JPH10135003A - Rectangular chip-like electronic part - Google Patents
Rectangular chip-like electronic partInfo
- Publication number
- JPH10135003A JPH10135003A JP9299983A JP29998397A JPH10135003A JP H10135003 A JPH10135003 A JP H10135003A JP 9299983 A JP9299983 A JP 9299983A JP 29998397 A JP29998397 A JP 29998397A JP H10135003 A JPH10135003 A JP H10135003A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrodes
- electrode
- protective film
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、角形チップ固定抵
抗器や積層チップコンデンサなどの角形チップ状電子部
品の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improvements in square chip electronic components such as square chip fixed resistors and multilayer chip capacitors.
【０００２】[0002]
【従来の技術】角形チップ状電子部品として、チップ部
品の対向両側に端子電極を設け、端子電極のうちチップ
部品の上面に形成される上面電極のチップの端縁寄りの
部分が露出する態様で上面電極上に保護膜を設けたもの
がある。一例として、角形チップ固定抵抗器は、例えば
図３に示す如く、アルミナ基板２０上に抵抗体膜（特に
図示せず）が設けられ、抵抗体膜は全体が保護膜２２で
覆われて保護されている。アルミナ基板２０の左右両側
には電極３０，４０が形成されており、左右の各端子電
極３０，４０はそれぞれ上面外部電極３１，４１と、側
面外部電極３２，４２と、下面外部電極３３，４３とで
構成される。この内、上面外部電極３１，４１は端縁寄
りの部分を残して保護膜２２で覆われている。2. Description of the Related Art As a rectangular chip-shaped electronic component, terminal electrodes are provided on opposite sides of the chip component, and a portion of the terminal electrode near an edge of a chip of an upper surface electrode formed on the upper surface of the chip component is exposed. In some cases, a protective film is provided on the upper electrode. As an example, in the square chip fixed resistor, as shown in FIG. 3, for example, a resistor film (not particularly shown) is provided on an alumina substrate 20, and the resistor film is entirely covered with a protection film 22 and protected. ing. Electrodes 30, 40 are formed on both left and right sides of the alumina substrate 20, respectively. The left and right terminal electrodes 30, 40 are upper surface external electrodes 31, 41, side surface external electrodes 32, 42, and lower surface external electrodes 33, 43, respectively. It is composed of Of these, the upper surface external electrodes 31 and 41 are covered with the protective film 22 except for portions near the edges.
【０００３】かかる構造のチップ抵抗器を基板に配線す
る場合、例えば図４に示すように抵抗器５０をガラスエ
ポキシ基板７０に取付ける場合を例にすると、抵抗器５
０を基板７０上に載せた後に、基板上の銅配線７１に抵
抗器５０の左右電極３０，４０を半田付けして固定する
のが一般的である。この時、半田付けは下面外部電極３
３，４３と側面外部電極３２，４２だけでなく上面外部
電極３１，４１にも行われ、図中に斜線で示す如く半田
６０は上面外部電極３１，４１上で盛り上がった状態に
なる。When a chip resistor having such a structure is wired on a substrate, for example, as shown in FIG.
Generally, the left and right electrodes 30, 40 of the resistor 50 are soldered and fixed to the copper wiring 71 on the substrate after the 0 is mounted on the substrate 70. At this time, soldering is performed on the lower external electrode 3
3, 43 and the side external electrodes 32, 42 as well as the upper external electrodes 31, 41, and the solder 60 is raised on the upper external electrodes 31, 41 as shown by oblique lines in the figure.
