JPH11509977A - 少なくとも2つのケーシング部分から成る制御装置 - Google Patents
少なくとも2つのケーシング部分から成る制御装置Info
- Publication number
- JPH11509977A JPH11509977A JP8536831A JP53683196A JPH11509977A JP H11509977 A JPH11509977 A JP H11509977A JP 8536831 A JP8536831 A JP 8536831A JP 53683196 A JP53683196 A JP 53683196A JP H11509977 A JPH11509977 A JP H11509977A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- control device
- casing
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cookers (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.少なくとも2つのケーシング部分(18,26)と、出力素子(14)を備 えた少なくとも1つのプリント配線板(10)とから成る制御装置であって、プ リント配線板(10)がケーシング部分(18,26)の間で縁部領域において 緊締されていて、プリント配線板(10)が熱伝導性の材料から成る層(34) を有している形式のものにおいて、プリント配線板(10)における第1のケー シング部分(26)の支持面(28)が、少なくとも、プリント配線板(10) の縁部に配置された出力素子(14)の領域において、第2のケーシング部分( 18)の支持面(22)よりも大きく、前記熱伝導性の材料から成る層(34) がプリント配線板(10)と第1のケーシング部分(26)との間に配置されて おり、しかも前記層が、プリント配線板(10)及び第1のケーシング部分(2 6)に固着しかつ熱伝導性の良好な特性をもつ充てん物質(34)であることを 特徴とする、少なくとも2つのケーシング部分から成る制御装置。 2.プリント配線板(10)の縁部において第1のケーシング部分(26)の支 持面(28)の領域に、損失熱が最大の出力素子(14)が配置されている、請 求項1記載の制御装置。 3.充てん物質が圧力負荷時に硬化するようになっている、請求項1又は2記載 の制御装置。 4.充てん物質(34)が硬化後に弾性的な特性を有するようになっている、請 求項1から3までのいずれか1項記載の制御装置。 5.充てん物質(34)が2つの成分から成っていて、圧力負荷時に硬化するよ うになっている、請求項1又は2記載の制御装置。 6.充てん物質(34)が2つの成分から成っていて、熱負荷時に硬化するよう になっている、請求項1又は2記載の制御装置。 7.第1のケーシング部分(26)とプリント配線板(10)と第2のケーシン グ部分(18)とが、互いに堅く結合されている、請求項1から6までのいずれ か1項記載の制御装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19528632A DE19528632A1 (de) | 1995-08-04 | 1995-08-04 | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
DE19528632.4 | 1995-08-04 | ||
PCT/DE1996/001212 WO1997006658A1 (de) | 1995-08-04 | 1996-07-06 | Steuergerät bestehend aus mindestens zwei gehäuseteilen |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11509977A true JPH11509977A (ja) | 1999-08-31 |
JP4112614B2 JP4112614B2 (ja) | 2008-07-02 |
Family
ID=7768660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53683196A Expired - Lifetime JP4112614B2 (ja) | 1995-08-04 | 1996-07-06 | 少なくとも2つのケーシング部分から成る制御装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6084776A (ja) |
EP (1) | EP0842594B1 (ja) |
JP (1) | JP4112614B2 (ja) |
KR (1) | KR100418148B1 (ja) |
DE (2) | DE19528632A1 (ja) |
ES (1) | ES2131949T3 (ja) |
WO (1) | WO1997006658A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000124644A (ja) * | 1998-10-12 | 2000-04-28 | Pfu Ltd | カード型回路モジュール装置およびこれに使用する実装基板 |
JP2009522761A (ja) * | 2005-12-30 | 2009-06-11 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 集積電子構成部材ならびに集積電子構成部材に対する冷却装置 |
US7970815B1 (en) | 1999-11-14 | 2011-06-28 | Sony Corporation | Portable record and/or reproduce device, method of reproducing, and method of recording and reproducing |
JP2013062509A (ja) * | 2012-10-03 | 2013-04-04 | Denso Corp | 電子制御装置 |
JP2013232654A (ja) * | 2013-06-05 | 2013-11-14 | Denso Corp | 電子制御装置 |
JP2017191872A (ja) * | 2016-04-14 | 2017-10-19 | キヤノン株式会社 | カード型電子装置、スロット及び電子機器 |
