド２にリード５を載せて半田付けする方法とが用
いられている。前者の方法においては、リードを
孔に挿入することにより位置決定は確実になされ
るが部品の取外し交換は非常に困難である。これ
に比し後者の場合は、部品の取外し交換は容易で
あるが取付が平面と平面の接合であるため位置決
めが困難であり、位置ずれを生じた場合には接合
面積が減少して接合の信頼性を低下する。本発明
はこの欠点を改良するために案出されたものであ
る。 Conventionally, in order to mount components on a printed circuit board, as shown in FIG.
When inserting and soldering lead 5 into the second
As shown in the figure, a method is used in which leads 5 are placed on pads 2 provided on a printed circuit board 1 and soldered. In the former method, the position can be determined reliably by inserting the lead into the hole, but it is very difficult to remove and replace the parts. In contrast, in the latter case, it is easy to remove and replace the parts, but since the installation is done by joining two planes, positioning is difficult, and if misalignment occurs, the joining area decreases and the joining becomes difficult. Decreases reliability. The present invention has been devised to improve this drawback.
このため本発明においては、リードを接続する
パツドを有するプリント基板に、複数個のフラツ
トリードを有する実装部品を実装する場合の位置
決め方法において、該プリント基板上のパツドに
貫通孔を穿設する一方実装部品の各リードの裏面
の該貫通孔に対応する領域のみに突起を形成し、
該部品の各リードの裏面を各パツドの貫通孔以外
の領域に密着させるとともに該各リードの突起を
該貫通孔内に嵌合せしめることを特徴とするもの
である。 Therefore, in the present invention, in a positioning method when mounting a mounted component having a plurality of flat leads on a printed circuit board having pads for connecting leads, a through-hole is formed in the pad on the printed circuit board. Forming protrusions only in the area corresponding to the through hole on the back side of each lead of the component,
The device is characterized in that the back surface of each lead of the component is brought into close contact with an area other than the through-hole of each pad, and the protrusion of each lead is fitted into the through-hole.
以下、添付図面に基づいて本発明の実施例につ
き詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings.
第３図に本発明の方法を実施する実装部品とプ
リント基板との実装直前の状態を斜視図により示
す。図において６は実装部品であつて、その多数
のリード５には裏面に突起７が形成されている。
またプリント基板１にはリード５が接続されるべ
き配線用の導体であるパツド２に貫通した孔３が
あけられている。なおこの孔３とリードの突起７
とはその位置が一致するようにし、かつリードの
突起７はパツド２の貫通孔３に対応する領域のみ
に設けられている。このように形成された基板に
実装部品を載置すれば第４図に示すように孔３と
リードの突起７とは容易に嵌合してその位置が決
定され、かつ突起７以外の領域はパツド２に密着
する。この状態でリード５をパツド２に半田付け
を行い部品６を固定するのである。なお第４図は
単にプリント基板を貫通してパツドに孔をあけた
場合であるが、第５図に示す如くスルーホール４
を利用することも可能であり、その効果も同様で
ある。 FIG. 3 is a perspective view showing a state immediately before mounting of a mounted component and a printed circuit board for carrying out the method of the present invention. In the figure, reference numeral 6 denotes a mounted component, and its many leads 5 have protrusions 7 formed on the back surface thereof.
Further, the printed circuit board 1 is provided with a hole 3 that penetrates through a pad 2 which is a conductor for wiring to which a lead 5 is to be connected. Note that this hole 3 and the protrusion 7 of the lead
and the lead protrusions 7 are provided only in areas corresponding to the through holes 3 of the pads 2. When a mounted component is placed on the substrate formed in this way, the hole 3 and the protrusion 7 of the lead are easily fitted and the position is determined, as shown in FIG. 4, and the area other than the protrusion 7 is Closely adheres to pad 2. In this state, the lead 5 is soldered to the pad 2 to fix the component 6. Although Figure 4 shows the case where a hole is simply drilled through the printed circuit board, the through hole 4 is shown in Figure 5.
It is also possible to use , and the effect is the same.
以上の本発明方法は実装部品としてIC、LSI、
抵抗、トランジスタ、コンデンサ等に適用され、
プリント基板には材料的に樹脂或いはセラミツク
等何れでも良く、構造的には片面、両面、多層の
各プリント基板に適用することができる。またパ
ツドとリードとの半田付けにはリフロ、手半田付
け、赤外照射、超音波半田付け等の方法が適用可
能である。 The above method of the present invention uses IC, LSI,
Applicable to resistors, transistors, capacitors, etc.
