JPS57126108A - Mounting method for coil - Google Patents
Mounting method for coilInfo
- Publication number
- JPS57126108A JPS57126108A JP1153181A JP1153181A JPS57126108A JP S57126108 A JPS57126108 A JP S57126108A JP 1153181 A JP1153181 A JP 1153181A JP 1153181 A JP1153181 A JP 1153181A JP S57126108 A JPS57126108 A JP S57126108A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- group
- wiring board
- printed wiring
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coils Or Transformers For Communication (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To mount a coil to a printed wiring board by forming the coil used for an electronic circuit of a tuner, etc. by using a polyamide group or polyureamide group film wire and soldering the coil at a specified temperature by employing flux. CONSTITUTION:The polyamide group or polyureamide group film wire is molded to the predetermined coil 11. The rosin group or synthetic rosin group flux used at the time of the soldering of the normal printed wiring board is applied to the lead section of the coil 11, and the lead section is loaded at the prescribed position of the printed wiring board, and soldered at the temperature of approximately 200-300 deg.C. Accordingly, the lead section of the coil 11 is soldered directly to the printed wiring board for 10sec or shorter at said temperature without conducting preparatory solder treatment or the removal of the film by using the predetermined flux, and can be mounted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1153181A JPS57126108A (en) | 1981-01-30 | 1981-01-30 | Mounting method for coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1153181A JPS57126108A (en) | 1981-01-30 | 1981-01-30 | Mounting method for coil |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57126108A true JPS57126108A (en) | 1982-08-05 |
Family
ID=11780543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1153181A Pending JPS57126108A (en) | 1981-01-30 | 1981-01-30 | Mounting method for coil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57126108A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61164297A (en) * | 1985-01-17 | 1986-07-24 | 東芝ケミカル株式会社 | Manufacture of electronic component |
-
1981
- 1981-01-30 JP JP1153181A patent/JPS57126108A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61164297A (en) * | 1985-01-17 | 1986-07-24 | 東芝ケミカル株式会社 | Manufacture of electronic component |
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