JPS61288092A - Partial plating method - Google Patents
Partial plating methodInfo
- Publication number
- JPS61288092A JPS61288092A JP12983085A JP12983085A JPS61288092A JP S61288092 A JPS61288092 A JP S61288092A JP 12983085 A JP12983085 A JP 12983085A JP 12983085 A JP12983085 A JP 12983085A JP S61288092 A JPS61288092 A JP S61288092A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- boundary line
- plates
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は部分めっき方法に係り、特にめっき不用部分を
被覆することなく部分的にめっきを行なう方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method of partial plating, and particularly to a method of performing partial plating without covering parts not required for plating.
従来、プリント配線板の接栓部に金めつきを行なうには
、以下（α） ＋ （Ａ）の工程で行なっていた。Conventionally, gold plating was performed on the plugging portion of a printed wiring board using the following steps (α) + (A).
（α） プリント配線板を対向する弾性ベルト間に圧接
保持して境界線によってめっき液と接触する接栓部と、
めっき液と接触しない配線部とを分離し、
（ｈ） 境界線の下方からめっき液を接栓部に吹きつ
ける。（特開昭５５−１６４９９ ）しかし、上記の方
法ではベルトとプリント配線板間にめっき液が毛細管現
象で浸み込み、めっき不要□部分にも金めつき皮膜が形
成されることがあった。 ・
〔発明の目的〕
本発明の目的は上記した従来技術の欠点をなくし、めっ
き不用部分をマスクすることなく、めっきすべき部分に
のみめっき皮膜形成出来る部分めっき方法を提供するに
ある。(α) a plug portion that holds the printed wiring board in pressure contact between opposing elastic belts and contacts the plating solution through the boundary line;
Separate the wiring parts that do not come into contact with the plating solution, and (h) Spray the plating solution onto the plugs from below the boundary line. (Japanese Unexamined Patent Publication No. 55-16499) However, in the above method, the plating solution sometimes penetrates between the belt and the printed wiring board due to capillary action, and a gold plating film is sometimes formed even in the square portions where no plating is required. - [Object of the Invention] The object of the present invention is to eliminate the drawbacks of the above-mentioned conventional techniques and to provide a partial plating method that can form a plating film only on the parts to be plated without masking the parts not to be plated.
上記目的は、垂直に保持した被めっき物のめっきをすべ
き部分とめっき不用部分の境界線で直角に被めっき物に
交わる面に対して、ある角度でめっき液を被めっき物の
上記境界線近傍に噴射することで達成される。The purpose of the above is to apply the plating solution at a certain angle to the boundary line between the part to be plated and the part not to be plated, which is held vertically, and intersects the part at right angles to the part to be plated. This is achieved by spraying it in the vicinity.
上記のある角度とは、後述する第１図のθを指し、★用
土は１０°〜６５°であシ、好ましくは３０°〜４５°
である。また、めっき液が噴出する部分は、被めっき物
の移動に支障ない位置にあれば良く、通常は被めっき物
から１−〜４箇離すが、１■〜２■離れていると更に良
い。The above-mentioned angle refers to θ in Fig. 1 described later, and the soil should be 10° to 65°, preferably 30° to 45°.
It is. Further, the part from which the plating solution is spouted need only be located at a position that does not interfere with the movement of the object to be plated, and is usually 1 to 4 points away from the object to be plated, but it is even better if it is 1 to 2 inches away from the object to be plated.
めっき液の噴射速度は、めっき液がめっきを２１２１７
’ｈ−好ましくは３５．７ｊ／−〜７ｔ４ｊ／−である
。The injection speed of the plating solution is 21217
'h-preferably 35.7j/- to 7t4j/-.
以下、本発明を実施例によって詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図に示すように、プリント回路板１をめっき槽の上
部し中へい板２−１．２−２の間に垂直に保持する。上
部じゃへい板２−１．２−２の先端Ｃ，Ｄは、プリント
回路板よシ１■離れている。As shown in FIG. 1, the printed circuit board 1 is held vertically between the upper and middle plates 2-1, 2-2 of the plating tank. The ends C and D of the upper shingle plate 2-1 and 2-2 are separated by one inch from the printed circuit board.
めっき液槽５−１．５−２中のめっき液は、上部し中へ
い板２−１ 、２−２と下部し中へい板４−１．４板１
の長さ５０３の境界線に噴射させためっき液は、めっき
液排出部６からめっき槽５−１．５−２に循環された。The plating solution in the plating solution tank 5-1.5-2 is distributed between the upper inner walls 2-1 and 2-2 and the lower inner walls 4-1.4 plate 1.
The plating solution injected onto the boundary line of length 503 was circulated from the plating solution discharge section 6 to the plating tank 5-1.5-2.
そして、プリント回路板１を陰極とし、陽極３とプリン
ト回路板１との間に直ト回路板１の接栓部鋼パターン上
に金めつきを行なった。なお、第２図は、第１図のめっ
き液噴射部の拡大図である。Then, using the printed circuit board 1 as a cathode, gold plating was performed on the steel pattern of the connecting part of the direct circuit board 1 between the anode 3 and the printed circuit board 1. Note that FIG. 2 is an enlarged view of the plating solution spraying section in FIG. 1.
