JPS57126108A - Mounting method for coil - Google Patents

Mounting method for coil

Info

Publication number
JPS57126108A
JPS57126108A JP1153181A JP1153181A JPS57126108A JP S57126108 A JPS57126108 A JP S57126108A JP 1153181 A JP1153181 A JP 1153181A JP 1153181 A JP1153181 A JP 1153181A JP S57126108 A JPS57126108 A JP S57126108A
Authority
JP
Japan
Prior art keywords
coil
group
wiring board
printed wiring
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1153181A
Other languages
English (en)
Inventor
Morio Toyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1153181A priority Critical patent/JPS57126108A/ja
Publication of JPS57126108A publication Critical patent/JPS57126108A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1153181A 1981-01-30 1981-01-30 Mounting method for coil Pending JPS57126108A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1153181A JPS57126108A (en) 1981-01-30 1981-01-30 Mounting method for coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1153181A JPS57126108A (en) 1981-01-30 1981-01-30 Mounting method for coil

Publications (1)

Publication Number Publication Date
JPS57126108A true JPS57126108A (en) 1982-08-05

Family

ID=11780543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1153181A Pending JPS57126108A (en) 1981-01-30 1981-01-30 Mounting method for coil

Country Status (1)

Country Link
JP (1) JPS57126108A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164297A (ja) * 1985-01-17 1986-07-24 東芝ケミカル株式会社 電子部品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164297A (ja) * 1985-01-17 1986-07-24 東芝ケミカル株式会社 電子部品の製造方法

Similar Documents

Publication Publication Date Title
GB2140716B (en) Mounting apparatus for chip type electronic parts on circuit boards
GB2076703B (en) Apparatus for mounting a chip-type electronic component on a substrate
DE3366308D1 (en) Mounting of electronic components on printed circuit boards
GB2036625B (en) Apparatus for soldering components mounted on printed circuit boards
JPS57126108A (en) Mounting method for coil
GB1517247A (en) Soldering apparatus for soldering electronic component leads to conductors on a printed circuit board
EP0376620A3 (en) Method for processing plastic packaged electronic devices
JPS54131775A (en) Method of connecting electronic components having multiiterminal lead wire with printed circuit board and device used for same
JPS6472590A (en) Method of mounting component of aluminum conductor circuit substrate
JPH05129753A (ja) デイスクリート部品およびデイスクリート部品のプリント基板実装方法
JPS6464298A (en) Hybrid integrated circuit
GB1555227A (en) Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
JPS57121266A (en) Manufacture of hybrid integrated circuit
JPS56115599A (en) Method of soldering electronic circuit component on printed circuit board
TW374218B (en) Method for mounting integrated circuits on printed circuit boards
JPS52125378A (en) Temperature measuring method
JPS6442140A (en) Connection of integrated circuit
SU1274169A1 (ru) Способ соединени монтажных проводов с выводами радиоэлементов,установленных на монтажной плате
JPS63161696A (ja) 電子部品の表面実装方法
KR0138707B1 (ko) 미세피치 전자부품의 실장방법
JPS6425499A (en) Mounting of electronic component
SU608279A1 (ru) Устройство дл установки радиодеталей с осевыми выводами на печатную плату
JPH05167296A (ja) プリント回路基板における面実装部品の位置決め装置
JPS57107094A (en) Method of soldering through hole printed circuit board
JPS56129356A (en) Packaging and package