【０００４】[0004]
【発明が解決しようとする課題】このような半田付けが
なされると、当該半田付部分が外気などの温度差、特に
自動車産業で要求される「温度サイクル試験」（チップ
抵抗器などのチップ部品を、例えば−５０℃程度で１５
〜３０分間保持した後、１５０℃程度まで昇温して同様
に１５〜３０分間保持するサイクルを約１０００回繰り
返す試験）を受けた場合、半田付部分の温度差による膨
張・収縮が大きいために、上面外部電極３１，４１に引
張り応力が発生し、当該電極の内部から亀裂が生じた
り、電極が剥離したり、或いはアルミナ基板２０が割れ
ることがある。特に、これらの損傷が著しいと、例えば
上面外部電極３１，４１を縦断する亀裂が生起して当該
電極が分離された場合や、電極３１，４１が剥がれて抵
抗体膜との接触が断たれた場合には、断線不良を来すこ
とになる。When such soldering is performed, a temperature difference between the soldered portion and the outside air, particularly a "temperature cycle test" (a chip component such as a chip resistor) required in the automobile industry. At -50 ° C. for 15
After holding for about 30 minutes, the temperature is raised to about 150 ° C. and the cycle of holding for about 15 to 30 minutes is also repeated about 1000 times). Then, a tensile stress is generated in the upper external electrodes 31 and 41, and a crack may be generated from the inside of the electrodes, the electrodes may be separated, or the alumina substrate 20 may be broken. In particular, when these damages are remarkable, for example, cracks that traverse the upper surface external electrodes 31 and 41 occur and the electrodes are separated, or the electrodes 31 and 41 are peeled off and the contact with the resistor film is cut off. In this case, a disconnection failure occurs.
【０００５】上記応力発生のメカニズムについて図５を
参照しながらもう少し詳しく説明する。アルミナ基板２
０上に設けた抵抗体膜２１と左側の上面外部電極４１と
は相互の端部で重合状態で接続されており、この接続部
を含む抵抗体膜２１全体及び電極４１の一部が保護膜２
２で被覆されている。なお、電極４１上には半田喰れ防
止のためのＮｉメッキ膜８０が形成されている。ここで
電極４１上に更にＳｎ／Ｐｂメッキ膜及び半田８１を施
して半田付けを終了した後に当該半田付部分に温度差が
生じると、金属部分８０，８１には矢印イ方向の引張り
応力が、ガラス性の保護膜２２には矢印ロ方向の引張り
応力がそれぞれ発生する。一般に、金属の膨張・収縮率
はガラスのそれよりも大きいため、電極４１には両応力
イ、ロの差により矢印ハ方向の「ズレ応力」が生起す
る。この「ズレ応力」によって前述の問題点が引く起こ
る訳である。The mechanism of the above-mentioned stress generation will be described in more detail with reference to FIG. Alumina substrate 2
The resistor film 21 provided on the upper side and the left upper surface external electrode 41 are connected in a superposed state at their mutual ends, and the entire resistor film 21 including this connection portion and a part of the electrode 41 are formed of a protective film. 2
2 coated. Note that a Ni plating film 80 for preventing solder erosion is formed on the electrode 41. Here, if a temperature difference occurs in the soldered portion after the Sn / Pb plating film and the solder 81 are further applied on the electrode 41 and the soldering is completed, the tensile stress in the direction of arrow A is applied to the metal portions 80 and 81, A tensile stress in the direction of arrow B is generated in the glassy protective film 22. In general, since the expansion and contraction rate of metal is greater than that of glass, a "deviation stress" in the direction of arrow C occurs in the electrode 41 due to the difference between the two stresses a and b. This "displacement stress" causes the problem described above.
【０００６】この種の問題は、上記角形チップ固定抵抗
器に限らず、積層チップコンデンサなどの角形チップ部
品全般に相当する。これは、チップ抵抗器の如きチップ
部品には厳しい信頼性が要求されることからすると甚だ
好ましくない。従って、本発明の目的は、上記従来の角
形チップ固定抵抗器を始めとする種々の角形チップ状電
子部品の半田付けで生じていた不都合な点を解消するこ
とにある。[0006] This kind of problem is not limited to the above-mentioned square chip fixed resistors, but also applies to all square chip components such as multilayer chip capacitors. This is extremely undesirable because strict reliability is required for chip components such as chip resistors. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to eliminate disadvantages caused by soldering various rectangular chip-shaped electronic components including the above-described conventional rectangular chip fixed resistors.
