ES2131949T3 - Mando compuesto como minimo de dos cuerpos - Google Patents
Mando compuesto como minimo de dos cuerposInfo
- Publication number
- ES2131949T3 ES2131949T3 ES96921898T ES96921898T ES2131949T3 ES 2131949 T3 ES2131949 T3 ES 2131949T3 ES 96921898 T ES96921898 T ES 96921898T ES 96921898 T ES96921898 T ES 96921898T ES 2131949 T3 ES2131949 T3 ES 2131949T3
- Authority
- ES
- Spain
- Prior art keywords
- circuit board
- printed circuit
- support surface
- control
- found
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cookers (AREA)
Abstract
EN UN MANDO ELECTRICO, LA SUPERFICIE DE APOYO (28) DEL FONDO (26) DEL CUERPO SOBRE LA PLACA DE CIRCUITOS IMPRESOS (10) ES MAYOR QUE LA SUPERFICIE DE APOYO DE LA TAPA (18) DEL MANDO. ENTRE LA SUPERFICIE DE APOYO (28) DEL FONDO (26) Y LA PLACA DE CIRCUITOS IMPRESOS (10) SE HALLA UN MATERIAL DE RELLENO (34) QUE TIENE BUENAS PROPIEDADES TERMOCONDUCTIVAS Y DE ADHERENCIA. EL MATERIAL DE RELLENO SE ADHIERE TANTO A LA CARA INFERIOR (25) DE LA PLACA DE CIRCUITOS IMPRESOS (10) COMO A LA SUPERFICIE DE APOYO (28) DEL FONDO DEL CUERPO (26). LOS COMPONENTES DE POTENCIA (14) CON GRANDES PERDIDAS DE CALOR SE ENCUENTRAN A LA ALTURA DE LA SUPERFICIE DE APOYO (28) DEL CUERPO (26). CON ESTE DISEÑO DEL MANDO SE ASEGURA UNA ELEVADA DISIPACION DEL CALOR DE PERDIDA DEL COMPONENTE DE POTENCIA (14).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19528632A DE19528632A1 (de) | 1995-08-04 | 1995-08-04 | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2131949T3 true ES2131949T3 (es) | 1999-08-01 |
Family
ID=7768660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96921898T Expired - Lifetime ES2131949T3 (es) | 1995-08-04 | 1996-07-06 | Mando compuesto como minimo de dos cuerpos |
Country Status (7)
Country | Link |
---|---|
US (1) | US6084776A (es) |
EP (1) | EP0842594B1 (es) |
JP (1) | JP4112614B2 (es) |
KR (1) | KR100418148B1 (es) |
DE (2) | DE19528632A1 (es) |
ES (1) | ES2131949T3 (es) |
WO (1) | WO1997006658A1 (es) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19600619A1 (de) * | 1996-01-10 | 1997-07-17 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
DE19723409A1 (de) * | 1997-06-04 | 1998-12-10 | Bosch Gmbh Robert | Steuergerät |
DE19736962B4 (de) * | 1997-08-25 | 2009-08-06 | Robert Bosch Gmbh | Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben |
JP2000124644A (ja) * | 1998-10-12 | 2000-04-28 | Pfu Ltd | カード型回路モジュール装置およびこれに使用する実装基板 |
DE19919781A1 (de) * | 1999-04-30 | 2000-11-09 | Wuerth Elektronik Gmbh | Leiterplatte und Verfahren zu ihrer Anbringung |
DE19924080A1 (de) * | 1999-05-26 | 2000-12-21 | Siemens Ag | Grundplatte mit darauf angebrachter Leiterplatte |
IL130775A (en) * | 1999-07-02 | 2007-03-08 | Elta Systems Ltd | Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling |
FR2798814B1 (fr) * | 1999-09-22 | 2001-11-16 | Valeo Vision | Perfectionnements aux assemblages electroniques a drain thermique, notamment pour module de commande de lampe a decharge de projecteur de vehicule automobile |
JP4304558B2 (ja) * | 1999-11-14 | 2009-07-29 | ソニー株式会社 | 携帯機器 |
JP3648119B2 (ja) * | 2000-03-01 | 2005-05-18 | 株式会社ケーヒン | 電子回路基板の収容ケース |
JP3923703B2 (ja) * | 2000-03-29 | 2007-06-06 | ローム株式会社 | 放熱手段を有するプリント配線板 |
FR2821497B1 (fr) * | 2001-02-27 | 2004-07-16 | Bosch Gmbh Robert | Entrainement electrique notamment entrainement d'essuie-glaces |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
