JPH05243078A - Chip type laminar ceramic capacitor and manufacture thereof - Google Patents

Chip type laminar ceramic capacitor and manufacture thereof

Info

Publication number
JPH05243078A
JPH05243078A JP7820692A JP7820692A JPH05243078A JP H05243078 A JPH05243078 A JP H05243078A JP 7820692 A JP7820692 A JP 7820692A JP 7820692 A JP7820692 A JP 7820692A JP H05243078 A JPH05243078 A JP H05243078A
Authority
JP
Japan
Prior art keywords
ceramic capacitor
chip type
paste
solder
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7820692A
Other languages
Japanese (ja)
Inventor
Shigeaki Niiyama
重秋 新山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP7820692A priority Critical patent/JPH05243078A/en
Publication of JPH05243078A publication Critical patent/JPH05243078A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

PURPOSE:To obtain a chip type laminar ceramic capacitor that can be manufactured without substantial thermal stress applied. CONSTITUTION:To both the end parts of a chip type laminar ceramic capacitor element, a paste made of silver including glass, etc., is applied, and it is dried, and further, it is sintered. Thereafter, a glass paste, which is obtained by removing metals of silver, etc., from the foregoing paste, is applied to the middle parts of both the end parts of the laminar capacitor element in the form of bands which are parallel with the respective long edges of the laminar capacitor element. Then, the glass paste is dried, and it is sintered at the temperature lower than the foregoing silver paste, to form glass layers 4, which are not wettable with solder. When this chip type laminar ceramic capacitor is soldered to a board, solder 3 does not adhere to the upper layers including the glass layers 4. Therefore, the amount of solder applied decreases, and the thermal stress to the chip type laminar ceramic capacitor by the fused solders can be limited to a small value.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、チップ形積層セラミッ
クコンデンサおよびその製造方法に関し、特に、その外
部電極部の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type multilayer ceramic capacitor and a method for manufacturing the same, and more particularly to the structure of its external electrode portion.

【０００２】[0002]

【従来の技術】図４は、従来のチップ形積層セラミック
コンデンサを基板にハンダ溶着した斜視図を示してい
る。ハンダ３がチップ形積層セラミックコンデンサの外
部電極２の全面を厚く被覆していることを示している。
１は焼成セラミックチップである。2. Description of the Related Art FIG. 4 is a perspective view of a conventional chip type monolithic ceramic capacitor soldered to a substrate. It shows that the solder 3 thickly covers the entire surface of the external electrode 2 of the chip type monolithic ceramic capacitor.
Reference numeral 1 is a fired ceramic chip.

【０００３】一般に、この種の従来のチップ形積層セラ
ミックコンデンサは、図７に示すように誘電体グリーン
シート５の表面に内部電極６を印刷し、これを互に逆方
向に複数枚積み重ね、熱加圧し一体化した後、焼成して
図８に示すようにチップの両端部７に、内部電極６の端
面６ａが露出した焼成セラミックチップ１を作る。Generally, in this type of conventional chip type monolithic ceramic capacitor, internal electrodes 6 are printed on the surface of a dielectric green sheet 5, as shown in FIG. After pressurization and integration, firing is performed to produce a fired ceramic chip 1 in which the end faces 6a of the internal electrodes 6 are exposed at both ends 7 of the chip as shown in FIG.

【０００４】次に図５，図６に示すように、焼成セラミ
ックチップ１の両端部７に外部電極材料として、バイン
ダ材と溶剤とガラスフリットと銀等の金属粒とを含有す
るペーストを塗布・乾燥・焼成して厚さ約１００ミクロ
ンの外部電極２を形成していた。Next, as shown in FIGS. 5 and 6, a paste containing a binder material, a solvent, glass frit, and metal particles such as silver is applied to both ends 7 of the fired ceramic chip 1 as external electrode materials. The external electrode 2 having a thickness of about 100 μm was formed by drying and firing.

【０００５】[0005]

【発明が解決しようとする課題】しかし、この従来のチ
ップ形積層セラミックコンデンサを基板に搭載し、ハン
ダ溶着をさせた場合、外部電極の良好なハンダ付性のた
め、ハンダ表面張力と塗れ性により、図４のように外部
電極全体をハンダ３が被覆して、基板と外部電極との間
にハンダが付き過ぎることとなった。However, when this conventional chip-type monolithic ceramic capacitor is mounted on a substrate and soldered, the external electrodes have good solderability, so that solder surface tension and wettability As shown in FIG. 4, the entire external electrode was covered with the solder 3, and too much solder was attached between the substrate and the external electrode.