The printed circuit board may be made of resin or ceramic, and can be applied to single-sided, double-sided, or multilayer printed circuit boards. Furthermore, methods such as reflow soldering, manual soldering, infrared irradiation, and ultrasonic soldering can be applied to soldering the pads and leads.
以上説明したように本発明の方法は、実装部品
のリードに形成した突起とプリント基板に設けた
孔とを嵌合することにより実装部品の位置決めを
容易にし、又基板のパツド部の接合面積が小さい
ような場合でも孔部に入つたリードの突起にフイ
レツトができて接合部の表面積が大となり接合の
信頼性が増加する。さらに部品の位置決定が容易
であることから部品実装の自動化を容易にするも
のである。 As explained above, the method of the present invention facilitates the positioning of the mounted component by fitting the protrusion formed on the lead of the mounted component into the hole provided on the printed circuit board, and also reduces the bonding area of the pad portion of the board. Even if it is small, a fillet is formed on the protrusion of the lead that has entered the hole, increasing the surface area of the joint and increasing the reliability of the joint. Furthermore, since it is easy to determine the position of components, automation of component mounting is facilitated.
第１図および第２図は従来の実装部品のプリン
ト基板への実装状態の断面図、第３図は本発明に
かかる実装部品のプリント基板への位置決め方法
を実施する実装部品とプリント基板の斜視図、第
４図および第５図はその実装状態の断面図であ
る。
１……プリント基板、２……パツド、３……
孔、４……スルーホール、５……リード、６……
実装部品、７……突起。
1 and 2 are cross-sectional views of conventional mounted components mounted on a printed circuit board, and FIG. 3 is a perspective view of a mounted component and a printed circuit board implementing the method of positioning a mounted component on a printed circuit board according to the present invention. 4 and 5 are cross-sectional views of the mounted state. 1...Printed circuit board, 2...Pad, 3...
Hole, 4... Through hole, 5... Lead, 6...
Mounted parts, 7...Protrusions.
Claims (1)
板に、複数個のフラツトリードを有する実装部品
を実装する場合の位置決め方法において、該プリ
ント基板上のパツドに貫通孔を穿設する一方実装
部品の各リードの裏面の該貫通孔に対応する領域
のみに突起を形成し、該部品の各リードの裏面を
各パツドの貫通孔以外の領域に密着させるととも
に該各リードの突起を該貫通孔内に嵌合せしめる
ことを特徴とする実装部品のプリント基板への位
置決め方法。1. In a positioning method when mounting a mounted component having a plurality of flat leads on a printed circuit board having pads for connecting the leads, a through hole is drilled in the pad on the printed circuit board, while the back side of each lead of the mounted component is Forming a protrusion only in the area corresponding to the through hole of the component, bringing the back surface of each lead of the component into close contact with an area other than the through hole of each pad, and fitting the protrusion of each lead into the through hole. A method for positioning mounted components on a printed circuit board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6666978A JPS54158674A (en) | 1978-06-05 | 1978-06-05 | Method of positioning component on printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6666978A JPS54158674A (en) | 1978-06-05 | 1978-06-05 | Method of positioning component on printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54158674A JPS54158674A (en) | 1979-12-14 |
| JPS6146998B2 true JPS6146998B2 (en) | 1986-10-16 |
Family
ID=13322534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6666978A Granted JPS54158674A (en) | 1978-06-05 | 1978-06-05 | Method of positioning component on printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54158674A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019211931A1 (en) | 2018-05-01 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | Touch sensor and display device using same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745995A (en) * | 1980-09-03 | 1982-03-16 | Canon Kk | Method and device for mounting electric circuit element |
| JPS6193980U (en) * | 1984-11-26 | 1986-06-17 | ||
| JP2687493B2 (en) * | 1988-10-20 | 1997-12-08 | 日本電気株式会社 | Surface mount structure of semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5158670A (en) * | 1974-11-18 | 1976-05-22 | Hitachi Ltd | DENSHIBUHINNOHANDAZUKESETSUZOKUKOZO OYOBI SONOSEIZOHOHO |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50135951U (en) * | 1974-04-23 | 1975-11-08 | ||
| JPS52149257U (en) * | 1976-05-11 | 1977-11-12 |
-
1978
- 1978-06-05 JP JP6666978A patent/JPS54158674A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5158670A (en) * | 1974-11-18 | 1976-05-22 | Hitachi Ltd | DENSHIBUHINNOHANDAZUKESETSUZOKUKOZO OYOBI SONOSEIZOHOHO |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019211931A1 (en) | 2018-05-01 | 2019-11-07 | パナソニックＩｐマネジメント株式会社 | Touch sensor and display device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54158674A (en) | 1979-12-14 |
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