【０００７】[0007]
【課題を解決するための手段】前記目的を達成するため
に、本発明の角形チップ状電子部品は、角形チップ状電
子部品の対向両側に端子電極を設け、端子電極のうちチ
ップの上面に形成される一方の上面電極に一端部を接触
させると共に他方の上面電極に他端部を接触させて１つ
の抵抗体膜を設け、上面電極の端縁寄りの部分が露出す
る態様でチップ上面及び上面電極上に保護膜を設けたも
のにおいて、前記上面電極の横断方向における保護膜の
長さ（ｌ）が前記横断方向におけるチップ上面の長さ
（Ｌ）の９０％以上であることを特徴とする。In order to achieve the above object, a rectangular chip-shaped electronic component according to the present invention is provided with terminal electrodes on opposite sides of the rectangular chip-shaped electronic component, and formed on the upper surface of the chip among the terminal electrodes. The chip upper surface and the upper surface are formed in such a manner that one end is brought into contact with one upper surface electrode and the other end is brought into contact with the other upper surface electrode to provide one resistor film, and a portion near the edge of the upper surface electrode is exposed. In the case where a protective film is provided on an electrode, a length (l) of the protective film in a transverse direction of the upper surface electrode is 90% or more of a length (L) of a chip upper surface in the transverse direction. .
【０００８】この電子部品では、１つの抵抗体膜の一端
部が一方の上面電極に接触し、他端部が他方の上面電極
に接触すると共に、上面電極の横断方向における保護膜
の長さ（ｌ）が同横断方向におけるチップ上面の長さ
（Ｌ）の９０％以上であるので、上面電極の殆どが保護
膜によって覆われ、金属部分である半田付部分とガラス
性保護膜との膨張・収縮率の差異が実質上無くなるた
め、前記図５に基づいて説明した「ズレ応力」が上面電
極に発生しなくなる。この結果、上面電極の亀裂や剥
離、アルミナ基板の割れ、及びこれらに起因する断線不
良などの問題は殆ど皆無になる。In this electronic component, one end of one resistor film is in contact with one upper electrode, the other end is in contact with the other upper electrode, and the length of the protective film in the transverse direction of the upper electrode ( Since 1) is 90% or more of the length (L) of the upper surface of the chip in the transverse direction, most of the upper surface electrodes are covered with the protective film, and the expansion of the soldered portion, which is a metal portion, and the vitreous protective film. Since the difference in the shrinkage rate is substantially eliminated, the “deviation stress” described with reference to FIG. 5 does not occur on the upper surface electrode. As a result, there are almost no problems such as cracking or peeling of the upper electrode, cracking of the alumina substrate, and disconnection failure caused by these.
【０００９】本発明のチップ状電子部品では、チップの
両側の上面電極の横断方向における保護膜の長さｌが当
該方向におけるチップ部品上面の長さＬの９０％以上で
あれば、所期の目的を充分に達成できるが、好ましくは
図１に示す如くｌ＝Ｌの場合である。この場合は、チッ
プ両側の上面電極はチップ部品の各々の端縁に露出しな
いことになる。In the chip-shaped electronic component of the present invention, if the length l of the protective film in the transverse direction of the upper surface electrode on both sides of the chip is 90% or more of the length L of the upper surface of the chip component in the direction, the expected value is obtained. Although the object can be sufficiently achieved, it is preferable that l = L as shown in FIG. In this case, the upper electrodes on both sides of the chip are not exposed at the respective edges of the chip component.