【０００６】このため、チップ形積層セラミックコンデ
ンサは、基板とハンダによる大きな熱ストレスを受け、
割れたり、ヒビが入ったり、性能低下を招く等の問題が
生じ、ハンダ付着後の外観検査，特性チェック、あるい
は手直し等が必要となっていた。Therefore, the chip-type monolithic ceramic capacitor receives a large thermal stress due to the substrate and solder,
Problems such as cracking, cracking, and deterioration of performance have arisen, and it is necessary to perform visual inspection after solder adhesion, characteristic check, or rework.

【０００７】本発明の目的は、大きな熱ストレスを受け
るのを防止したチップ形積層セラミックコンデンサ及び
その製造方法を提供することにある。An object of the present invention is to provide a chip type monolithic ceramic capacitor which is prevented from receiving a large thermal stress and a method for manufacturing the same.

【０００８】[0008]

【課題を解決するための手段】前記目的を達成するた
め、本発明に係るチップ形積層セラミックコンデンサ
は、チップ形積層セラミックコンデンサ素子両端の外部
電極部の長辺方向に平行な中央部に、帯状にハンダが付
着しない部位を有するものである。In order to achieve the above-mentioned object, a chip type monolithic ceramic capacitor according to the present invention is provided with a strip shape in the central portion parallel to the long side direction of the external electrode parts at both ends of the chip type monolithic ceramic capacitor element. It has a part where solder does not adhere to.

【０００９】また、本発明に係るチップ形積層セラミッ
クコンデンサの製造方法は、チップ形積層セラミックコ
ンデンサ素子両端部に、ガラスを含む銀等のペーストを
塗布・乾燥し、焼結した後、前記ペーストから銀等の金
属を除いたペーストを素子両端部の各長辺方向に平行な
中央部に帯状に塗布・乾燥し、前記より低い温度で焼結
するものである。Further, in the method of manufacturing a chip type monolithic ceramic capacitor according to the present invention, a paste of silver or the like containing glass is applied to both ends of the chip type monolithic ceramic capacitor element, dried and sintered, and then the paste is removed from the paste. A paste excluding a metal such as silver is applied in a strip shape on the central portions of both ends of the element parallel to the long side directions, dried, and sintered at a temperature lower than the above.

【００１０】[0010]

【作用】チップ形積層セラミックコンデンサの両端の外
部電極の長辺方向に平行な中央部に帯状にハンダが付着
しない部位を有しており、これにより熱ストレスを最小
限とする。The chip-type monolithic ceramic capacitor has strip-shaped solder-free portions at the central portions of the external electrodes at both ends parallel to the long side direction, thereby minimizing thermal stress.

【００１１】[0011]

【実施例】以下、本発明の実施例を図１〜図３を参照し
ながら説明する。Embodiments of the present invention will be described below with reference to FIGS.

【００１２】図７および図８に示すように、誘電体グリ
ーンシート５の表面に内部電極６を印刷し、これを互に
逆方向に複数枚積み重ねて熱加圧し、一体化した後、焼
成して図８のようなチップの両端部７に内部電極６の端
面６ａが露出した焼成セラミックチップ１を作る。As shown in FIGS. 7 and 8, the internal electrodes 6 are printed on the surface of the dielectric green sheet 5, and a plurality of the internal electrodes 6 are stacked in the opposite directions, heat-pressed, integrated, and fired. As shown in FIG. 8, a fired ceramic chip 1 in which the end surfaces 6a of the internal electrodes 6 are exposed at both ends 7 of the chip is produced.

【００１３】次に図２，図３に示すように、この両端部
７に、バインダ材と溶剤とガラスフリットと銀等の金属
粒とを含有するペーストを厚さ約１５０ミクロンを塗布
・乾燥した後、最高温度８３０〜８６０℃で１０〜１５
分間保持して、約１００ミクロン厚の外部電極２を形成
する。Next, as shown in FIGS. 2 and 3, a paste containing a binder material, a solvent, glass frit, and metal particles such as silver is applied to both ends 7 to a thickness of about 150 μm and dried. After that, 10-15 at the maximum temperature of 830-860 ℃
The external electrode 2 having a thickness of about 100 μm is formed by holding it for a minute.

