SU1274169A1 - Method of connecting the wiring conductors with leads of electronic components which are installed on wiring board - Google Patents

Method of connecting the wiring conductors with leads of electronic components which are installed on wiring board

Info

Publication number
SU1274169A1
SU1274169A1 SU813251011A SU3251011A SU1274169A1 SU 1274169 A1 SU1274169 A1 SU 1274169A1 SU 813251011 A SU813251011 A SU 813251011A SU 3251011 A SU3251011 A SU 3251011A SU 1274169 A1 SU1274169 A1 SU 1274169A1
Authority
SU
USSR - Soviet Union
Prior art keywords
leads
wiring
electronic components
wiring board
terminals
Prior art date
Application number
SU813251011A
Other languages
Russian (ru)
Inventor
Владимир Павлович Бырыкин
Original Assignee
Byrykin Vladimir P
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Byrykin Vladimir P filed Critical Byrykin Vladimir P
Priority to SU813251011A priority Critical patent/SU1274169A1/en
Application granted granted Critical
Publication of SU1274169A1 publication Critical patent/SU1274169A1/en

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  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Изобретение относитс  к технологии изготовлени  монтажных плат электронных приборов„ Цель изобретени  - повышение .производительности процесса монтажа и улучшение качества соединени » Способ соединени  монтажных проводов с выводами радиоэлементов, установленных на монтажной плате, включает накрутку монтажного провода на выводы радиоэлементов от основани  монтажной платы к концу вывода и обратно и пайку поверхности соединени . 1 ил.The invention relates to the technology of manufacturing electronic circuit boards. The purpose of the invention is to increase the productivity of the installation process and improve the quality of the connection. and back and solder the joint surface. 1 il.

Description

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Изобретение относитс  к технологии изготовлени  монтажных плат электронных приборов.The invention relates to the technology of manufacturing electronic circuit boards.

Цель изобретени  - повьшение производительности процесса монтажа и улучшение качества соединени .The purpose of the invention is to increase the productivity of the installation process and improve the quality of the connection.

На чертеже изображено соединение монтажных проводов с выводами радиоэлементов , установленных на-монтажной плате.The drawing shows the connection of the wiring with the findings of the radio elements mounted on the on-wiring board.

Дл  осуществлени  способа в отверсти  монтажной платы 1 ввод т выводы радиоэлементов 2 и закрепл ют их на монтажной плате 1 клееМо На выводы радиоэлементов 2 производ т на- круфку монтажного провода 3, причем накрутку монтажных проводов на выводи радиоэлементов осуществл ют от основани  монтажной платы к концу выбода и обратно. Затем поверхность соединени  монтажного провода 3 с выводами радиоэлементов 2 подвергают групповой пайке, предварительно установив поверх проводного монтажа защитную маску 4 так, что соединение вывод - проводник выступает на маской 4 на величину, достаточную дл  осуществлени  пайки соединений групповым способом. Пайку соединений осуществл ют окунанием соединений в ванну с расплавленным припоем или волной припо .For carrying out the method, the leads of the radio elements 2 are inserted into the holes of the circuit board 1 and secured to the circuit board 1 glue. pick and back. Then, the surface of the connection of the installation wire 3 with the terminals of the radio elements 2 is subjected to group soldering, having previously installed a protective mask 4 over the wiring, so that the output-conductor connection acts on the mask 4 by an amount sufficient to solder the connections in a group fashion. Soldering of the compounds is carried out by dipping the compounds in a bath of molten solder or a wave of solder.

Claims (1)

Формула изобретени Invention Formula Способ соединени  монтажных проводов с выводами радиоэлементов, установленных на монтажной плате, включающий накрутку монтажного провода на выводы радиоэлементов и пайку поверхности соединени  монтажного провода с выводами радиоэлементов, отличающийс  тем, что, с целью повышени  производительности процесса монтажа и улучшени  качества соединени  , накрутку монтажных проводов на выводы радиоэлементов осуществл ют от основани  монтажной платы к концу вывода и обратно.The method of connecting wiring wires to the terminals of radio elements mounted on the circuit board includes winding the wire to the terminals of radio elements and soldering the surface of the connection of the wire to the terminals of radio elements, in order to improve the performance of the installation process and improve the quality of the connection radio element leads are made from the base of the circuit board to the end of the output and vice versa. W SSSSS s p iiS W SSSSS s p iiS
SU813251011A 1981-02-25 1981-02-25 Method of connecting the wiring conductors with leads of electronic components which are installed on wiring board SU1274169A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU813251011A SU1274169A1 (en) 1981-02-25 1981-02-25 Method of connecting the wiring conductors with leads of electronic components which are installed on wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU813251011A SU1274169A1 (en) 1981-02-25 1981-02-25 Method of connecting the wiring conductors with leads of electronic components which are installed on wiring board

Publications (1)

Publication Number Publication Date
SU1274169A1 true SU1274169A1 (en) 1986-11-30

Family

ID=20944124

Family Applications (1)

Application Number Title Priority Date Filing Date
SU813251011A SU1274169A1 (en) 1981-02-25 1981-02-25 Method of connecting the wiring conductors with leads of electronic components which are installed on wiring board

Country Status (1)

Country Link
SU (1) SU1274169A1 (en)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Уайтхед. Новый метод монтажа, обеспечивающий автоматическую проверку соединений. Электроника, том 50 № 8 (308), 1977, с.40-50. *

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