DE10214363A1 (de) * | 2002-03-30 | 2003-10-16 | Bosch Gmbh Robert | Kühlanordnung und Elektrogerät mit einer Kühlanordnung |
DE10300175B4 (de) * | 2003-01-08 | 2016-12-29 | Hella Kgaa Hueck & Co. | Elektronische Baugruppe mit Wärme ableitendem Gehäuseteil |
DE20301773U1 (de) * | 2003-02-05 | 2003-04-17 | Leopold Kostal GmbH & Co. KG, 58507 Lüdenscheid | Elektrische Einrichtung |
DE10315299A1 (de) * | 2003-04-04 | 2004-10-14 | Hella Kg Hueck & Co. | Gehäuse |
ES2298809T3 (es) | 2003-08-01 | 2008-05-16 | Vdo Automotive Ag | Unidad electronica asi como procedimiento para fabricar una unidad electronica. |
TWI333805B (en) | 2003-10-03 | 2010-11-21 | Osram Sylvania Inc | Housing for electronic ballast |
ITMI20032131A1 (it) * | 2003-11-05 | 2005-05-06 | Sp El Srl | Contenitore ad elevata capacita' di dissipazione per |
US7145774B2 (en) * | 2003-12-29 | 2006-12-05 | Intel Corporation | Backside cooling apparatus for modular platforms |
FR2872992B1 (fr) * | 2004-07-09 | 2006-09-29 | Valeo Vision Sa | Assemblage electronique a drain thermique notamment pour module de commande de lampe a decharge de projecteurs de vehicule automobile |
JP4196904B2 (ja) * | 2004-08-26 | 2008-12-17 | 株式会社デンソー | 電子制御装置 |
DE102005039374A1 (de) * | 2005-08-19 | 2007-02-22 | BSH Bosch und Siemens Hausgeräte GmbH | Gehäuse für Elektronikbaugruppen |
DE102005063281A1 (de) * | 2005-12-30 | 2007-07-05 | Robert Bosch Gmbh | Integriertes elektronisches Bauteil sowie Kühlvorrichtung für ein integriertes elektronisches Bauteil |
KR100752009B1 (ko) * | 2006-03-06 | 2007-08-28 | 삼성전기주식회사 | Led가 구비된 백라이트유닛 |
JP4357504B2 (ja) * | 2006-06-29 | 2009-11-04 | 株式会社日立製作所 | エンジン制御装置 |
US7888601B2 (en) * | 2006-12-29 | 2011-02-15 | Cummins Power Generations IP, Inc. | Bus bar interconnection techniques |
EP1947921B1 (en) * | 2007-01-17 | 2009-10-21 | MEN Mikro Elektronik GmbH | Electronic module |
DE202007002940U1 (de) | 2007-02-28 | 2007-04-26 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Elektronisches Bauteil und elektrischer Schaltungsträger |
DE102007029913A1 (de) | 2007-06-28 | 2009-01-02 | Robert Bosch Gmbh | Elektrisches Steuergerät |
DE102007032535B4 (de) | 2007-07-12 | 2009-09-24 | Continental Automotive Gmbh | Elektronisches Modul für eine integrierte mechatronische Getriebesteuerung |
JP4489112B2 (ja) | 2007-11-16 | 2010-06-23 | 三菱電機株式会社 | 電子基板の取付構造 |
DE102008040501A1 (de) * | 2008-07-17 | 2010-01-21 | Robert Bosch Gmbh | Verbesserte Wärmeabfuhr aus einem Steuergerät |
JP2010245174A (ja) * | 2009-04-02 | 2010-10-28 | Denso Corp | 電子制御ユニット及びその製造方法 |
DE102009053999A1 (de) * | 2009-11-19 | 2011-05-26 | Still Gmbh | Umrichter mit einem Kühlkörper |
JP2011249520A (ja) * | 2010-05-26 | 2011-12-08 | Mitsubishi Electric Corp | 電子制御装置 |
JP2012004216A (ja) * | 2010-06-15 | 2012-01-05 | Denso Corp | 電子制御装置 |
DE102010043312A1 (de) * | 2010-11-03 | 2012-05-03 | Robert Bosch Gmbh | Steuergerät für ein Kühlgebläse, Verfahren zur Herstellung eines Steuergeräts und Kühlsystem |
JP2013004953A (ja) * | 2011-06-22 | 2013-01-07 | Denso Corp | 電子制御装置 |
DE102011121823A1 (de) * | 2011-12-21 | 2013-07-11 | Wabco Gmbh | Elektronikeinheit mit einem zweiteiligen Gehäuse |
JP5408320B2 (ja) * | 2012-10-03 | 2014-02-05 | 株式会社デンソー | 電子制御装置 |