【００１４】次に、前記ペースト材の中から銀等の金属
粒を除いた成分からなるペーストを、両端部の各長辺方
向に平行な中央部に帯状に一定幅で約５０ミクロン塗布
・乾燥し、前記温度より５０℃程低い最高温度で１０〜
１５分間保持して、約３０ミクロン厚のガラス質からな
るハンダが付着しないガラス帯４をもった外部電極を得
る。Next, a paste consisting of a component excluding metal particles such as silver from the paste material is applied in a belt-like shape at a constant width of about 50 μm on the central portions parallel to the long side directions of both ends and dried. 10 to 10 at a maximum temperature lower than the above temperature by about 50 ° C.
After holding for 15 minutes, an external electrode having a glass band 4 having a thickness of about 30 μm and made of a vitreous solder to which the solder does not adhere is obtained.

【００１５】なお、本発明実施例は、チップ形積層セラ
ミックコンデンサについて説明しているが、同様なチッ
プ形電子部品であれば、すべて適用可能であることは、
言うまでもない。Although the embodiments of the present invention describe the chip-type monolithic ceramic capacitor, any similar chip-type electronic component is applicable.
Needless to say.

【００１６】[0016]

【発明の効果】以上説明したように本発明によれば、チ
ップ形積層セラミックコンデンサを基板に搭載し、ハン
ダ溶着をさせた場合、外部電極の良好なハンダ付性のた
め、ハンダ表面張力と塗れ性により、ハンダがチップ厚
み方向に上昇してくるが、図１に示すようにハンダが付
着しないガラス帯４の手前で上昇は止まる。As described above, according to the present invention, when a chip type monolithic ceramic capacitor is mounted on a substrate and soldered, solder surface tension and coating can be applied due to good solderability of external electrodes. Due to the property, the solder rises in the thickness direction of the chip, but as shown in FIG. 1, the rise stops before the glass strip 4 to which the solder does not adhere.

【００１７】この結果、基板と外部電極間のハンダ量は
少なく、しかも一定量になる。このため、チップ形積層
セラミックコンデンサは、基板とハンダによる小さな熱
ストレスしか受けないため、割れたり、ヒビが入った
り、性能低下を招く等の問題がなくなり、ハンダ付後の
外観検査，特性チェックあるいは手直し等の必要がなく
なる。As a result, the amount of solder between the substrate and the external electrode is small, and the amount is constant. Therefore, the chip-type monolithic ceramic capacitor receives only a small amount of thermal stress due to the board and solder, and therefore there are no problems such as cracking, cracking, performance deterioration, etc., and appearance inspection after soldering, characteristic check or There is no need for rework.

【００１８】しかも、チップ形積層セラミックコンデン
サの特徴である上，下，左右対称を崩していないため、
方向性がなく、自動実装の障害を生じないので、工業用
価値は大である。Moreover, since the top, bottom and left-right symmetry which are the characteristics of the chip type monolithic ceramic capacitor are not broken,
It has great industrial value because it has no direction and does not cause obstacles for automatic mounting.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明に係るチップ形積層セラミックコンデン
サを基板にハンダ溶着した状態を示す斜視図である。FIG. 1 is a perspective view showing a state in which a chip type monolithic ceramic capacitor according to the present invention is solder-welded to a substrate.

【図２】本発明に係るチップ形積層セラミックコンデン
サを示すもので、（ａ）は上面図、（ｂ）は正面図、
（ｃ）は側面図である。2A and 2B show a chip type monolithic ceramic capacitor according to the present invention, in which FIG. 2A is a top view and FIG. 2B is a front view.
(C) is a side view.

【図３】本発明に係るチップ形積層セラミックコンデン
サを示す断面図である。FIG. 3 is a sectional view showing a chip type monolithic ceramic capacitor according to the present invention.

【図４】従来のチップ形積層セラミックコンデンサを基
板にハンダ溶着した状態を示す斜視図である。FIG. 4 is a perspective view showing a state in which a conventional chip type monolithic ceramic capacitor is solder-welded to a substrate.

【図５】従来のチップ形積層セラミックコンデンサを示
すもので、（ａ）は上面図、（ｂ）は正面図、（ｃ）は
側面図である。5A and 5B show a conventional chip type monolithic ceramic capacitor, in which FIG. 5A is a top view, FIG. 5B is a front view, and FIG. 5C is a side view.

