JPH0214028Y2 - - Google Patents
Info
- Publication number
- JPH0214028Y2 JPH0214028Y2 JP1981120716U JP12071681U JPH0214028Y2 JP H0214028 Y2 JPH0214028 Y2 JP H0214028Y2 JP 1981120716 U JP1981120716 U JP 1981120716U JP 12071681 U JP12071681 U JP 12071681U JP H0214028 Y2 JPH0214028 Y2 JP H0214028Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- electrode
- lead
- display board
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- CMSGUKVDXXTJDQ-UHFFFAOYSA-N 4-(2-naphthalen-1-ylethylamino)-4-oxobutanoic acid Chemical compound C1=CC=C2C(CCNC(=O)CCC(=O)O)=CC=CC2=C1 CMSGUKVDXXTJDQ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【考案の詳細な説明】
本考案は、とくにガラス基板上に設けた表示用
電極を外部に取り出す構造を有する平型表示板の
リード取り出し方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to a lead extraction method for a flat display panel having a structure in which display electrodes provided on a glass substrate are extracted to the outside.
一盤にこれら表示板は表示用電極とこれを外部
回路へ取り出すリード電極とをガラス基板上に於
て、そのリード電極の一部を、外部取り出し用リ
ードへ接続する構造となつている。この場合、ガ
ラス基板上のリード電極と外部取り出し用リード
との接続方法には、圧着、溶接、半田付等がある
が、半田付で行なうのが一般的である。又、ガラ
ス基板上のリード電極の形成方法には、メツキ、
蒸着、スクリーン印刷等があるが、スクリーン印
刷で行なうのが一盤的である。これに対し、外部
取り出し用リードは、金属製のテープ状、縒り線
状あるいは線状のものが使われる。これら薄い膜
状電極とリードとを半田付で接続した場合、リー
ドは後工程で外部電気回路に接続する為に、ある
程度の強度を必要とし、膜状電極よりはるかに厚
い為、機械的強度は薄い膜状電極のガラス基板へ
の接着強度で決定される。その為リードに加えら
れる外的な力、特に膜状電極を剥離させる方向の
力に極めて弱い。又、薄い膜状電極が外部の湿気
や活性ガス等に長期にさらされると化学的反応な
どによつて除々に劣化する。 All of these display boards have a structure in which a display electrode and a lead electrode for taking out the electrode to an external circuit are placed on a glass substrate, and a part of the lead electrode is connected to a lead for taking out to the outside. In this case, methods for connecting the lead electrodes on the glass substrate and the leads for external extraction include crimping, welding, soldering, etc., but soldering is generally used. In addition, methods for forming lead electrodes on glass substrates include plating,
There are methods such as vapor deposition and screen printing, but screen printing is the only method used. On the other hand, as the lead for external extraction, a metal tape, twisted wire, or wire is used. When these thin film electrodes and leads are connected by soldering, the leads require a certain degree of strength because they are connected to an external electrical circuit in a later process, and since they are much thicker than the film electrodes, their mechanical strength is low. It is determined by the adhesion strength of the thin film electrode to the glass substrate. Therefore, it is extremely susceptible to external force applied to the lead, especially force in a direction that causes the membrane electrode to peel off. Furthermore, when a thin film electrode is exposed to external moisture, active gas, etc. for a long period of time, it gradually deteriorates due to chemical reactions and the like.
上述のような欠点を補う為、従来用いられてい
る構成の一つに、電極とリードの接続部分を有機
物で被覆する手段がある。この場合、有機物の材
料選択がむづかしく、下記の条件を満足するもの
でなければならない。 In order to compensate for the above-mentioned drawbacks, one of the structures conventionally used is to coat the connection portion between the electrode and the lead with an organic substance. In this case, it is difficult to select the organic material, which must satisfy the following conditions.
(イ) 膜状電極及びリードとの接続部分を外部の湿
気や活性ガスから保護できる材料であること。(a) The material must be able to protect the connection part with the membrane electrode and lead from external moisture and active gas.
(ロ) ガラス基板及び金属製リードとの接着性が良
好であること。(b) Good adhesion to the glass substrate and metal leads.
(ハ) 表示板の使用される環境変化、特に温度が−
40℃から＋70℃温度まで変化しても、ガラス基
板及び接続部分に損傷を起さず、良好な接着力
を持続すること。(c) Changes in the environment in which the display board is used, especially when the temperature is -
Even if the temperature changes from 40°C to +70°C, the glass substrate and connecting parts will not be damaged and maintain good adhesive strength.
(ニ) 材料回路が安く、かつ使用法が簡単であるこ
と。(d) The material circuit is cheap and easy to use.
