JPS6425499A - Mounting of electronic component - Google Patents

Mounting of electronic component

Info

Publication number
JPS6425499A
JPS6425499A JP18176287A JP18176287A JPS6425499A JP S6425499 A JPS6425499 A JP S6425499A JP 18176287 A JP18176287 A JP 18176287A JP 18176287 A JP18176287 A JP 18176287A JP S6425499 A JPS6425499 A JP S6425499A
Authority
JP
Japan
Prior art keywords
mounting
substrate
electronic component
adhesive tape
side adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18176287A
Other languages
Japanese (ja)
Inventor
Koichi Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Kyushu Ltd
Original Assignee
Tokyo Electron Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Kyushu Ltd filed Critical Tokyo Electron Kyushu Ltd
Priority to JP18176287A priority Critical patent/JPS6425499A/en
Publication of JPS6425499A publication Critical patent/JPS6425499A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To easily correct a temporarily clamped position and to prevent improper soldering by mounting electronic components on an electrically wired insulating substrate with a both-side adhesive tape. CONSTITUTION:An electronic component, such as a flat package type IC 2 of a chip component is secured with a both-side adhesive tape 3 on an electrically wired insulating substrate, such as a glass epoxy printed substrate 1, and the terminal 4 of the IC 2 is bonded to be mounted by a solder 6 to a land 5 formed on the substrate 1. According to this method, the correction of the mounting displacement can be easily corrected to be efficiently soldered.
JP18176287A 1987-07-21 1987-07-21 Mounting of electronic component Pending JPS6425499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18176287A JPS6425499A (en) 1987-07-21 1987-07-21 Mounting of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18176287A JPS6425499A (en) 1987-07-21 1987-07-21 Mounting of electronic component

Publications (1)

Publication Number Publication Date
JPS6425499A true JPS6425499A (en) 1989-01-27

Family

ID=16106442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18176287A Pending JPS6425499A (en) 1987-07-21 1987-07-21 Mounting of electronic component

Country Status (1)

Country Link
JP (1) JPS6425499A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017119114A1 (en) * 2016-01-08 2017-07-13 富士機械製造株式会社 Repair device and repair method
CN108453337A (en) * 2018-03-06 2018-08-28 奇鋐科技股份有限公司 Welding fixture and its welding method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017119114A1 (en) * 2016-01-08 2017-07-13 富士機械製造株式会社 Repair device and repair method
JPWO2017119114A1 (en) * 2016-01-08 2018-11-01 株式会社Ｆｕｊｉ Repair device and repair method
CN108453337A (en) * 2018-03-06 2018-08-28 奇鋐科技股份有限公司 Welding fixture and its welding method

Similar Documents

Publication Publication Date Title
ATE65346T1 (en) PLATED CONTACT ELEMENT.
MY115175A (en) Semiconductor chip package with enhanced thermal conductivity
KR0123032B1 (en) Electrical components mounted pcb
ES8503196A1 (en) Integrated circuit module and method of making same.
JPS5779652A (en) Resin-sealed semiconductor device
JPS5618448A (en) Composite electronic part
JPS6425499A (en) Mounting of electronic component
JPS6481330A (en) Film carrier semiconductor device
JPS6464298A (en) Hybrid integrated circuit
GB1361400A (en) Method of electrically connecting a semi-conductor chip to a substrate
JPS6442140A (en) Connection of integrated circuit
EP0303370A3 (en) Circuit board component spacer
JPS57121266A (en) Manufacture of hybrid integrated circuit
JPS631093A (en) Electronic parts mounting board device
JPS55123151A (en) Integrated circuit device
JPS6444030A (en) Semiconductor package
JPS6097656A (en) Method for mounting hybrid integrated circuit
JPS571245A (en) Integrated circuit device
JPH0378288A (en) Semiconductor device
JPH118459A (en) Mounting structure for surface-mounted component on printed wiring board
JPS57126108A (en) Mounting method for coil
EP0092019A3 (en) Improved semiconductor package
JPS63269550A (en) Semiconductor device
JPS56120147A (en) Integrated circuit package
JPH05167296A (en) Surface-mounting component positioning device of printed circuit board