JPH0129070B2 - - Google Patents
Info
- Publication number
- JPH0129070B2 JPH0129070B2 JP57149334A JP14933482A JPH0129070B2 JP H0129070 B2 JPH0129070 B2 JP H0129070B2 JP 57149334 A JP57149334 A JP 57149334A JP 14933482 A JP14933482 A JP 14933482A JP H0129070 B2 JPH0129070 B2 JP H0129070B2
- Authority
- JP
- Japan
- Prior art keywords
- glass tube
- stepped cylindrical
- chip
- cylindrical electrode
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
本発明は電子部品、特にリードレスDHD形の
電子部品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing electronic components, particularly leadless DHD type electronic components.
最近、プリント基板等の配線基板へのダイオー
ドの実装形態として面実装構造が採用されてい
る。この種のダイオード構造としては、第１図に
示すように、ガラススリーブ（ガラス管）１と、
このガラススリーブ１の両端から小径部２を挿入
しかつ小径部端面間にチツプ（ダイオードチツ
プ）３を挾持する段付円柱電極４とからなるもの
が知られている。段付円柱電極（以下、単に電極
とも称す。）はその大径部５をガラススリーブ１
から突出させている。そして、実装時は、あらか
じめプリント基板６に印刷した接着層７によつて
ガラススリーブ１部分を仮固定した後、半田リフ
ローによつて電極の大径部５とプリント基板６の
配線層８とを半田９で固定して電気的接続を図つ
ている。このようなダイオードは、従来のような
プリント基板の挿入孔に挿し込み細くて長いリー
ドを有しないことからリードレスDHD（ダブル・
ヒートシンク・ダイオード）と称されている。 Recently, a surface mount structure has been adopted as a form of mounting diodes on wiring boards such as printed circuit boards. As shown in FIG. 1, this type of diode structure includes a glass sleeve (glass tube) 1,
It is known to have a stepped cylindrical electrode 4 in which a small diameter part 2 is inserted from both ends of the glass sleeve 1 and a chip (diode chip) 3 is sandwiched between the end faces of the small diameter part. The stepped cylindrical electrode (hereinafter also simply referred to as an electrode) has its large diameter portion 5 connected to the glass sleeve 1.
It stands out from the outside. Then, during mounting, after temporarily fixing the glass sleeve 1 part with the adhesive layer 7 printed on the printed circuit board 6 in advance, the large diameter part 5 of the electrode and the wiring layer 8 of the printed circuit board 6 are connected by solder reflow. It is fixed with solder 9 for electrical connection. This type of diode is inserted into the insertion hole of a printed circuit board and does not have long thin leads like conventional ones, so it is called a leadless DHD (double DHD).
It is called a heat sink diode.
ところで、このような面実装型のダイオードの
プリント基板への実装は、両端に細長いリード１
０を突出させかつそのリードをプリント基板の取
付孔に挿入する第２図に示すようなダブル・ヒー
トシンク・ダイオード（DHD）１１の実装に比
較して実装作業が容易である特長があるが、その
組立においては、段付円柱電極が短い等のことも
あつて、位置決め、方向決めが難しい。 By the way, when mounting such a surface mount type diode on a printed circuit board, long thin leads 1 are attached to both ends.
Compared to mounting a double heat sink diode (DHD) 11 as shown in Figure 2, in which the lead 0 protrudes and the lead is inserted into the mounting hole of the printed circuit board, the mounting work is easier. During assembly, positioning and orientation are difficult, partly because the stepped cylindrical electrode is short.
また、現在、安価な製造システムとして、前記
DHDの製造システムが確立されているが、この
ような新な面実装構造のダイオードの量産化を図
る場合、長いリードに代つて短い段付円柱電極を
用いることからDHD製造システムは使用できな
くなり、新に組立、選別等の設備投資が必要とな
る。この結果、製造コストが高くなる難点があ
る。 In addition, the above-mentioned method is currently available as an inexpensive manufacturing system.
Although a DHD manufacturing system has been established, when mass-producing diodes with this new surface-mount structure, short stepped cylindrical electrodes are used instead of long leads, making the DHD manufacturing system unusable. New equipment investment for assembly, sorting, etc. will be required. As a result, there is a disadvantage that the manufacturing cost becomes high.
したがつて、本発明の目的は電子部品を安価に
製造することができる電子部品の製造方法を提供
することにある。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing electronic components that allows electronic components to be manufactured at low cost.