これらを満足させる為、従来よく用いられてい
る材料に、エポキシ系接着剤とシリコンゴム系接
着剤がある、但し、これらの接着剤は単独では、
前記条件(イ)〜(ニ)を満足できず、ガラス基板のリー
ド接続部に二重に被覆する方法がとられていた。
しかしながら、接着剤を二重に被覆する為、工数
が大きくなり、しかも、エポキシ系接着剤、シリ
コンゴム系接着剤共にその硬化の為に、10時間な
いし70時間必要である為、前述の条件(ニ)を充分に
は満足できないという欠点があつた。 In order to satisfy these requirements, epoxy adhesives and silicone rubber adhesives are commonly used materials. However, these adhesives do not work alone.
Since the above conditions (a) to (d) cannot be satisfied, a method has been adopted in which the lead connection portion of the glass substrate is coated twice.
However, since the adhesive is coated twice, the number of man-hours increases, and since both the epoxy adhesive and the silicone rubber adhesive require 10 to 70 hours to cure, the above-mentioned conditions ( The drawback was that (d) could not be fully satisfied.
本考案は、上記の様な欠点を補い、信頼性の高
い電極接続部を有した安価な表示板を提供するこ
とにある。 The object of the present invention is to compensate for the above-mentioned drawbacks and provide an inexpensive display panel with highly reliable electrode connections.
本考案によれば、ガラス基板上に設けた表示用
電極の端部と外部取り出し用金属リードとを電気
的に接続した表示板において、接続部にSiO2粉
末を混合した紫外線硬化性接着剤を塗布し、更に
接着剤の塗布面にガラス製補強板を配置し、紫外
線を照射して接着剤を硬化させてなる事を特徴と
する表示板が得られる。 According to the present invention, in a display board in which the ends of display electrodes provided on a glass substrate and metal leads for external extraction are electrically connected, an ultraviolet curable adhesive mixed with SiO 2 powder is applied to the connection part. A display board is obtained by applying the adhesive, further arranging a glass reinforcing plate on the surface to which the adhesive is applied, and curing the adhesive by irradiating it with ultraviolet rays.
次に図面を用いて本考案を詳細に説明する。 Next, the present invention will be explained in detail using the drawings.
第１図は本考案を放電表示板に適用した場合の
実施例である。第１図に於いて約２mm厚の第一の
ガラス基板１に銀電極２を約10μmの厚さにスク
リーン印刷によつて形成する。これに対向して約
２mm厚の第二ガラス基板４を準備し、第一のガラ
ス基板１上の銀電極に対向する部分に、ネサ電極
５を形成する。これら電極の形成された第一のガ
ラス基板１と第二のガラス基板４とを放電空間３
が保たれるように組み合わせ周囲をフリツトガラ
ス６で気密封止する。この場合、銀電極２及びネ
サ電極５はガラス基板上で延長されて気密封止部
より外部に引き出してリード電極として構成す
る。しかる後放電空間に電離性ガスを封入する。
外部取り出し用の金属リード７は例えば52鉄・ニ
ツケル合金に半田メツキした約0.3mm厚のものと
する。ガラス基板１に形成された銀電極２と金属
リード７とを半田８によつて半田付により接続す
る。次に、これら半田付部分及び銀電極２を覆う
ように、粒径約20μmのSiO2粉末と紫外線硬化性
接着剤とを重量比50：50で混合した樹脂９を塗布
し、この上に約1.3mm厚のガラス製補強板１０を
置く。この場合、紫外線硬化性接着剤としては、
例えば明星チヤーチル（株）製の商品名フオー
ト・ポンド100を用いる。次にこの表示板１１を
紫外線ランプで照射して樹脂９を硬化させ、ガラ
ス製補強板１０と表示板１１とを接着する。この
ような構造を有する表示板は、紫外線硬化性接着
剤のガラスとの良好な接着性と、SiO2粉末を混
ぜたことによる膨張係数の低下により、前述した
条件(イ)，(ロ)および(ハ)を満足し、更に単層の接着剤
である為に、簡単な作業でしかも、紫外線の照射
により、短時間で製作できるという著るしい特長
をもつ。 FIG. 1 shows an embodiment in which the present invention is applied to a discharge display board. In FIG. 1, silver electrodes 2 are formed on a first glass substrate 1 with a thickness of about 2 mm to a thickness of about 10 μm by screen printing. A second glass substrate 4 having a thickness of about 2 mm is prepared opposite to this, and a NESA electrode 5 is formed on a portion of the first glass substrate 1 facing the silver electrode. The first glass substrate 1 and the second glass substrate 4 on which these electrodes are formed are placed in a discharge space 3.
The periphery of the combination is hermetically sealed with fritted glass 6 so that the temperature is maintained. In this case, the silver electrode 2 and the NESA electrode 5 are extended on the glass substrate and drawn out from the hermetically sealed portion to constitute a lead electrode. After that, the discharge space is filled with ionizable gas.
