JPS5531168A - Method and apparatus for partial plating - Google Patents

Method and apparatus for partial plating

Info

Publication number
JPS5531168A
JPS5531168A JP10433778A JP10433778A JPS5531168A JP S5531168 A JPS5531168 A JP S5531168A JP 10433778 A JP10433778 A JP 10433778A JP 10433778 A JP10433778 A JP 10433778A JP S5531168 A JPS5531168 A JP S5531168A
Authority
JP
Japan
Prior art keywords
plated
plating solution
gap
injected
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10433778A
Other languages
Japanese (ja)
Other versions
JPS6053759B2 (en
Inventor
Kazuhiro Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP10433778A priority Critical patent/JPS6053759B2/en
Publication of JPS5531168A publication Critical patent/JPS5531168A/en
Publication of JPS6053759B2 publication Critical patent/JPS6053759B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To apply partial plating securely, by injection air from the back and/or face side of the part to be plated into the gap not to be plated, and blocking entry of plating solution into said gap when injecting plating solution.
CONSTITUTION: The material to be plated 9 is placed on a face side mask body 6, and a back side mask body 15 is pressed downward by means of a pressing means 19, and the material 9 is held by the both mask bodies 6, 15 to perform plating. In this case, while injecting air from an air injection part 13, the plating solution is injected through the injection nozzle 13. The injected air is passed into a gap 14, and is injected to the face side of the material 9. On the other hand, the plating solution injected upwards from a nozzle 2 is supplied to the part to be plated A of the material 9 which is divided and exposed by an opening part 10 of the mask body 6. Only the plating solution is deposited on the exposed surface of the face side of the material 9 in the part to be plated A, and entry into the gap 14 is blocked by an opposing air injection flow.
COPYRIGHT: (C)1980,JPO&Japio
JP10433778A 1978-08-29 1978-08-29 Partial plating method and device Expired JPS6053759B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10433778A JPS6053759B2 (en) 1978-08-29 1978-08-29 Partial plating method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10433778A JPS6053759B2 (en) 1978-08-29 1978-08-29 Partial plating method and device

Publications (2)

Publication Number Publication Date
JPS5531168A true JPS5531168A (en) 1980-03-05
JPS6053759B2 JPS6053759B2 (en) 1985-11-27

Family

ID=14378107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10433778A Expired JPS6053759B2 (en) 1978-08-29 1978-08-29 Partial plating method and device

Country Status (1)

Country Link
JP (1) JPS6053759B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837190A (en) * 1981-08-26 1983-03-04 Sonitsukusu:Kk Method and device for partial plating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837190A (en) * 1981-08-26 1983-03-04 Sonitsukusu:Kk Method and device for partial plating
JPS5852034B2 (en) * 1981-08-26 1983-11-19 株式会社ソニツクス Partial plating method and device

Also Published As

Publication number Publication date
JPS6053759B2 (en) 1985-11-27

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