DE102013203932A1 (de) * | 2013-03-07 | 2014-09-11 | Continental Automotive Gmbh | Elektronische, optoelektronische oder elektrische Anordnung |
JP6027945B2 (ja) * | 2013-06-05 | 2016-11-16 | 株式会社デンソー | 電子制御装置 |
EP2914071A1 (en) * | 2014-02-28 | 2015-09-02 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Heat spreader in multilayer build ups |
JP6800601B2 (ja) * | 2016-04-14 | 2020-12-16 | キヤノン株式会社 | カード型電子装置及び電子機器 |
DE102017212968B4 (de) * | 2016-08-05 | 2024-02-01 | Robert Bosch Gmbh | Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren |
DE102017207491A1 (de) | 2017-05-04 | 2018-11-08 | Bayerische Motoren Werke Aktiengesellschaft | Elektronikmodul |
JP6432918B1 (ja) * | 2017-10-27 | 2018-12-05 | 三菱電機株式会社 | 回路基板収納筐体 |
DE202019103915U1 (de) * | 2019-07-16 | 2020-10-19 | Liebherr-Elektronik Gmbh | Anzeigevorrichtung |
CN114630547A (zh) * | 2020-12-10 | 2022-06-14 | 中兴通讯股份有限公司 | 散热装置及电子设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9003623U1 (de) * | 1990-03-28 | 1990-10-31 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Abführen der Verlustwärme von einer Leiterplatte |
DE9007236U1 (de) * | 1990-06-29 | 1991-10-31 | Robert Bosch Gmbh, 70469 Stuttgart | Gehäuse für eine elektronische Schaltung |
DE4107312A1 (de) * | 1991-03-07 | 1992-09-10 | Telefunken Electronic Gmbh | Montageanordnung von halbleiterbauelementen auf einer leiterplatte |
JP3231349B2 (ja) * | 1991-05-07 | 2001-11-19 | 富士電機株式会社 | コンピュータシステム |
DE4222838C2 (de) * | 1991-09-21 | 2002-03-28 | Bosch Gmbh Robert | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
DE4218112B4 (de) * | 1992-01-21 | 2012-03-01 | Robert Bosch Gmbh | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
DE9200624U1 (de) * | 1992-01-21 | 1993-05-19 | Robert Bosch Gmbh, 7000 Stuttgart | Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge |
DE4243180A1 (es) * | 1992-02-21 | 1993-08-26 | Bosch Gmbh Robert | |
DE4232048C2 (de) * | 1992-09-24 | 1995-08-03 | Siemens Ag | Elektronisches Steuergerät |
DE4234022C2 (de) * | 1992-10-09 | 1995-05-24 | Telefunken Microelectron | Schichtschaltung mit mindestens einem Leistungswiderstand |
KR100307465B1 (ko) * | 1992-10-20 | 2001-12-15 | 야기 추구오 | 파워모듈 |
DE4240996C1 (de) * | 1992-12-05 | 1994-06-16 | Bosch Gmbh Robert | Verfahren zur Herstellung einer Verbundanordnung |
-
1995
- 1995-08-04 DE DE19528632A patent/DE19528632A1/de not_active Withdrawn
-
1996
- 1996-07-06 US US08/952,020 patent/US6084776A/en not_active Expired - Lifetime
- 1996-07-06 WO PCT/DE1996/001212 patent/WO1997006658A1/de active IP Right Grant
- 1996-07-06 KR KR10-1998-0700724A patent/KR100418148B1/ko not_active IP Right Cessation
- 1996-07-06 JP JP53683196A patent/JP4112614B2/ja not_active Expired - Lifetime
- 1996-07-06 EP EP96921898A patent/EP0842594B1/de not_active Expired - Lifetime
- 1996-07-06 ES ES96921898T patent/ES2131949T3/es not_active Expired - Lifetime
- 1996-07-06 DE DE59601566T patent/DE59601566D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6084776A (en) | 2000-07-04 |
KR19990036059A (ko) | 1999-05-25 |
KR100418148B1 (ko) | 2004-06-30 |
DE19528632A1 (de) | 1997-02-06 |
EP0842594B1 (de) | 1999-03-31 |
JP4112614B2 (ja) | 2008-07-02 |
JPH11509977A (ja) | 1999-08-31 |
DE59601566D1 (de) | 1999-05-06 |
WO1997006658A1 (de) | 1997-02-20 |
EP0842594A1 (de) | 1998-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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