The metal lead 7 for external extraction is made of, for example, a 52 iron/nickel alloy soldered and approximately 0.3 mm thick. A silver electrode 2 formed on a glass substrate 1 and a metal lead 7 are connected by soldering with a solder 8. Next, a resin 9 made by mixing SiO 2 powder with a particle size of about 20 μm and an ultraviolet curable adhesive in a weight ratio of 50:50 is applied to cover these soldered parts and the silver electrode 2, and about A glass reinforcing plate 10 with a thickness of 1.3 mm is placed. In this case, the UV curable adhesive is
For example, the product name FOOT POND 100 manufactured by Myojo Churchill Co., Ltd. is used. Next, this display board 11 is irradiated with an ultraviolet lamp to harden the resin 9, and the glass reinforcing board 10 and the display board 11 are bonded together. A display board with such a structure can meet the conditions (a), (b) and above due to the good adhesion of the ultraviolet curable adhesive to the glass and the reduction in expansion coefficient due to the addition of SiO 2 powder. It satisfies (c), and since it is a single layer adhesive, it has the remarkable feature that it can be manufactured easily and in a short time by irradiation with ultraviolet rays.
本実施例では、SiO2粉末と紫外線硬化性接着
剤の混合率をそれぞれ50％、50％としたが、実験
によれば明星チヤーチルのフオト・ポンド100を
使用した場合、SiO2粉末の混合率を40％ないし
70％の範囲にしても前述の条件(イ)〜(ニ)を満足する
ことがわかつている。 In this example, the mixing ratio of SiO 2 powder and ultraviolet curable adhesive was 50% and 50%, respectively, but according to experiments, when Myojo Churchill's Foto Pond 100 was used, the mixing ratio of SiO 2 powder was 50% and 50%, respectively. 40% or more
It has been found that the above-mentioned conditions (a) to (d) are satisfied even in the range of 70%.
又、本実施例の放電表示板以外の類似の表示板
例えば、螢光表示板あるいは液晶表示板へも全く
同様に適用できる。 Furthermore, the present invention can be applied in exactly the same manner to similar display boards other than the discharge display board of this embodiment, such as fluorescent display boards or liquid crystal display boards.
第１図は本考案の実施例の断面図である。
１，４……ガラス基板、２，５……電極、３…
…放電空間、６……フリツト、７……金属リー
ド、８……半田、９……SiO2粉末を混合した紫
外線硬化性接着剤、１０……ガラス製補強板。
FIG. 1 is a sectional view of an embodiment of the present invention. 1, 4... Glass substrate, 2, 5... Electrode, 3...
...Discharge space, 6...Fritt, 7...Metal lead, 8...Solder, 9...UV curable adhesive mixed with SiO 2 powder, 10...Glass reinforcing plate.
Claims (1)
取り出し用金属リードとを電気的に接続した表示
板において、前記接続部にSiO2粉末を混合した
紫外線硬化性接着剤を用い、かつ前記接着剤上に
ガラス製補強板を配置したことを特徴とする表示
板。 In a display board in which the end of a display electrode provided on a glass substrate and a metal lead for external extraction are electrically connected, an ultraviolet curable adhesive mixed with SiO 2 powder is used in the connection part, and the adhesive A display board characterized by having a glass reinforcing board placed on top of the display board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12071681U JPS5826026U (en) | 1981-08-14 | 1981-08-14 | display board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12071681U JPS5826026U (en) | 1981-08-14 | 1981-08-14 | display board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5826026U JPS5826026U (en) | 1983-02-19 |
| JPH0214028Y2 true JPH0214028Y2 (en) | 1990-04-17 |
Family
ID=29914698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12071681U Granted JPS5826026U (en) | 1981-08-14 | 1981-08-14 | display board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826026U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102132344B1 (en) * | 2016-12-28 | 2020-07-09 | 삼성전자주식회사 | Panel module and display apparatus having the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52137669A (en) * | 1976-05-12 | 1977-11-17 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit unit |
| JPS5518401A (en) * | 1978-07-25 | 1980-02-08 | Sumitomo Bakelite Co Ltd | Ink composition for coating flexible circuit base board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55181278U (en) * | 1979-06-12 | 1980-12-26 |
-
1981
- 1981-08-14 JP JP12071681U patent/JPS5826026U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52137669A (en) * | 1976-05-12 | 1977-11-17 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit unit |
| JPS5518401A (en) * | 1978-07-25 | 1980-02-08 | Sumitomo Bakelite Co Ltd | Ink composition for coating flexible circuit base board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5826026U (en) | 1983-02-19 |
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