このような目的を達成するために本発明は、１
対の段付円柱電極の小径部をガラス管の両端から
ガラス管内に挿入するとともに、１対の小径部端
面間にチツプを挾持させ、かつガラス管の一時的
溶融によつてチツプを気密封止して電子部品を製
造する方法において、あらかじめ前記段付円柱電
極の大径端面に細く長いリード部を同軸的に設け
ておくとともに、組立気密封止後に前記リード部
を大径部端面部分で切断除去するものであつて、
以下実施例により本発明を説明する。 In order to achieve these objectives, the present invention has the following features:
The small diameter portions of the pair of stepped cylindrical electrodes are inserted into the glass tube from both ends of the glass tube, the chip is sandwiched between the end faces of the pair of small diameter portions, and the chip is hermetically sealed by temporarily melting the glass tube. In this method, a thin and long lead portion is coaxially provided on the large-diameter end face of the stepped cylindrical electrode in advance, and the lead portion is cut at the large-diameter end face portion after assembly and hermetically sealing. It is intended to remove
The present invention will be explained below with reference to Examples.
第３図ａ〜ｃは本発明の一実施例による面実装
型ダイオードの製造方法を示す断面図である。 3a to 3c are cross-sectional views showing a method of manufacturing a surface-mount diode according to an embodiment of the present invention.
この実施例の面実装型ダイオードの製造にあつ
ては、同図ａに示すように、細いリード部１２を
大径部５の端面に同軸的に設けた小径部２と大径
部５とからなるリード部付段付円柱電極１３を１
対用意するとともに、チツプ３およびガラス管１
をあらかじめ用意する。リード部付段付円柱電極
１３は、たとえば鉄系の細線（たとえば、直径
0.5mm〓、長さ25mm程度）からなるリードの一端を
ヘツデイング加工してガラス管１の内径よりも大
きく外径よりも小さな鍔部を形成し、この鍔部の
端面中心部にジユメツト線を同軸的に溶接して形
成する。ガラス管１は内径が0.86mm〓、外径が２
mm〓前後となり、長さは４〜５mmとなつている。
チツプ３は上下面にそれぞれ電極（一方はバンプ
電極）を有している。 In manufacturing the surface-mounted diode of this embodiment, as shown in FIG. The stepped cylindrical electrode 13 with lead part is 1
In addition, prepare a chip 3 and a glass tube 1.
Prepare in advance. The stepped cylindrical electrode with lead portion 13 is made of, for example, a thin iron wire (for example, a diameter
One end of the lead made of 0.5mm〓, length of about 25mm) is helded to form a flange larger than the inner diameter of the glass tube 1 and smaller than the outer diameter, and a dim wire is coaxially attached to the center of the end surface of this flange. Formed by welding. Glass tube 1 has an inner diameter of 0.86 mm and an outer diameter of 2.
The length is approximately 4 to 5 mm.
The chip 3 has electrodes (one is a bump electrode) on the upper and lower surfaces.
リード部付段付円柱電極１３は鍔状の大径部５
を有する点では第２図のDHDのリード１０とは
異るが、組立にあつてはDHDのリード１０の場
合と同様となる。すなわち、図示はしないが、一
方のリード部付段付円柱電極１３を鉛直にDHD
組立用治具で支持した後、このリード部付段付円
柱電極１３の上部の小径部２にガラス管１を挿入
する。その後、このガラス管１内にチツプ３を入
れるとともに、他方のリード付段付円柱電極１３
をその小径部２側からガラス管１内に挿し込む。
すると、ガラス管１内において、チツプ３は１対
の小径部２の端面間に電極を介して挾持される。
そこで、ガラス管を一時的に加熱溶融してジユメ
ツト線からなる小径部２にガラス管１を密着さ
せ、同図ｂに示すようにチツプ３を気密的に封止
する。 The stepped cylindrical electrode 13 with a lead part has a large diameter part 5 shaped like a brim.
Although it is different from the DHD lead 10 shown in FIG. 2 in that it has the following, the assembly is similar to that of the DHD lead 10. In other words, although not shown in the figure, one of the stepped cylindrical electrodes 13 with the lead part is connected vertically to the DHD.
After supporting it with an assembly jig, the glass tube 1 is inserted into the small diameter portion 2 at the top of the stepped cylindrical electrode 13 with a lead portion. Thereafter, the chip 3 is put into the glass tube 1, and the other stepped cylindrical electrode 13 with a lead is inserted into the glass tube 1.
is inserted into the glass tube 1 from the small diameter portion 2 side.
Then, within the glass tube 1, the chip 3 is held between the end faces of the pair of small diameter portions 2 via the electrodes.
Therefore, the glass tube 1 is temporarily heated and melted to tightly adhere the glass tube 1 to the small diameter portion 2 made of a composite wire, and the chip 3 is hermetically sealed as shown in FIG.
つぎに、大径部５の端面部分でリード部１２を
切断し、同図ｃで示すようなガラス管部分の両端
から段付円柱電極４の大径部５を突出させる面実
装型ダイオード１４を製造する。 Next, the lead portion 12 is cut at the end face portion of the large diameter portion 5, and a surface mount type diode 14 is fabricated with the large diameter portion 5 of the stepped cylindrical electrode 4 protruding from both ends of the glass tube portion as shown in FIG. Manufacture.
