JPH05167296A - Surface-mounting component positioning device of printed circuit board - Google Patents
Surface-mounting component positioning device of printed circuit boardInfo
- Publication number
- JPH05167296A JPH05167296A JP3328574A JP32857491A JPH05167296A JP H05167296 A JPH05167296 A JP H05167296A JP 3328574 A JP3328574 A JP 3328574A JP 32857491 A JP32857491 A JP 32857491A JP H05167296 A JPH05167296 A JP H05167296A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- positioning device
- mounting component
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器等に使用する
プリント回路基板（チップオンボード）に面実装部品を
実装する際、この面実装部品をプリント回路基板に位置
決めするための位置決め装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning device for positioning a surface-mounted component on a printed circuit board (chip-on-board) used in electronic equipment when the surface-mounted component is mounted on the printed circuit board. .
【０００２】[0002]
【従来の技術】従来のプリント回路基板において、実装
する面実装部品を位置決めするには、図２に示すよう
に、プリント回路基板２１に一対の位置決め穴２２を形
成し、この位置決め穴２２に面実装部品２３に設けた位
置決め突起２４を挿入する。これにより、例えば、面実
装部品２３のリード２５をプリント回路基板２１のラン
ド上のクリームはんだ２６に対応するように位置決め
し、両者をリフロー方式ではんだ付けすることにより、
面実装部品２３をプリント回路基板２１に実装すること
ができる。2. Description of the Related Art In a conventional printed circuit board, a pair of positioning holes 22 are formed in a printed circuit board 21 as shown in FIG. The positioning protrusion 24 provided on the mounting component 23 is inserted. Thereby, for example, the lead 25 of the surface mount component 23 is positioned so as to correspond to the cream solder 26 on the land of the printed circuit board 21, and both are soldered by the reflow method.
The surface mount component 23 can be mounted on the printed circuit board 21.
【０００３】なお、符号２７はプリント回路基板２１上
にエポキシ樹脂等によるダムシルク印刷により形成され
たはんだ流出防止枠である。Reference numeral 27 is a solder outflow prevention frame formed on the printed circuit board 21 by dam silk printing with epoxy resin or the like.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来技術のようにプリント回路基板２１の位置決め穴２２
に面実装部品２３の位置決め突起２４を挿入して位置決
めするようにすると、面実装部品２３の小型化およびプ
リント回路基板２１の実装面積の削減におのずから限界
があるという問題があった。However, the positioning hole 22 of the printed circuit board 21 as in the prior art described above.
If the positioning protrusions 24 of the surface mount component 23 are inserted and positioned, the size of the surface mount component 23 and the mounting area of the printed circuit board 21 will be limited, which is a problem.
【０００５】本発明は、このような従来の問題を解決す
るものであり、面実装部品の小型化およびプリント回路
基板の実装面積の削減を図ることができ、したがって、
電子機器等の小型化を図ることができ、また、プリント
回路基板の製造に際し、特別な工程を不要とし、納期、
価格に影響を及ぼさないようにしたプリント回路基板に
おける面実装部品の位置決め装置を提供することを目的
とするものである。The present invention solves such a conventional problem, and can reduce the size of the surface mounting component and the mounting area of the printed circuit board.
It is possible to reduce the size of electronic devices, etc. Also, when manufacturing printed circuit boards, no special process is required,
It is an object of the present invention to provide a positioning device for surface mounting components on a printed circuit board that does not affect the price.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記目的を達
成するために、プリント回路基板上に面実装部品の外形
に対応する位置決め枠がダムシルク印刷により形成され
たものである。In order to achieve the above object, the present invention has a positioning frame corresponding to the outer shape of a surface mount component formed by dam silk printing on a printed circuit board.
【０００７】[0007]
【作用】したがって、本発明によれば、プリント回路基
板上に形成した位置決め枠に面実装部品を挿入して位置
決めすることができるので、面実装部品の小型化および
プリント回路基板の実装面積の削減を図ることができ
る。また、上記位置決め枠はプリント回路基板に使用さ
れているダムシルク印刷により形成しているので、プリ
ント回路基板の製造に際し、特別な工程が不要となる。Therefore, according to the present invention, since the surface mount component can be inserted and positioned in the positioning frame formed on the printed circuit board, the surface mount component can be downsized and the mounting area of the printed circuit board can be reduced. Can be planned. Further, since the positioning frame is formed by dam silk printing used on the printed circuit board, no special process is required when manufacturing the printed circuit board.
【０００８】[0008]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【０００９】図１は本発明の一実施例における位置決め
装置を示す概略構成図である。図１に示すように、プリ
ント回路基板１上に位置決め枠２が形成されている。こ
の位置決め枠２は、例えば、はんだ流出防止枠３と同様
に、エポキシ樹脂等によるダムシルク印刷により形成さ
れ、面実装部品４の本体部の外形に対応するように設定
されている。FIG. 1 is a schematic configuration diagram showing a positioning device according to an embodiment of the present invention. As shown in FIG. 1, a positioning frame 2 is formed on a printed circuit board 1. Similar to the solder outflow prevention frame 3, the positioning frame 2 is formed by dam silk printing with an epoxy resin or the like, and is set so as to correspond to the outer shape of the main body of the surface mount component 4.
