JPS58148405A - Method of connecting lead terminal - Google Patents
Method of connecting lead terminalInfo
- Publication number
- JPS58148405A JPS58148405A JP3269782A JP3269782A JPS58148405A JP S58148405 A JPS58148405 A JP S58148405A JP 3269782 A JP3269782 A JP 3269782A JP 3269782 A JP3269782 A JP 3269782A JP S58148405 A JPS58148405 A JP S58148405A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- electronic component
- flux
- solder
- connecting lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は、円板状または角板状をしたバ′リスタ。[Detailed description of the invention] The present invention relates to a varistor having a disk shape or a square plate shape.
抵抗、コンデンサ等の電子部品への半田付けによるリー
ド端子の接続方法に関するものであり、フラックスを使
用することなしに還元性または不活性ガスを伴なった熱
風で半田を溶融してリード端子付けを行い、信頼性の高
い電子部品を提供することを目的とする。This relates to a method of connecting lead terminals to electronic components such as resistors and capacitors by soldering.The method involves melting the solder with hot air accompanied by reducing or inert gas to attach lead terminals without using flux. The aim is to provide highly reliable electronic components.
従来より、電子部品への半田付けによるリード端子の接
続方法としては、半田付は性を良くするためにフラック
スを使用するのが一般的である。Conventionally, as a method for connecting lead terminals to electronic components by soldering, flux has generally been used to improve soldering properties.
しかし、フラックスを使用するために、例えばｔＮｌ）
リスクであればバリスタ電圧の変化や劣化が起り、後の
寿命特性に悪影響を及ぼす原因となっていた。However, in order to use a flux, e.g. tNl)
If it were a risk, the varistor voltage would change or deteriorate, which would have a negative impact on later life characteristics.
本発明は上記のような従来の欠点を除去すべくなされた
ものであり、以下本発明を実施例を示す図面と共に説明
する。The present invention has been made to eliminate the above-mentioned conventional drawbacks, and the present invention will be described below with reference to drawings showing embodiments.
まず、第１図に示すように使用するリード端子３３′の
円板状または角板状をしたバリスタ、抵抗、コンデンサ
等の電子部品素体１への接続部分に予め半田４，４′の
半田付けを行い、フラックスを十分洗浄し除去しておく
。そして、上記リード端子３，３′で電子部品素体１を
両方からはさみ込み、これにチッ素、アルゴン等の還元
性または不活性ガスと共にホットジェットで熱風を吹付
け、フラックスを使用することなく上記半田４．４′を
溶融させてリード端子３，３′を電子部品素体１に半田
付けにより接続する。このようにして電子部品素体１に
アキシャル型にリード端子３．３′を半田付けした完成
品を第２図に示している。なお、図で２．２′は電子部
品素体１の両面に設けられた電極部である。First, as shown in Fig. 1, solder 4, 4' is applied to the connection part of the lead terminal 33' to be used, which is in the shape of a disk or square plate, to the electronic component body 1 such as a varistor, resistor, or capacitor. After applying the flux, thoroughly wash and remove the flux. Then, the electronic component element body 1 is sandwiched between the lead terminals 3 and 3' from both sides, and hot air is blown thereon with a hot jet along with a reducing or inert gas such as nitrogen or argon, without using flux. The solder 4, 4' is melted and the lead terminals 3, 3' are connected to the electronic component body 1 by soldering. FIG. 2 shows a completed product in which lead terminals 3 and 3' are soldered in an axial manner to the electronic component body 1 in this manner. In the figure, reference numeral 2.2' indicates electrode portions provided on both sides of the electronic component element body 1.
以上のような本発明による接続方法では、還元性または
不活性ガスを使用するため、電子部品素体の電極面及び
半田面の酸化が防止され、フラックスを使用しなくても
半田付けが可能である。したかって、フラックスによる
特性劣化が防止でき、しかも半田付は後のフラックス洗
浄の必要がなくなり、信頼性の高い電子部品を提供する
ことができるものである。In the connection method according to the present invention as described above, since reducing or inert gas is used, oxidation of the electrode surface and solder surface of the electronic component element body is prevented, and soldering can be performed without using flux. be. Therefore, characteristic deterioration due to flux can be prevented, and there is no need for flux cleaning after soldering, making it possible to provide highly reliable electronic components.
第１図は本発明方法の実施例を示す製造途中の断面図、
第２図は同方法により得られたアキシャル型電子部品の
断面図である。
１・・・・・・電子部品（電子部品素体）、３，３′・
・・・・・リード端子、４．４′・・・・・・半田。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
！FIG. 1 is a sectional view showing an example of the method of the present invention during manufacturing;
FIG. 2 is a cross-sectional view of an axial type electronic component obtained by the same method. 1...Electronic component (electronic component element), 3,3'・
...Lead terminal, 4.4'...Solder. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure!
Claims (1)
いフラックスを洗浄しておき、このリード端子で上記電
子部品をはさみ込み、その状態でフラックスを使用する
ことなく還元性または不活性ガスを伴なった熱風を吹付
け、上記半田を溶融させて上記リード端子を上記電子部
品に半田付けすることを特徴とするリード端子の接続方
法。Solder the connection part of the lead terminal to the electronic component in advance and clean the flux, sandwich the electronic component with the lead terminal, and in that state, solder it with reducing or inert gas without using flux. A method for connecting a lead terminal, comprising: blowing hot air to melt the solder and solder the lead terminal to the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3269782A JPS58148405A (en) | 1982-03-01 | 1982-03-01 | Method of connecting lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3269782A JPS58148405A (en) | 1982-03-01 | 1982-03-01 | Method of connecting lead terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58148405A true JPS58148405A (en) | 1983-09-03 |
Family
ID=12366038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3269782A Pending JPS58148405A (en) | 1982-03-01 | 1982-03-01 | Method of connecting lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58148405A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5622362A (en) * | 1979-07-31 | 1981-03-02 | Asahi Chem Ind Co Ltd | Improving initial drying property of polyurethane resin coating material |
-
1982
- 1982-03-01 JP JP3269782A patent/JPS58148405A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5622362A (en) * | 1979-07-31 | 1981-03-02 | Asahi Chem Ind Co Ltd | Improving initial drying property of polyurethane resin coating material |
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