JP6432918B1 (ja) * | 2017-10-27 | 2018-12-05 | 三菱電機株式会社 | 回路基板収納筐体 |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19600619A1 (de) * | 1996-01-10 | 1997-07-17 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
DE19723409A1 (de) * | 1997-06-04 | 1998-12-10 | Bosch Gmbh Robert | Steuergerät |
DE19736962B4 (de) * | 1997-08-25 | 2009-08-06 | Robert Bosch Gmbh | Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben |
DE19919781A1 (de) * | 1999-04-30 | 2000-11-09 | Wuerth Elektronik Gmbh | Leiterplatte und Verfahren zu ihrer Anbringung |
DE19924080A1 (de) * | 1999-05-26 | 2000-12-21 | Siemens Ag | Grundplatte mit darauf angebrachter Leiterplatte |
IL130775A (en) * | 1999-07-02 | 2007-03-08 | Elta Systems Ltd | Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling |
FR2798814B1 (fr) * | 1999-09-22 | 2001-11-16 | Valeo Vision | Perfectionnements aux assemblages electroniques a drain thermique, notamment pour module de commande de lampe a decharge de projecteur de vehicule automobile |
JP3648119B2 (ja) * | 2000-03-01 | 2005-05-18 | 株式会社ケーヒン | 電子回路基板の収容ケース |
JP3923703B2 (ja) * | 2000-03-29 | 2007-06-06 | ローム株式会社 | 放熱手段を有するプリント配線板 |
FR2821497B1 (fr) * | 2001-02-27 | 2004-07-16 | Bosch Gmbh Robert | Entrainement electrique notamment entrainement d'essuie-glaces |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
DE10214363A1 (de) * | 2002-03-30 | 2003-10-16 | Bosch Gmbh Robert | Kühlanordnung und Elektrogerät mit einer Kühlanordnung |
DE10300175B4 (de) * | 2003-01-08 | 2016-12-29 | Hella Kgaa Hueck & Co. | Elektronische Baugruppe mit Wärme ableitendem Gehäuseteil |
DE20301773U1 (de) * | 2003-02-05 | 2003-04-17 | Leopold Kostal GmbH & Co. KG, 58507 Lüdenscheid | Elektrische Einrichtung |
DE10315299A1 (de) * | 2003-04-04 | 2004-10-14 | Hella Kg Hueck & Co. | Gehäuse |
ES2298809T3 (es) | 2003-08-01 | 2008-05-16 | Vdo Automotive Ag | Unidad electronica asi como procedimiento para fabricar una unidad electronica. |
TWI333805B (en) | 2003-10-03 | 2010-11-21 | Osram Sylvania Inc | Housing for electronic ballast |
ITMI20032131A1 (it) * | 2003-11-05 | 2005-05-06 | Sp El Srl | Contenitore ad elevata capacita' di dissipazione per |
US7145774B2 (en) * | 2003-12-29 | 2006-12-05 | Intel Corporation | Backside cooling apparatus for modular platforms |
FR2872992B1 (fr) * | 2004-07-09 | 2006-09-29 | Valeo Vision Sa | Assemblage electronique a drain thermique notamment pour module de commande de lampe a decharge de projecteurs de vehicule automobile |
JP4196904B2 (ja) * | 2004-08-26 | 2008-12-17 | 株式会社デンソー | 電子制御装置 |
DE102005039374A1 (de) * | 2005-08-19 | 2007-02-22 | BSH Bosch und Siemens Hausgeräte GmbH | Gehäuse für Elektronikbaugruppen |
KR100752009B1 (ko) * | 2006-03-06 | 2007-08-28 | 삼성전기주식회사 | Led가 구비된 백라이트유닛 |
JP4357504B2 (ja) * | 2006-06-29 | 2009-11-04 | 株式会社日立製作所 | エンジン制御装置 |
