JPS5531168A - Method and apparatus for partial plating - Google Patents
Method and apparatus for partial platingInfo
- Publication number
- JPS5531168A JPS5531168A JP10433778A JP10433778A JPS5531168A JP S5531168 A JPS5531168 A JP S5531168A JP 10433778 A JP10433778 A JP 10433778A JP 10433778 A JP10433778 A JP 10433778A JP S5531168 A JPS5531168 A JP S5531168A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating solution
- gap
- injected
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 8
- 238000000034 method Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 5
- 239000000243 solution Substances 0.000 abstract 5
- 238000002347 injection Methods 0.000 abstract 4
- 239000007924 injection Substances 0.000 abstract 4
- 230000000903 blocking effect Effects 0.000 abstract 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To apply partial plating securely, by injection air from the back and/or face side of the part to be plated into the gap not to be plated, and blocking entry of plating solution into said gap when injecting plating solution.
CONSTITUTION: The material to be plated 9 is placed on a face side mask body 6, and a back side mask body 15 is pressed downward by means of a pressing means 19, and the material 9 is held by the both mask bodies 6, 15 to perform plating. In this case, while injecting air from an air injection part 13, the plating solution is injected through the injection nozzle 13. The injected air is passed into a gap 14, and is injected to the face side of the material 9. On the other hand, the plating solution injected upwards from a nozzle 2 is supplied to the part to be plated A of the material 9 which is divided and exposed by an opening part 10 of the mask body 6. Only the plating solution is deposited on the exposed surface of the face side of the material 9 in the part to be plated A, and entry into the gap 14 is blocked by an opposing air injection flow.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10433778A JPS6053759B2 (en) | 1978-08-29 | 1978-08-29 | Partial plating method and device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10433778A JPS6053759B2 (en) | 1978-08-29 | 1978-08-29 | Partial plating method and device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5531168A true JPS5531168A (en) | 1980-03-05 |
JPS6053759B2 JPS6053759B2 (en) | 1985-11-27 |
Family
ID=14378107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10433778A Expired JPS6053759B2 (en) | 1978-08-29 | 1978-08-29 | Partial plating method and device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6053759B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5837190A (en) * | 1981-08-26 | 1983-03-04 | Sonitsukusu:Kk | Method and device for partial plating |
-
1978
- 1978-08-29 JP JP10433778A patent/JPS6053759B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5837190A (en) * | 1981-08-26 | 1983-03-04 | Sonitsukusu:Kk | Method and device for partial plating |
JPS5852034B2 (en) * | 1981-08-26 | 1983-11-19 | 株式会社ソニツクス | Partial plating method and device |
Also Published As
Publication number | Publication date |
---|---|
JPS6053759B2 (en) | 1985-11-27 |
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