接栓部への部分金めっき結果を、第３図に示した。第３
図の（α）は、噴射角（θ）が３０°の場合である。部
分的、すなわち接点との接触部近傍にのみ金めっきがさ
れていた。このような状態は、噴射角３０６〜４５°の
間でみられた。めっき液の噴射速度、めっき液の噴出す
る上部し中へい板の先端（第１図中のｃ、ｎ ）とプリ
ント回路板との距離が前述した範囲で同様に起こること
も確認された。The results of selective gold plating on the plug are shown in Figure 3. Third
(α) in the figure is a case where the injection angle (θ) is 30°. Gold plating was applied only partially, that is, only near the contact points. Such a state was observed between injection angles of 306° and 45°. It was also confirmed that the spraying speed of the plating solution and the distance between the tip of the upper middle plate (c, n in FIG. 1) from which the plating solution is sprayed and the printed circuit board were the same as above.
第３図の（Ａ） 、 （ｅ）は噴射角（θ）が６０’、
８０°の場合である。第５図（Ａ）のように接点との接
触部近傍の金めつき皮膜厚さが厚くなり、その他の部分
は金めつき被膜厚さがうすくなるのは、噴射角１０°〜
３０′１未満、４５°よシ大〜６５＠以下の場合であっ
た。このような状態は、めっき液の噴出速度、めっき液
の噴出する部分（第１図中のＣ９Ｄ）とプリント回路板
との距離が前述した範囲で同様に起こることも確認され
た。第４図はその一例であり、めっき液の噴出する上部
し中へい板の先端とプリント回路板との距離が４°°で
ある以外は第５図（Ａ）と同じ条件で部分金めつきを行
なった場合であり、第３図（Ａ）と同様の結果を得てい
る。In Fig. 3 (A) and (e), the injection angle (θ) is 60',
This is the case of 80°. As shown in Figure 5 (A), the thickness of the gold plating film near the contact area becomes thicker, and the thickness of the gold plating film becomes thinner in other areas, as shown in Fig. 5 (A).
The angle was less than 30'1, and the angle was between 45° and 65°. It was also confirmed that such a situation similarly occurs within the above-mentioned ranges of the spouting speed of the plating solution and the distance between the part (C9D in FIG. 1) from which the plating solution is spouted and the printed circuit board. Figure 4 is an example of this, and partial gold plating was performed under the same conditions as Figure 5 (A), except that the distance between the tip of the upper middle plate where the plating solution spouted and the printed circuit board was 4°. This is a case in which the same results as in FIG. 3(A) are obtained.
以上述べたように本発明によって部分めっきをすれば、
（、） 必要とする部分の近傍にのみ厚くつくので経
済的である。As described above, partial plating according to the present invention is economical because (,) the plating is thick only in the vicinity of the required areas.
（ｂ） めっき不要部分を弾性体で圧接する必要もな
いので、めっき設備が簡単になる。(b) Since there is no need to press the parts that do not need plating with an elastic body, the plating equipment becomes simpler.
（１） テープでめっき不用部分をかくす必要がない
ので、めっき工程が簡略になる。また、テープをはがし
た後に残る粘着剤を取シ除く１第１図は本発明で用いる
めりき槽の部分断面図、第２図は第１図の部分拡大図、
第３図、第４図は本発明の方法で部分めっきした場合の
めっき皮膜の出来１合を示す図である。(1) There is no need to hide parts not to be plated with tape, which simplifies the plating process. In addition, remove the adhesive remaining after peeling off the tape 1. Figure 1 is a partial sectional view of the milling tank used in the present invention, Figure 2 is a partially enlarged view of Figure 1,
FIGS. 3 and 4 are diagrams showing the results of a plating film obtained when partial plating is performed by the method of the present invention.
１・・・・−・・・・・−・・・−・・・・・プリント
回路板２−１ 、２−２・・・上部し中へい板３・・・
・・・・・・・・・・・・・・・・・・陽極４−１．４
−２・・・下部し中へい板
５−１．５−２・・・めっき液槽
６・・−・・・・・・・−・−・・・・・めっき液排出
部（°−゛1...--...--...--...Printed circuit board 2-1, 2-2...Upper and inner board 3...
・・・・・・・・・・・・・・・・・・Anode 4-1.4
-2...Lower inner wall plate 5-1.5-2...Plating solution tank 6...--...Plating solution discharge part
Claims (1)
不用部分の境界線で直角に被めっき物に交わる面に対し
て１０°〜６５°の角度でめっき液を被めっき物の上記
境界線近傍に噴射することを特徴とする部分めっき方法
。Apply the plating solution near the boundary line of the object to be plated at an angle of 10° to 65° to the plane that intersects the object to be plated at right angles to the boundary line between the part to be plated and the part not to be plated, which is held vertically. A partial plating method characterized by spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60129830A JPH0762270B2 (en) | 1985-06-17 | 1985-06-17 | Partial plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60129830A JPH0762270B2 (en) | 1985-06-17 | 1985-06-17 | Partial plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61288092A true JPS61288092A (en) | 1986-12-18 |
| JPH0762270B2 JPH0762270B2 (en) | 1995-07-05 |
Family
ID=15019280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60129830A Expired - Fee Related JPH0762270B2 (en) | 1985-06-17 | 1985-06-17 | Partial plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0762270B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528340A (en) * | 1978-08-18 | 1980-02-28 | Electroplating Eng Of Japan Co | Plating apparatus |
| JPS5528339A (en) * | 1978-08-18 | 1980-02-28 | Electroplating Eng Of Japan Co | Plating apparatus |
-
1985
- 1985-06-17 JP JP60129830A patent/JPH0762270B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528340A (en) * | 1978-08-18 | 1980-02-28 | Electroplating Eng Of Japan Co | Plating apparatus |
| JPS5528339A (en) * | 1978-08-18 | 1980-02-28 | Electroplating Eng Of Japan Co | Plating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0762270B2 (en) | 1995-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |