JPS62213224A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPS62213224A JPS62213224A JP61057225A JP5722586A JPS62213224A JP S62213224 A JPS62213224 A JP S62213224A JP 61057225 A JP61057225 A JP 61057225A JP 5722586 A JP5722586 A JP 5722586A JP S62213224 A JPS62213224 A JP S62213224A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- soldering
- electronic parts
- roughness
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 description 13
- 238000005476 soldering Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電極を引出し樹脂外装をおこなうフィルムコン
デンサ等の電子部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to electronic components such as film capacitors that have electrodes and are covered with resin.
従来の技術
近年、電子機器の小形化に伴ない、回路部品であるフィ
ルムコンデンサにもチップ化が要求されている。チップ
部品の半田付けには、リフロ一方式とディップ方式があ
り、モールド型チップコンデンサの場合には、主にリフ
ロ一方式を採用している。このリフロ一方式はプリント
基板上にスクリーン印刷されたクリーム半田にチップコ
ンデンサを仮固定し遠赤外線、近赤外線などの熱により
溶融し半田付けをする方法である。この時端子部と基板
との溶着力が充分、必要とする。2. Description of the Related Art In recent years, as electronic devices have become smaller, film capacitors, which are circuit components, are required to be made into chips. There are two methods of soldering chip components: the reflow one-way method and the dip method.In the case of molded chip capacitors, the reflow one-way method is mainly used. This reflow method is a method in which chip capacitors are temporarily fixed to cream solder screen printed on a printed circuit board, and then melted and soldered using heat such as far infrared rays or near infrared rays. At this time, sufficient welding force between the terminal part and the board is required.
以下従来例とその問題点を説明する。A conventional example and its problems will be explained below.
第３図ａ、ｂはモールド型チップコンデンサの本体を示
すもので、第３図すは第３図ａのＡ部の拡大図である。3a and 3b show the main body of the molded chip capacitor, and FIG. 3 is an enlarged view of section A in FIG. 3a.
１ａは端子部本体、１ｂはめつき部を示し、板状の端子
部１をコンデンサ本体２のモールド外装部に折り曲げ加
工することによりモールド型チップコンデンサを構成し
ている。このモールド型チップコンデンサの半田付けに
おいて、基板またはクリーム半田と端子部との溶着性を
良くするために、端子部本体１ａ上にめっき処理をおこ
なっている。Reference numeral 1a indicates a terminal body, and 1b indicates a fitting portion.A molded chip capacitor is constructed by bending a plate-shaped terminal portion 1 onto a molded exterior portion of a capacitor body 2. In soldering this molded chip capacitor, plating treatment is performed on the terminal body 1a in order to improve the weldability between the terminal part and the board or cream solder.
発明が解決しようとする問題点
しかしながら、この方法では、半田付は後、半田が端子
部１と基板の接触面全体に溶けにくく部分的にのみ半田
付けされ半田不良となる場合がある。今後、基板１部品
の小型化によシ増々高密度実装化され半田付けの溶着強
度の確保が難しくなっている。Problems to be Solved by the Invention However, in this method, after soldering, the solder is difficult to melt over the entire contact surface between the terminal portion 1 and the board, and soldering may occur only partially, resulting in a soldering defect. In the future, due to the miniaturization of each component on a board, the density of packaging will increase, and it will become difficult to ensure the strength of soldering.
本発明は前記の問題を鑑み、はんだ付けの溶着力を向上
させ、かつ電気的接続を確実なものとして、製品特性、
信頼性の高いチップ型の電子部品を提供するものである
。In view of the above problems, the present invention improves the welding force of soldering and ensures reliable electrical connection, and improves product characteristics.
It provides highly reliable chip-type electronic components.
問題点を解決するための手段
前記目的を達成するため本発明の電子部品は、端子部に
半田めっき処理を施こし、かつ表面粗さを０．５μｍ（
Ｒａ：中心線平均粗さ）以上としたものである。Means for Solving the Problems In order to achieve the above object, the electronic component of the present invention has its terminal portions subjected to solder plating treatment and has a surface roughness of 0.5 μm (
Ra: center line average roughness) or more.
作 用
この構成によシ、本発明の電子部品は、端子部表面の突
部に熱が集中し、半田が溶は易くなり、接触面積が大き
くなるため、プリント基板またはクリーム半田との溶融
性に優れ、溶着強度が向上する。Effect: Due to this configuration, the electronic component of the present invention has low meltability with printed circuit boards or cream solder because heat concentrates on the protrusions on the surface of the terminal, making it easier for the solder to melt and increasing the contact area. Excellent properties and improved welding strength.