【００１０】又、保護膜の幅（前記横断方向に垂直な方
向における長さ）は、その長さｌと同様にチップ部品上
面の幅（前記横断方向に垂直な方向における長さ）と敢
えて同一にする必要はなく、チップ部品の基板への実装
作業の容易性などを考慮すると従来と同様でよい。な
お、本発明においていうチップ状電子部品は、既記から
理解されるように、チップの対向両側に端子電極を設
け、端子電極のうちチップの上面に在る上面電極のチッ
プ端縁寄りの部分が露出する態様で上面電極上に保護膜
を設けたものを指し、具体例として角形チップ固定抵抗
器、積層チップコンデンサなどが列挙される。The width of the protective film (the length in the direction perpendicular to the transverse direction) is the same as the length 1 thereof, and is the same as the width of the upper surface of the chip component (the length in the direction perpendicular to the transverse direction). It is not necessary to use the conventional method, considering the easiness of mounting the chip components on the substrate. As understood from the above description, the chip-shaped electronic component in the present invention is provided with terminal electrodes on opposite sides of the chip, and a portion of the terminal electrodes near the chip edge of the upper surface electrode on the upper surface of the chip. Indicates a state in which a protective film is provided on the upper electrode in such a manner as to expose a rectangular chip fixed resistor, a multilayer chip capacitor and the like as specific examples.
【００１１】[0011]
【発明の実施の形態】以下、本発明を実施形態に基づい
て詳説する。但し、下記の実施形態では角形チップ状電
子部品の代表例として角形チップ固定抵抗器に関して説
明する。図１はその一実施形態に係る抵抗器の斜視図
（メッキ膜１７，１７′及びメッキ膜１８，１８′は除
く）を、図２は図１の線Ａ−Ａにおける断面図を示す。
アルミナ基板１上には順に１つの抵抗体膜２、抵抗体膜
２を覆う内部保護膜３、更に内部保護膜３を覆う別の内
部保護膜４が設けられている。なお、抵抗体膜２のほぼ
中央にはレーザトリミング溝５が形成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments. However, in the following embodiment, a square chip fixed resistor will be described as a typical example of a square chip electronic component. FIG. 1 is a perspective view (excluding the plating films 17, 17 'and the plating films 18, 18') of the resistor according to the embodiment, and FIG. 2 is a cross-sectional view taken along line AA in FIG.
On the alumina substrate 1, one resistor film 2, an internal protection film 3 covering the resistor film 2, and another internal protection film 4 covering the internal protection film 3 are sequentially provided. Note that a laser trimming groove 5 is formed substantially at the center of the resistor film 2.
【００１２】又、基板１の対向両側には、それぞれ端子
電極１９，１９′が設けられ、端子電極１９，１９′
は、例えばＡｇ／Ｐｄ系導電性ペーストとＡｇ系導電性
ペーストとからなる上面電極１０，１０′と、上面電極
１０，１０′に電気的に接続したＡｇ系導電性ペースト
などからなる側面電極１１，１１′と、側面電極１１，
１１′上に形成された半田喰れ防止のためのＮｉメッキ
膜１７，１７′と、更にＮｉメッキ膜１７，１７′上に
形成されたＳｎ／Ｐｂメッキ膜１８，１８′とで構成さ
れる。側面電極１１，１１′は、基板１の下面において
下面電極１２，１２′を形成している。Further, terminal electrodes 19 and 19 'are provided on both sides of the substrate 1 facing each other, and the terminal electrodes 19 and 19' are provided.
Are, for example, upper electrodes 10, 10 'made of an Ag / Pd-based conductive paste and an Ag-based conductive paste, and side electrodes 11 made of an Ag-based conductive paste electrically connected to the upper electrodes 10, 10'. , 11 'and the side electrodes 11,
It is composed of Ni plating films 17 and 17 'formed on 11' for preventing solder erosion, and Sn / Pb plating films 18 and 18 'formed on Ni plating films 17 and 17'. . The side electrodes 11, 11 'form lower electrodes 12, 12' on the lower surface of the substrate 1.
