JPH0519306B2 - - Google Patents

Info

Publication number: JPH0519306B2
Authority: JP; Japan
Prior art keywords: semiconductor element; resin; wiring board; conductor wiring; pressure
Prior art date: 1988-02-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP63024219A

Other languages

English (en)

Japanese (ja)

Other versions

JPH01199440A (ja

Inventor

Tomohiko Suzuki

Izumi Okamoto

Shinsuke Nakamoto

Masayoshi Mihata

Kenzo Hatada

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Holdings Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-02-04

Filing date

1988-02-04

Publication date

1993-03-16

1988-02-04 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1988-02-04 Priority to JP63024219A priority Critical patent/JPH01199440A/ja

1989-08-10 Publication of JPH01199440A publication Critical patent/JPH01199440A/ja

1993-03-16 Publication of JPH0519306B2 publication Critical patent/JPH0519306B2/ja

Status Granted legal-status Critical Current

Links

239000004065 semiconductor Substances 0.000 claims description 36
239000011347 resin Substances 0.000 claims description 17
229920005989 resin Polymers 0.000 claims description 17
239000004020 conductor Substances 0.000 claims description 15
238000000034 method Methods 0.000 claims description 8
238000004519 manufacturing process Methods 0.000 claims description 4
238000004806 packaging method and process Methods 0.000 claims 1
229910052782 aluminium Inorganic materials 0.000 description 5
239000004593 Epoxy Substances 0.000 description 4
229910052737 gold Inorganic materials 0.000 description 4
238000010438 heat treatment Methods 0.000 description 4
229920001187 thermosetting polymer Polymers 0.000 description 4
239000000853 adhesive Substances 0.000 description 3
230000001070 adhesive effect Effects 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
230000000694 effects Effects 0.000 description 3
239000011521 glass Substances 0.000 description 3
238000009461 vacuum packaging Methods 0.000 description 3
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
239000000919 ceramic Substances 0.000 description 2
238000001816 cooling Methods 0.000 description 2
229920001296 polysiloxane Polymers 0.000 description 2
238000003825 pressing Methods 0.000 description 2
239000004677 Nylon Substances 0.000 description 1
239000004743 Polypropylene Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
229920001778 nylon Polymers 0.000 description 1
239000005022 packaging material Substances 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
-1 polypropylene Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
- H01L2224/75101—Chamber
- H01L2224/75102—Vacuum chamber
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83053—Bonding environment
- H01L2224/8309—Vacuum
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83209—Compression bonding applying isostatic pressure, e.g. degassing using vacuum or a pressurised liquid

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Wire Bonding (AREA)

JP63024219A 1988-02-04 1988-02-04 半導体装置の製造方法 Granted JPH01199440A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP63024219A JPH01199440A (ja)	1988-02-04	1988-02-04	半導体装置の製造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP63024219A JPH01199440A (ja)	1988-02-04	1988-02-04	半導体装置の製造方法

Publications (2)

Publication Number	Publication Date
JPH01199440A JPH01199440A (ja)	1989-08-10
JPH0519306B2 true JPH0519306B2 (ko)	1993-03-16

Family

ID=12132174

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP63024219A Granted JPH01199440A (ja)	1988-02-04	1988-02-04	半導体装置の製造方法

Country Status (1)

Country	Link
JP (1)	JPH01199440A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH1041694A (ja) *	1996-07-25	1998-02-13	Sharp Corp	半導体素子の基板実装構造及びその実装方法
JP4513235B2 (ja) *	2001-05-31	2010-07-28	ソニー株式会社	フリップチップ実装装置
JP4710205B2 (ja) *	2001-09-06	2011-06-29	ソニー株式会社	フリップチップ実装方法
US7456050B2 (en) *	2003-07-01	2008-11-25	Stmicroelectronics, Inc.	System and method for controlling integrated circuit die height and planarity
JP4780023B2 (ja) *	2007-04-09	2011-09-28	日立化成工業株式会社	マルチチップモジュールの実装方法

1988
- 1988-02-04 JP JP63024219A patent/JPH01199440A/ja active Granted

Also Published As

Publication number	Publication date
JPH01199440A (ja)	1989-08-10

Publication	Publication Date	Title
JPH0519306B2 (ko)	1993-03-16
JPH036828A (ja)	1991-01-14	半導体装置
JP2003197853A5 (ko)	2005-07-28
JP2903697B2 (ja)	1999-06-07	半導体装置の製造方法及び半導体装置の製造装置
JPS63151033A (ja)	1988-06-23	半導体装置の製造方法
JP2001308146A (ja)	2001-11-02	チップキャリアに半導体チップを取り付けるための装置
JPH034542A (ja)	1991-01-10	半導体装置の製造方法
US5930652A (en)	1999-07-27	Semiconductor encapsulation method
JPH02122531A (ja)	1990-05-10	電子部品の実装装置
JPH10173007A (ja)	1998-06-26	ベアチップ搭載装置
JPH0558660B2 (ko)	1993-08-27
JPS62132331A (ja)	1987-06-15	半導体装置の製造方法
JPH012331A (ja)	1989-01-06	半導体装置の製造方法
JPH01160029A (ja)	1989-06-22	半導体装置
JP3267071B2 (ja)	2002-03-18	Ｔａｂ−セル圧着装置及び圧着方法
JPH04254343A (ja)	1992-09-09	半導体装置の実装方法
JP2523641B2 (ja)	1996-08-14	半導体装置
JPS62252946A (ja)	1987-11-04	半導体装置の製造方法
JPH02110951A (ja)	1990-04-24	半導体装置の製造方法および装置
JPH0629349A (ja)	1994-02-04	半導体素子の実装方法
JPS63151031A (ja)	1988-06-23	半導体装置の接続方法
JPH0797596B2 (ja)	1995-10-18	半導体装置の製造方法
JPS63240036A (ja)	1988-10-05	半導体装置の製造方法
JP2712654B2 (ja)	1998-02-16	電子部品の実装構造及び製造方法
JPH0482240A (ja)	1992-03-16	半導体装置の製造方法