【図６】従来のチップ形積層セラミックコンデンサを示
す断面図である。FIG. 6 is a cross-sectional view showing a conventional chip type monolithic ceramic capacitor.

【図７】内部電極を印刷した誘電体グリーンシートの斜
視図である。FIG. 7 is a perspective view of a dielectric green sheet on which internal electrodes are printed.

【図８】焼成セラミックチップを示す斜視図である。FIG. 8 is a perspective view showing a fired ceramic chip.

【符号の説明】[Explanation of symbols]

１ 焼成セラミックチップ ２ 外部電極 ３ 溶着ハンダ ４ ハンダが付着しないガラス帯 ５ 誘電体グリーンシート ６ 内部電極 ６ａ 内部電極の端面 ７ 焼成セラミックチップの両端面 1 Firing Ceramic Chip 2 External Electrode 3 Welding Solder 4 Glass Band Where Solder Does Not Attach 5 Dielectric Green Sheet 6 Internal Electrode 6a End Face of Internal Electrode 7 Both Ends of Firing Ceramic Chip

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 チップ形積層セラミックコンデンサ素子
両端の外部電極部の長辺方向に平行な中央部に、帯状に
ハンダが付着しない部位を有することを特徴とするチッ
プ形積層セラミックコンデンサ。1. A chip type monolithic ceramic capacitor having a strip-shaped portion to which solder does not adhere in a central portion parallel to the long side direction of the external electrode portions at both ends of the chip type monolithic ceramic capacitor element. 【請求項２】 チップ形積層セラミックコンデンサ素子
両端部に、ガラスを含む銀等のペーストを塗布・乾燥
し、焼結した後、前記ペーストから銀等の金属を除いた
ペーストを素子両端部の各長辺方向に平行な中央部に帯
状に塗布・乾燥し、前記より低い温度で焼結することを
特徴とするチップ形積層セラミックコンデンサの製造方
法。2. A chip-type monolithic ceramic capacitor element is coated on both ends thereof with a paste of silver or the like containing glass, dried and sintered, and then a paste obtained by removing a metal such as silver from the paste is applied to both ends of the element. A method for producing a chip-type monolithic ceramic capacitor, which comprises coating and drying in a strip shape at a central portion parallel to the long side direction and sintering at a lower temperature than the above.
JP7820692A 1992-02-28 1992-02-28 Chip type laminar ceramic capacitor and manufacture thereof Pending JPH05243078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7820692A JPH05243078A (en) 1992-02-28 1992-02-28 Chip type laminar ceramic capacitor and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7820692A JPH05243078A (en) 1992-02-28 1992-02-28 Chip type laminar ceramic capacitor and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH05243078A true JPH05243078A (en) 1993-09-21

Family

ID=13655563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7820692A Pending JPH05243078A (en) 1992-02-28 1992-02-28 Chip type laminar ceramic capacitor and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH05243078A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338177A1 (en) * 1982-10-21 1984-04-26 Nihon Plast Co., Ltd., Fuji, Shizuoka MULTI-STAGE ADJUSTER
KR100972874B1 (en) * 2005-03-31 2010-07-28 인텔 코포레이션 Itfc with optimized ct
JP2013235928A (en) * 2012-05-08 2013-11-21 Murata Mfg Co Ltd Ceramic electronic component and electronic device
JP2015065284A (en) * 2013-09-25 2015-04-09 株式会社村田製作所 Electronic component and manufacturing method thereof
JP2015065283A (en) * 2013-09-25 2015-04-09 株式会社村田製作所 Electronic component and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338177A1 (en) * 1982-10-21 1984-04-26 Nihon Plast Co., Ltd., Fuji, Shizuoka MULTI-STAGE ADJUSTER
KR100972874B1 (en) * 2005-03-31 2010-07-28 인텔 코포레이션 Itfc with optimized ct
JP2013235928A (en) * 2012-05-08 2013-11-21 Murata Mfg Co Ltd Ceramic electronic component and electronic device
JP2015065284A (en) * 2013-09-25 2015-04-09 株式会社村田製作所 Electronic component and manufacturing method thereof
JP2015065283A (en) * 2013-09-25 2015-04-09 株式会社村田製作所 Electronic component and manufacturing method thereof

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