【００１３】更に、この実施形態では、１つの抵抗体膜
２の一端部が上面電極１０に接触し、他端部が上面電極
１０′に接触すると共に、外部保護膜６が内部保護膜４
と上面電極１０，１０′の殆どを被覆している。即ち、
上面電極１０，１０′の横断方向における保護膜６の長
さｌは、当該方向における抵抗器（基板１）上面の長さ
Ｌに等しく（ｌ＝Ｌ）、上面電極１０，１０′は保護膜
６によって完全に覆われた態様のものである（図１参
照）。なお、保護膜６の幅（前記横断方向に垂直な方向
における長さ）は従来と同様に抵抗器上面の幅（前記横
断方向に垂直な方向における長さ）よりも狭小であり、
前記横断方向における端縁部から内部保護膜４が現出し
ている。Further, in this embodiment, one end of one resistor film 2 is in contact with the upper electrode 10, the other end is in contact with the upper electrode 10 ', and the external protective film 6 is in contact with the internal protective film 4.
And almost all of the upper electrodes 10, 10 '. That is,
The length l of the protective film 6 in the transverse direction of the upper electrodes 10 and 10 'is equal to the length L of the upper surface of the resistor (substrate 1) in the direction (l = L), and the upper electrodes 10 and 10' are the protective films. 6 (see FIG. 1). Note that the width of the protective film 6 (the length in the direction perpendicular to the transverse direction) is smaller than the width of the upper surface of the resistor (the length in the direction perpendicular to the transverse direction) as in the related art.
The internal protective film 4 is exposed from the edge in the transverse direction.
【００１４】このような抵抗器を、図４に示した如く、
ガラスエポキシ基板７０に実装して半田付けした場合、
上面電極１０，１０′がガラス性外部保護膜６によって
覆われているため、半田が金属性の上面電極１０，１
０′上には付着せず、同じ金属性の側面電極１１，１
１′と下面電極１２，１２′のみが半田付けされ、従来
のように上面電極まで半田が多量に付くようなことがな
くなる。この結果、上面電極１０，１０′に温度差によ
る「ズレ応力」が発生するようなことは殆ど無くなり、
上面電極の亀裂や剥離などの発生を回避できる。Such a resistor is, as shown in FIG.
When mounted on a glass epoxy board 70 and soldered,
Since the upper electrodes 10, 10 'are covered with the glassy outer protective film 6, the upper electrodes 10, 1' made of metallic material are soldered.
0 'is not adhered, and the same metal side electrodes 11, 1
Only the 1 'and the lower electrodes 12, 12' are soldered, so that a large amount of solder does not adhere to the upper electrode as in the prior art. As a result, the occurrence of "deviation stress" due to the temperature difference between the upper electrodes 10, 10 'is almost eliminated.
The occurrence of cracks, peeling, and the like of the upper electrode can be avoided.
【００１５】[0015]
【発明の効果】本発明の角形チップ状電子部品は、以上
説明したように構成されているので、上面電極には半田
が付着せず、上面電極に「ズレ応力」は発生し難い。故
に、「ズレ応力」に起因する上面電極の亀裂や剥離、基
板の割れ、これらによって起こる電極の断線不良を防止
できる。As described above, since the rectangular chip-shaped electronic component of the present invention is configured as described above, no solder adheres to the upper surface electrode and "deviation stress" hardly occurs on the upper surface electrode. Therefore, it is possible to prevent cracks and peeling of the upper electrode, cracks of the substrate, and disconnection failure of the electrode caused by these, due to “deviation stress”.
【００１６】特に、外気の寒暖差の大きい場所への適用
に関して、自動車産業で要求される「温度サイクル」試
験によっても半田付部分における膨張・収縮の機械的応
力の発生は極少である。従って、本発明のチップ部品は
極めて信頼性の高いものである。In particular, with respect to application to a place where the temperature difference between the outside air and the temperature is large, the generation of mechanical stress due to expansion and contraction in the soldered portion is very small even in a "temperature cycle" test required in the automobile industry. Therefore, the chip component of the present invention is extremely reliable.
