JPS5841678B2 - How to attach parts to a printed circuit board - Google Patents
How to attach parts to a printed circuit boardInfo
- Publication number
- JPS5841678B2 JPS5841678B2 JP14200577A JP14200577A JPS5841678B2 JP S5841678 B2 JPS5841678 B2 JP S5841678B2 JP 14200577 A JP14200577 A JP 14200577A JP 14200577 A JP14200577 A JP 14200577A JP S5841678 B2 JPS5841678 B2 JP S5841678B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- parts
- attach parts
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、プリント基板に部品をはんだ付けして取り付
ける方法に関し、磁性体部分を有するリードレス部品を
磁力を利用して簡便な方法でプリント基板に取付けるこ
とのできる方法を提供することを目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of soldering and attaching components to a printed circuit board, and a method for attaching leadless components having magnetic parts to a printed circuit board in a simple manner using magnetic force. The purpose is to provide
一般に、抵抗やコンデンサその他のリード線のある部分
は、手または機械装置Ｏこよりプリント基板の孔にその
リード線を挿入し、それを折り曲げたりすることにより
仮固定し、その後はんだ槽にディッピングすることによ
りはんだ付けして固定するようにしていた。Generally, parts with lead wires for resistors, capacitors, etc. are temporarily fixed by inserting the lead wires into holes in the printed circuit board by hand or using a mechanical device, bending them, and then dipping them into a solder bath. They were fixed by soldering.
しかし、この場合にはリード線をプリント基板の孔に挿
入するのに高精度が要求され、また、リード線を折り曲
げるために装置が複雑になって工程のスピードがあがら
ない欠点があった。However, in this case, high precision is required to insert the lead wires into the holes in the printed circuit board, and the apparatus is complicated because the lead wires are bent, making it difficult to speed up the process.
また、リードレスのいわゆるチップ部品として従来より
用いられているものは、リード線がないために位置決め
の精度はそれほど要求されないが、その取付（ケは部品
をプリント基板におさえつけて固定した状態ではんだ付
けしたり導電性の接着剤等で固定する方法や、接着剤で
一度プリント基板に固定してから溶融はんだ槽にディッ
ピングしたりまたは炉によって加熱して取付ける方法で
行われている。In addition, since there are no lead wires for conventionally used so-called leadless chip components, positioning accuracy is not required as much. This is done by fixing by soldering or using conductive adhesive, or by first fixing it to the printed circuit board with adhesive and then dipping it into a molten solder bath or heating it in a furnace.
しかし、それらの方法は、前者はやはり工程のスピード
があがらない欠点があり、後者では生産工程が複雑にな
り、また、接着剤の取扱いのための設備が問題になると
いう欠点を有している。However, these methods have the disadvantage that the former does not speed up the process, while the latter complicates the production process and requires equipment for handling the adhesive. .
そこで本発明はかかる従来の欠点を解消して取付スピー
ドが速くしかも工程が簡単で接着剤も使用しなくてよい
取付方法を提供することを目的とするものである。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a mounting method that eliminates these conventional drawbacks and is fast in mounting speed, simple in process, and does not require the use of adhesives.
以下、本発明についてその一実施例の工程を示す図面を
参照して詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to drawings showing the steps of an embodiment thereof.
この方法では、まず第１図ａのようにプリント基板１の
表面側（箔のない側）から永久磁石や電磁石等の磁力を
発生する磁石２を部品３の取付は位置にあてる。In this method, first, as shown in FIG. 1a, a magnet 2 that generates magnetic force, such as a permanent magnet or an electromagnet, is applied from the front side (the side without foil) of the printed circuit board 1 to the position where the component 3 is to be attached.
次いで、同図すのようにプリント基板１の裏面側（箔側
）へ少ｆｉ くとも一部分に磁性体部分を有するリード
レスの部品３を供給してこれをプリント基板１をはさん
で吸引して仮止めする。Next, as shown in the figure, a leadless component 3 having at least a portion of a magnetic material portion is supplied to the back side (foil side) of the printed circuit board 1, and the leadless component 3 is sucked across the printed circuit board 1. Temporarily tighten it.
そして、その仮止状態のまま同図Ｃのようにプリント基
板１を溶融はんだ槽４にディッピングすることにより部
品を３プリント基板１の銅箔にはんだ付けして固定し、
同図ｄのようにはんだ５で部品３をプリント基板１に固
定した回路基板を完成する。Then, the printed circuit board 1 is dipped in the molten solder bath 4 as shown in FIG.
A circuit board is completed by fixing the component 3 to the printed circuit board 1 with solder 5 as shown in FIG. 4(d).
第２図は第１図Ｃの状態を拡大して示したものである。FIG. 2 is an enlarged view of the state shown in FIG. 1C.