US7888601B2 (en) * | 2006-12-29 | 2011-02-15 | Cummins Power Generations IP, Inc. | Bus bar interconnection techniques |
EP1947921B1 (en) * | 2007-01-17 | 2009-10-21 | MEN Mikro Elektronik GmbH | Electronic module |
DE202007002940U1 (de) | 2007-02-28 | 2007-04-26 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Elektronisches Bauteil und elektrischer Schaltungsträger |
DE102007029913A1 (de) | 2007-06-28 | 2009-01-02 | Robert Bosch Gmbh | Elektrisches Steuergerät |
DE102007032535B4 (de) | 2007-07-12 | 2009-09-24 | Continental Automotive Gmbh | Elektronisches Modul für eine integrierte mechatronische Getriebesteuerung |
JP4489112B2 (ja) | 2007-11-16 | 2010-06-23 | 三菱電機株式会社 | 電子基板の取付構造 |
DE102008040501A1 (de) * | 2008-07-17 | 2010-01-21 | Robert Bosch Gmbh | Verbesserte Wärmeabfuhr aus einem Steuergerät |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
DE102009053999A1 (de) * | 2009-11-19 | 2011-05-26 | Still Gmbh | Umrichter mit einem Kühlkörper |
JP2011249520A (ja) * | 2010-05-26 | 2011-12-08 | Mitsubishi Electric Corp | 電子制御装置 |
JP2012004216A (ja) * | 2010-06-15 | 2012-01-05 | Denso Corp | 電子制御装置 |
DE102010043312A1 (de) * | 2010-11-03 | 2012-05-03 | Robert Bosch Gmbh | Steuergerät für ein Kühlgebläse, Verfahren zur Herstellung eines Steuergeräts und Kühlsystem |
JP2013004953A (ja) * | 2011-06-22 | 2013-01-07 | Denso Corp | 電子制御装置 |
DE102011121823A1 (de) * | 2011-12-21 | 2013-07-11 | Wabco Gmbh | Elektronikeinheit mit einem zweiteiligen Gehäuse |
DE102013203932A1 (de) * | 2013-03-07 | 2014-09-11 | Continental Automotive Gmbh | Elektronische, optoelektronische oder elektrische Anordnung |
EP2914071A1 (en) * | 2014-02-28 | 2015-09-02 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Heat spreader in multilayer build ups |
DE102017212968B4 (de) * | 2016-08-05 | 2024-02-01 | Robert Bosch Gmbh | Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren |
DE102017207491A1 (de) | 2017-05-04 | 2018-11-08 | Bayerische Motoren Werke Aktiengesellschaft | Elektronikmodul |
DE202019103915U1 (de) * | 2019-07-16 | 2020-10-19 | Liebherr-Elektronik Gmbh | Anzeigevorrichtung |
CN114630547A (zh) * | 2020-12-10 | 2022-06-14 | 中兴通讯股份有限公司 | 散热装置及电子设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9003623U1 (de) * | 1990-03-28 | 1990-10-31 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte |
DE9007236U1 (de) * | 1990-06-29 | 1991-10-31 | Robert Bosch Gmbh, 70469 Stuttgart | Gehäuse für eine elektronische Schaltung |
DE4107312A1 (de) * | 1991-03-07 | 1992-09-10 | Telefunken Electronic Gmbh | Montageanordnung von halbleiterbauelementen auf einer leiterplatte |
JP3231349B2 (ja) * | 1991-05-07 | 2001-11-19 | 富士電機株式会社 | コンピュータシステム |
DE4222838C2 (de) * | 1991-09-21 | 2002-03-28 | Bosch Gmbh Robert | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
DE4218112B4 (de) * | 1992-01-21 | 2012-03-01 | Robert Bosch Gmbh | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