実施例
以下本発明の実施例について図面を参照しながら説明す
る。第１図ａ、ｂは本発明の一実施例におけるモード型
チップフィルムコンデンサを示すもので、第１図すは第
１図ａのＡ部の拡大図である。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings. FIGS. 1a and 1b show a mode type chip film capacitor in one embodiment of the present invention, and FIG. 1 is an enlarged view of section A in FIG. 1a.
第１図において１１は端子部、１１ａは端子部本体、１
１ｂはこの端子部本体１１ａの外表面に形成しためっき
部、２はモールド外装されたコンデンサ本体である。In FIG. 1, 11 is a terminal section, 11a is a terminal section main body, 1
1b is a plating portion formed on the outer surface of this terminal body 11a, and 2 is a capacitor body covered with a mold.
以上のように構成されたモールド型チップフィルムコン
デンサで、メッキ部１１ｂは第２図に示すように、端子
部表面粗さと半田付は不良率の関係から、表面粗さ０．
５μｍ（Ｒａ：中心線平均粗さ）以上であれば半田付は
不良率は減少する。In the molded chip film capacitor constructed as described above, the plated portion 11b has a surface roughness of 0.000000000000000000000000000000000000000000000000.0.0.
If the roughness is 5 μm (Ra: center line average roughness) or more, the defective rate of soldering will decrease.
以上のように本実施例によれば端子部のめっきした表面
を粗すことにより従来例に比べ表面の突起部に熱が集中
し溶は易くなり、接触面積が増すため、プリント基板ま
たは、クリーム半田との溶融性が良好となり、溶着強度
が向上する。As described above, according to this embodiment, by roughening the plated surface of the terminal, heat concentrates on the protrusions on the surface compared to the conventional example, making it easier to melt and increasing the contact area. The meltability with solder is improved, and the welding strength is improved.
発明の効果
以上のように本発明は、電子部品の端子部に半田めっき
処理を施こし、かつ表面粗さを０．６μｍ実装における
プリント基板、部品等の小形化に対応でき、安定した製
品特性、信頼性の高い電子部品を提供でき、工業的に大
きな効果をもたらすものである。Effects of the Invention As described above, the present invention applies solder plating to the terminals of electronic components, and is compatible with the miniaturization of printed circuit boards, components, etc. in mounting with a surface roughness of 0.6 μm, and has stable product characteristics. , it is possible to provide highly reliable electronic components and bring about great industrial effects.
第１図ａ、ｂは本発明の一実施例によるモールド型フィ
ルムコンデンサの斜視図及び要部拡大図、第２図は端子
部の表面粗さと半田付は不良率（５００，９の加圧を加
えはがれる不良率）の関係を示す特性図、第３図ａ、ｂ
は従来のモールド型フィルムコンデンサの斜視図及び要
部拡大図である。
１１・・・・・・端子部、１１ａ・・・・・・端子部本
体、１１ｂ・・・・・・めっき部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第３
図
（ｂ）／ｂ
！Ｉ ゝ
プFigures 1a and b are a perspective view and an enlarged view of the main parts of a molded film capacitor according to an embodiment of the present invention, and Figure 2 shows the surface roughness of the terminal part and soldering. Figure 3 a, b is a characteristic diagram showing the relationship between
1 is a perspective view and an enlarged view of essential parts of a conventional molded film capacitor. 11...Terminal part, 11a...Terminal part body, 11b...Plating part. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
Figure (b)/b! I pu
Claims (1)
．５μｍ（Ｒａ：中心線平均粗さ）以上としたことを特
徴とする電子部品。Solder plating is applied to the terminals, and the surface roughness is 0.
．． An electronic component characterized by having a roughness of 5 μm (Ra: center line average roughness) or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057225A JPS62213224A (en) | 1986-03-14 | 1986-03-14 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61057225A JPS62213224A (en) | 1986-03-14 | 1986-03-14 | Electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62213224A true JPS62213224A (en) | 1987-09-19 |
Family
ID=13049586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61057225A Pending JPS62213224A (en) | 1986-03-14 | 1986-03-14 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62213224A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018170355A (en) * | 2017-03-29 | 2018-11-01 | Tdk株式会社 | Through-capacitor |
-
1986
- 1986-03-14 JP JP61057225A patent/JPS62213224A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018170355A (en) * | 2017-03-29 | 2018-11-01 | Tdk株式会社 | Through-capacitor |
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