この実施例では、剛体のプレート６に、プリント基板１
を固定するためのア：ム７と、プリント基板１の部品取
付は位置にあわせた磁石２とを固定している。In this embodiment, a printed circuit board 1 is mounted on a rigid plate 6.
An arm 7 for fixing the parts and a magnet 2 that matches the position of the printed circuit board 1 for mounting the parts are fixed.
このアーム７にプリント基板１を固定し、部品３を磁力
で所定位置に吸引させておいて、剛体のプレート６を移
動させてプリント基板１を溶融はんだ槽４にディッピン
グさせて通過させることにより部品３のはんだ付けを行
っている。The printed circuit board 1 is fixed to this arm 7, the component 3 is attracted to a predetermined position by magnetic force, and the rigid plate 6 is moved to dip the printed circuit board 1 into the molten solder bath 4 and pass it through. 3 soldering is being done.
部品３としては、通常の抵抗部品からリードのみを除去
し、両端に鉄製（はんだメッキしたもの）のキャップを
嵌め合わせたもの等を使用することができる。As the component 3, it is possible to use an ordinary resistor component with only the leads removed and iron caps (solder plated) fitted to both ends.
このような本発明の取付方法によれば、従来のように部
品のリード線をプリント基板の孔に挿入しなくでもよい
ので高精度な取り付けが必要なくて工程を簡易にするこ
とができ、またリードの折り曲げも不要で磁石を設ける
だけでよいので組立装置の簡略化がはかれるものである
。According to the mounting method of the present invention, it is not necessary to insert the lead wires of the components into the holes of the printed circuit board as in the past, so there is no need for highly accurate mounting, which simplifies the process. Since there is no need to bend the leads and only need to provide a magnet, the assembly device can be simplified.
また、部品は一点ずつの挿入ではなく同時に複数個の取
り付けが行えるので効率を向上することができるもので
ある。Furthermore, since a plurality of parts can be attached at the same time instead of being inserted one by one, efficiency can be improved.
さらに、磁石によって仮止めするので従来のように接着
剤を用いる必要がなく、工程が簡単になり、また、接着
剤の凝固の時間をとらなくてすんで瞬間的に所定の位置
に取り付けることができることとなってスピードアップ
を図ることもできる等、工業的効果は太きいものである
。Furthermore, since it is temporarily attached using a magnet, there is no need to use adhesive as in conventional methods, simplifying the process, and it can be attached to a predetermined position instantly without having to take the time for the adhesive to solidify. The industrial effects are significant, such as speeding up the process.
第１図ａ、ｂ、ｃ、ｄ七よび第２図は本発明のプリント
基板への部品取付方法を実施した一例の工程における取
付装置およびプリント基板の側面図および断側面図であ
る。
１・・・・・・プリント基板、２・・・・・・磁石、３
・・・・・・部品、４・・・・・・溶融はんだ槽、５・
・・・・・はんだ。Figures 1a, b, c, and d7 and 2 are side views and cross-sectional views of a mounting device and a printed circuit board in one example of the process of carrying out the method of mounting components on a printed circuit board according to the present invention. 1... Printed circuit board, 2... Magnet, 3
... Parts, 4 ... Molten solder bath, 5.
...Solder.
Claims (1)
の電子部品を、永久磁石または電磁石等の磁力によりプ
リン］・基板をはさんでプリント基板の箔側に吸引して
仮止めし、その仮止状態で溶融はんだ槽にディッピング
して上記プリント基板にはんだ付けすることを特徴とす
るプリント基板への部品取付方法。1. Electronic parts with leads that have a magnetic material part in at least a portion are printed using the magnetic force of a permanent magnet or an electromagnet] - Temporarily fixed by attracting it to the foil side of the printed circuit board with the board in between, and temporarily fixed it. A method for attaching components to a printed circuit board, characterized in that the components are dipped in a molten solder bath and soldered to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14200577A JPS5841678B2 (en) | 1977-11-26 | 1977-11-26 | How to attach parts to a printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14200577A JPS5841678B2 (en) | 1977-11-26 | 1977-11-26 | How to attach parts to a printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5475071A JPS5475071A (en) | 1979-06-15 |
| JPS5841678B2 true JPS5841678B2 (en) | 1983-09-13 |
Family
ID=15305158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14200577A Expired JPS5841678B2 (en) | 1977-11-26 | 1977-11-26 | How to attach parts to a printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5841678B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56124295A (en) * | 1980-03-05 | 1981-09-29 | Chuo Meiban Mfg Co | Method of attaching part on printed board |
-
1977
- 1977-11-26 JP JP14200577A patent/JPS5841678B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5475071A (en) | 1979-06-15 |
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