【図１】本発明のチップ状電子部品の代表例としてのチ
ップ抵抗器を示す斜視図である。FIG. 1 is a perspective view showing a chip resistor as a typical example of a chip-shaped electronic component of the present invention.
【図２】図１に示す抵抗器の線Ａ−Ａにおける断面図で
ある。FIG. 2 is a cross-sectional view of the resistor shown in FIG. 1 taken along line AA.
【図３】従来の一般的なチップ抵抗器を示す斜視図であ
る。FIG. 3 is a perspective view showing a conventional general chip resistor.
【図４】図３に示す如き従来の抵抗器を基板上に半田付
けした時の状態を示す断面図である。FIG. 4 is a sectional view showing a state when the conventional resistor as shown in FIG. 3 is soldered on a substrate.
【図５】従来技術において上面電極に「ズレ応力」が発
生する仕組みを説明するための説明図である。FIG. 5 is an explanatory diagram for explaining a mechanism in which “displacement stress” occurs in an upper electrode in a conventional technique.
１ アルミナ基板 ２ 抵抗体膜 ３，４ 内部保護膜 ６ 外部保護膜 １０，１０′ 上面電極 １１，１１′ 側面電極 １２，１２′ 下面電極 １９，１９′ 端子電極 DESCRIPTION OF SYMBOLS 1 Alumina substrate 2 Resistor film 3, 4 Internal protective film 6 External protective film 10, 10 'Upper surface electrode 11, 11' Side surface electrode 12, 12 'Lower surface electrode 19, 19' Terminal electrode
Claims (1)
極を設け、端子電極のうちチップの上面に形成される一
方の上面電極に一端部を接触させると共に他方の上面電
極に他端部を接触させて１つの抵抗体膜を設け、上面電
極の端縁寄りの部分が露出する態様でチップ上面及び上
面電極上に保護膜を設けた角形チップ状電子部品におい
て、 前記上面電極の横断方向における保護膜の長さ（ｌ）が
前記横断方向におけるチップ上面の長さ（Ｌ）の９０％
以上であることを特徴とする角形チップ状電子部品。A terminal electrode is provided on both sides of a rectangular chip-shaped electronic component, one end of which is in contact with one of the upper electrodes formed on the upper surface of the chip, and the other is connected with the other upper electrode. A rectangular chip-shaped electronic component in which a protective film is provided on the upper surface of the chip and on the upper electrode in such a manner that one resistor film is provided in contact therewith and a portion near the edge of the upper electrode is exposed; The length (l) of the protective film is 90% of the length (L) of the chip upper surface in the transverse direction.
A rectangular chip-shaped electronic component characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9299983A JP2963420B2 (en) | 1997-10-31 | 1997-10-31 | Square chip electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9299983A JP2963420B2 (en) | 1997-10-31 | 1997-10-31 | Square chip electronic components |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03021728A Division JP3127437B2 (en) | 1991-01-21 | 1991-01-21 | Square chip electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10135003A true JPH10135003A (en) | 1998-05-22 |
| JP2963420B2 JP2963420B2 (en) | 1999-10-18 |
Family
ID=17879341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9299983A Expired - Fee Related JP2963420B2 (en) | 1997-10-31 | 1997-10-31 | Square chip electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2963420B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020013804A (en) * | 2018-07-13 | 2020-01-23 | パナソニックＩｐマネジメント株式会社 | Chip resistor |
-
1997
- 1997-10-31 JP JP9299983A patent/JP2963420B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020013804A (en) * | 2018-07-13 | 2020-01-23 | パナソニックＩｐマネジメント株式会社 | Chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2963420B2 (en) | 1999-10-18 |
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| LAPS | Cancellation because of no payment of annual fees |