DE9200624U1 (de) * | 1992-01-21 | 1993-05-19 | Robert Bosch Gmbh, 7000 Stuttgart | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
DE4243180A1 (ja) * | 1992-02-21 | 1993-08-26 | Bosch Gmbh Robert | |
DE4232048C2 (de) * | 1992-09-24 | 1995-08-03 | Siemens Ag | Elektronisches Steuergerät |
DE4234022C2 (de) * | 1992-10-09 | 1995-05-24 | Telefunken Microelectron | Schichtschaltung mit mindestens einem Leistungswiderstand |
KR100307465B1 (ko) * | 1992-10-20 | 2001-12-15 | 야기 추구오 | 파워모듈 |
DE4240996C1 (de) * | 1992-12-05 | 1994-06-16 | Bosch Gmbh Robert | Verfahren zur Herstellung einer Verbundanordnung |
-
1995
- 1995-08-04 DE DE19528632A patent/DE19528632A1/de not_active Withdrawn
-
1996
- 1996-07-06 US US08/952,020 patent/US6084776A/en not_active Expired - Lifetime
- 1996-07-06 WO PCT/DE1996/001212 patent/WO1997006658A1/de active IP Right Grant
- 1996-07-06 KR KR10-1998-0700724A patent/KR100418148B1/ko not_active IP Right Cessation
- 1996-07-06 JP JP53683196A patent/JP4112614B2/ja not_active Expired - Lifetime
- 1996-07-06 EP EP96921898A patent/EP0842594B1/de not_active Expired - Lifetime
- 1996-07-06 ES ES96921898T patent/ES2131949T3/es not_active Expired - Lifetime
- 1996-07-06 DE DE59601566T patent/DE59601566D1/de not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000124644A (ja) * | 1998-10-12 | 2000-04-28 | Pfu Ltd | カード型回路モジュール装置およびこれに使用する実装基板 |
US7970815B1 (en) | 1999-11-14 | 2011-06-28 | Sony Corporation | Portable record and/or reproduce device, method of reproducing, and method of recording and reproducing |
US8010596B2 (en) | 1999-11-14 | 2011-08-30 | Sony Corporation | Portable record and/or reproducing device, reproducing method, and recording/reproducing method |
US8341217B2 (en) | 1999-11-14 | 2012-12-25 | Sony Corporation | Portable recording and/or reproducing device, reproducing method, and recording/reproducing method |
JP2009522761A (ja) * | 2005-12-30 | 2009-06-11 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 集積電子構成部材ならびに集積電子構成部材に対する冷却装置 |
JP2013062509A (ja) * | 2012-10-03 | 2013-04-04 | Denso Corp | 電子制御装置 |
JP2013232654A (ja) * | 2013-06-05 | 2013-11-14 | Denso Corp | 電子制御装置 |
JP2017191872A (ja) * | 2016-04-14 | 2017-10-19 | キヤノン株式会社 | カード型電子装置、スロット及び電子機器 |
JP6432918B1 (ja) * | 2017-10-27 | 2018-12-05 | 三菱電機株式会社 | 回路基板収納筐体 |
JP2019080016A (ja) * | 2017-10-27 | 2019-05-23 | 三菱電機株式会社 | 回路基板収納筐体 |
Also Published As
Publication number | Publication date |
---|---|
US6084776A (en) | 2000-07-04 |
KR19990036059A (ko) | 1999-05-25 |
KR100418148B1 (ko) | 2004-06-30 |
ES2131949T3 (es) | 1999-08-01 |
DE19528632A1 (de) | 1997-02-06 |
EP0842594B1 (de) | 1999-03-31 |
JP4112614B2 (ja) | 2008-07-02 |
DE59601566D1 (de) | 1999-05-06 |
WO1997006658A1 (de) | 1997-02-20 |
EP0842594A1 (de) | 1998-05-20 |
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