このような実施例によれば、治具を含めて
DHDの製造設備をそのまま用いて面実装型ダイ
オードの製造を行うことができる。このため、新
な設備投資も不要となり、安価に面実装型ダイオ
ードを製造することができる。すなわち、従来の
DO―35型等の製造設備である封止装置・選別装
置・マーク装置等をそのまま利用できる。したが
つて、面実装型ダイオードに対するすべての加工
処理等が完了した時点でリード部を切断すればよ
い。 According to such an embodiment, including the jig,
Surface-mount diodes can be manufactured using DHD manufacturing equipment as is. Therefore, there is no need for new equipment investment, and surface-mount diodes can be manufactured at low cost. In other words, conventional
The sealing equipment, sorting equipment, marking equipment, etc. that are used to manufacture the DO-35 model can be used as is. Therefore, the lead portion may be cut off when all the processing and the like for the surface-mounted diode are completed.
なお、本発明は前記実施例に限定されない。す
なわち、本発明はダイオード以外にダビルエンド
型のサーミスタ、シールコンデンサあるいは他の
半導体チツプ等をガラス管内に組み込む面実装型
の電子部品の製造にも適用できる。 Note that the present invention is not limited to the above embodiments. That is, the present invention can also be applied to the manufacture of surface-mounted electronic components in which a double-ended thermistor, a sealed capacitor, or other semiconductor chip, etc., are incorporated into a glass tube in addition to diodes.
また、リード部付段付円柱電極は他の構造でも
よく、材質も他の金属でもよい。 Further, the stepped cylindrical electrode with lead portion may have another structure and may be made of other metal.
以上のように、本発明によれば、現有のDHD
製造用各種装置類を用いて面実装型電子部品を製
造することができることから、安価に面実装型の
電子部品を製造することができる。 As described above, according to the present invention, the existing DHD
Since surface-mounted electronic components can be manufactured using various types of manufacturing equipment, surface-mounted electronic components can be manufactured at low cost.
第１図は従来の面実装型ダイオードの実装状態
を示す断面図、第２図はDHDの断面図、第３図
ａ〜ｃは本発明の一実施例による面実装型ダイオ
ードの製造方法を示す断面図である。
１……ガラス管、２……小径部、３……チツ
プ、４……段付円柱電極、５……大径部、６……
プリント基板、１０……リード、１１……DHD、
１２……リード部、１３……リード部付段付円柱
電極、１４……面実装型ダイオード。
Fig. 1 is a cross-sectional view showing the mounting state of a conventional surface-mount diode, Fig. 2 is a cross-sectional view of a DHD, and Figs. 3 a to c show a method of manufacturing a surface-mount diode according to an embodiment of the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Glass tube, 2... Small diameter part, 3... Chip, 4... Stepped cylindrical electrode, 5... Large diameter part, 6...
Printed circuit board, 10...Lead, 11...DHD,
12...Lead part, 13...Stepped cylindrical electrode with lead part, 14...Surface mount diode.
Claims (1)
端からガラス管内に挿入するとともに、１対の小
径部端面間にチツプを挾持させ、かつガラス管の
一時的溶融によつてチツプを気密封止して電子部
品を製造する方法において、あらかじめ前記段付
円柱電極の大径部端面に細く長いリード部を同軸
的に設けておくとともに、組立気密封止後に前記
リード部を大径部端面部分で切断除去することを
特徴とする電子部品の製造方法。1 Insert the small diameter portions of a pair of stepped cylindrical electrodes into the glass tube from both ends of the glass tube, sandwich the chip between the end faces of the pair of small diameter portions, and temporarily melt the glass tube to air the chip. In a method of manufacturing electronic components by sealing, a thin and long lead portion is provided coaxially on the large diameter end face of the stepped cylindrical electrode in advance, and after assembly and airtight sealing, the lead portion is attached to the large diameter end face of the stepped cylindrical electrode. A method of manufacturing an electronic component, characterized by cutting and removing it in parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57149334A JPS5940555A (en) | 1982-08-30 | 1982-08-30 | Manufacture of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57149334A JPS5940555A (en) | 1982-08-30 | 1982-08-30 | Manufacture of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5940555A JPS5940555A (en) | 1984-03-06 |
| JPH0129070B2 true JPH0129070B2 (en) | 1989-06-07 |
Family
ID=15472831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57149334A Granted JPS5940555A (en) | 1982-08-30 | 1982-08-30 | Manufacture of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5940555A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201945U (en) * | 1986-06-12 | 1987-12-23 |
-
1982
- 1982-08-30 JP JP57149334A patent/JPS5940555A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5940555A (en) | 1984-03-06 |
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