JPS5528340A - Plating apparatus - Google Patents
Plating apparatusInfo
- Publication number
- JPS5528340A JPS5528340A JP10079478A JP10079478A JPS5528340A JP S5528340 A JPS5528340 A JP S5528340A JP 10079478 A JP10079478 A JP 10079478A JP 10079478 A JP10079478 A JP 10079478A JP S5528340 A JPS5528340 A JP S5528340A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating solution
- plating
- mask body
- boundary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 11
- 239000000243 solution Substances 0.000 abstract 7
- 239000000463 material Substances 0.000 abstract 4
- TZRXHJWUDPFEEY-UHFFFAOYSA-N Pentaerythritol Tetranitrate Chemical compound [O-][N+](=O)OCC(CO[N+]([O-])=O)(CO[N+]([O-])=O)CO[N+]([O-])=O TZRXHJWUDPFEEY-UHFFFAOYSA-N 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000011084 recovery Methods 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To clearly distinguish the boundary of the plated part and unplated part, and recover the plating solution completely, by injecting the plating solution from above onto the material being plated of which part to be plated is divided and exposed by masks.
CONSTITUTION: A material being plated 20 is placed on a back side mask body 21 on a table 2, and a plating box 1 is lowered to contact a mask body 18 closely on the upper surface of the material being plated 20. The plating solution A is injected downward from an anode/nozzle 6, and an opening part 19 is electrolycally plated. After plating treatment, solenoid valves 8, 9 are operated to inject the air from an air supply pipe 5 through the nozzle 6 to blow off the plating solution remaining in the opening part 19 of the mask body and plating solution injection opening 11, and the plating solution is recovered into a tank 12 through a recovery route 4. Besides, since the mask body 18 is press-contacted to the material being plated 20 in the plating box 1, the plating solution does not pentrate into the nonplating part, so that the boundary may not be vague.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10079478A JPS6059998B2 (en) | 1978-08-18 | 1978-08-18 | plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10079478A JPS6059998B2 (en) | 1978-08-18 | 1978-08-18 | plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5528340A true JPS5528340A (en) | 1980-02-28 |
JPS6059998B2 JPS6059998B2 (en) | 1985-12-27 |
Family
ID=14283324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10079478A Expired JPS6059998B2 (en) | 1978-08-18 | 1978-08-18 | plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6059998B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61288092A (en) * | 1985-06-17 | 1986-12-18 | Hitachi Ltd | Partial plating method |
JPH01180995A (en) * | 1988-01-11 | 1989-07-18 | Union Tool Kk | Marking method |
-
1978
- 1978-08-18 JP JP10079478A patent/JPS6059998B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61288092A (en) * | 1985-06-17 | 1986-12-18 | Hitachi Ltd | Partial plating method |
JPH01180995A (en) * | 1988-01-11 | 1989-07-18 | Union Tool Kk | Marking method |
Also Published As
Publication number | Publication date |
---|---|
JPS6059998B2 (en) | 1985-12-27 |
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