【００１０】そして、プリント回路基板１の位置決め枠
２に面実装部品４を挿入し、これにより、例えば、面実
装部品４のリード５をプリント回路基板１のランド上の
クリームはんだ６に対応するように位置決めする。その
後、両者をリフロー方式ではんだ付けすることにより、
面実装部品４をプリント回路基板１に実装することがで
きる。Then, the surface mount component 4 is inserted into the positioning frame 2 of the printed circuit board 1 so that, for example, the leads 5 of the surface mount component 4 correspond to the cream solder 6 on the land of the printed circuit board 1. To position. After that, by soldering both by reflow method,
The surface mount component 4 can be mounted on the printed circuit board 1.
【００１１】このように上記実施例によれば、プリント
回路基板１上に形成した位置決め枠２に面実装部品４を
挿入して位置決めするので、上記従来例のような面実装
部品の突起や、プリント回路基板の位置決め穴が不要と
なり、面実装部品の小型化およびプリント回路基板の実
装面積の削減を図ることができる。また、位置決め枠２
をダムシルク印刷により形成しているので、プリント回
路基板１の製造に際し、特別な工程を不要とし、納期、
価格に影響を及ぼさないようにすることができる。As described above, according to the above-described embodiment, since the surface mount component 4 is inserted into the positioning frame 2 formed on the printed circuit board 1 for positioning, the protrusion of the surface mount component as in the above-mentioned conventional example, and the like. Since the positioning hole of the printed circuit board is not required, it is possible to downsize the surface mount component and reduce the mounting area of the printed circuit board. Also, the positioning frame 2
Since it is formed by dam silk printing, no special process is required when manufacturing the printed circuit board 1,
You can avoid affecting the price.
【００１２】[0012]
【発明の効果】以上説明したように本発明によれば、プ
リント回路基板上に形成した位置決め枠に面実装部品を
挿入して位置決めすることができるので、面実装部品の
小型化、プリント回路基板の実装面積の削減を図ること
ができる。したがって、電子機器等の小型化を図ること
ができる。また、上記位置決め枠はプリント回路基板に
使用されているダムシルク印刷により形成しているの
で、プリント回路基板の製造に際し、特別な工程が不要
となる。したがって、プリント回路基板の納期、価格に
影響を及ぼさないようにすることができる。As described above, according to the present invention, since the surface mount component can be inserted and positioned in the positioning frame formed on the printed circuit board, downsizing of the surface mount component and the printed circuit board can be achieved. The mounting area can be reduced. Therefore, it is possible to reduce the size of the electronic device or the like. Further, since the positioning frame is formed by dam silk printing used for the printed circuit board, no special process is required when manufacturing the printed circuit board. Therefore, it is possible to prevent the delivery date and the price of the printed circuit board from being affected.
【図１】本発明の一実施例における位置決め装置を示す
概略構成図FIG. 1 is a schematic configuration diagram showing a positioning device according to an embodiment of the present invention.
【図２】従来の位置決め装置を示す概略構成図FIG. 2 is a schematic configuration diagram showing a conventional positioning device.
１ プリント回路基板 ２ 位置決め枠 ３ はんだ流出防止枠 ４ 面実装部品 1 Printed circuit board 2 Positioning frame 3 Solder outflow prevention frame 4 Surface mount components
Claims (1)
に対応する位置決め枠がダムシルク印刷により形成され
たプリント回路基板における面実装部品の位置決め装
置。1. A positioning device for a surface-mounted component on a printed circuit board, wherein a positioning frame corresponding to the outer shape of the surface-mounted component is formed on the printed circuit board by dam silk printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3328574A JPH05167296A (en) | 1991-12-12 | 1991-12-12 | Surface-mounting component positioning device of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3328574A JPH05167296A (en) | 1991-12-12 | 1991-12-12 | Surface-mounting component positioning device of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05167296A true JPH05167296A (en) | 1993-07-02 |
Family
ID=18211799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3328574A Pending JPH05167296A (en) | 1991-12-12 | 1991-12-12 | Surface-mounting component positioning device of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05167296A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0817550A1 (en) * | 1996-06-26 | 1998-01-07 | NGK Spark Plug Co. Ltd. | Circuit board with improved positioning means |
| EP3174159A1 (en) * | 2015-11-30 | 2017-05-31 | Sumida Corporation | Antenna device and manufacturing method of antenna device |
-
1991
- 1991-12-12 JP JP3328574A patent/JPH05167296A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0817550A1 (en) * | 1996-06-26 | 1998-01-07 | NGK Spark Plug Co. Ltd. | Circuit board with improved positioning means |
| EP3174159A1 (en) * | 2015-11-30 | 2017-05-31 | Sumida Corporation | Antenna device and manufacturing method of antenna device |
| US10186764B2 (en) | 2015-11-30 | 2019-01-22 | Sumida Corporation | Antenna device and manufacturing method of antenna device |
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