JPS6141110Y2 - - Google Patents
Info
- Publication number
- JPS6141110Y2 JPS6141110Y2 JP1979138868U JP13886879U JPS6141110Y2 JP S6141110 Y2 JPS6141110 Y2 JP S6141110Y2 JP 1979138868 U JP1979138868 U JP 1979138868U JP 13886879 U JP13886879 U JP 13886879U JP S6141110 Y2 JPS6141110 Y2 JP S6141110Y2
- Authority
- JP
- Japan
- Prior art keywords
- display board
- protective layer
- heat
- silicone rubber
- resistant vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011241 protective layer Substances 0.000 claims description 18
- 229920002379 silicone rubber Polymers 0.000 claims description 16
- 239000004945 silicone rubber Substances 0.000 claims description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 14
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 239000011521 glass Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Insulated Conductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【考案の詳細な説明】
本考案は放電表示板、螢光表示管、液晶表示板
などの様に電気信号により数字、文字等を表示す
る表示板、特に内部電極と外部電気回路との接続
部分を改良した表示板に関する。[Detailed description of the invention] The present invention is applicable to display boards that display numbers, characters, etc. by electrical signals, such as discharge display boards, fluorescent display tubes, and liquid crystal display boards, especially the connecting parts between internal electrodes and external electric circuits. This invention relates to an improved display board.
従来の放電表示板の外部回路との接続部分は表
示板の端子部に金属でできている外部リードを半
田付等で接続した後その接続部分を覆うようにシ
リコンゴムの保護層を設け、更にこの保護層を覆
うようにエポキシ樹脂の保護層を設けた如き構造
をなしていた。 The connection part of the conventional discharge display board to the external circuit is made by connecting an external lead made of metal to the terminal part of the display board by soldering, etc., and then applying a protective layer of silicone rubber to cover the connection part. The structure was such that a protective layer of epoxy resin was provided to cover this protective layer.
従来の放電表示板の外部回路との接続部分の一
例を第1図を用いて説明する。第1図は従来の端
子部の構造の一例を示す断面図で、電極ガラス基
板1の上に形成された電極2は封止部3の外へ引
き出され、耐熱ビニールで被覆されたリード4を
半田5で接続して、該リードに外部回路の電気信
号を加える様にしたものである。さらにこの構造
においては耐湿度の目的でシリコンゴム6で接続
部を覆い、その上からリードはがれを補強するた
めにエポキシ樹脂7でシリコンゴム及びリードの
耐熱ビニール被覆部を覆つている。しかしこの構
造では、エポキシ樹脂7を多量に使用するため低
温(−40〜−50℃)においてはエポキシ樹脂7と
電極ガラス基板1の膨張差によりはがれ、割れ等
を生ずる欠点がある。さらにこの構造では、シリ
コンゴム6とエポキシ樹脂7の硬化までの時間が
長くなるという欠点もある。さらにまたエポキシ
樹脂と耐熱ビニールの接着性が悪い欠点がある。 An example of a connection portion of a conventional discharge display board with an external circuit will be explained with reference to FIG. FIG. 1 is a cross-sectional view showing an example of the structure of a conventional terminal section, in which an electrode 2 formed on an electrode glass substrate 1 is drawn out of a sealing section 3, and a lead 4 covered with heat-resistant vinyl is pulled out. The leads are connected with solder 5, and electrical signals from an external circuit are applied to the leads. Further, in this structure, the connection portion is covered with silicone rubber 6 for the purpose of moisture resistance, and the silicone rubber and heat-resistant vinyl covering portion of the lead is covered with epoxy resin 7 to reinforce the lead from peeling. However, this structure has the disadvantage that since a large amount of epoxy resin 7 is used, the epoxy resin 7 and the electrode glass substrate 1 may peel off and crack due to the difference in expansion at low temperatures (-40 to -50 DEG C.). Furthermore, this structure also has the disadvantage that it takes a long time for the silicone rubber 6 and the epoxy resin 7 to harden. Furthermore, there is a drawback that the adhesion between the epoxy resin and the heat-resistant vinyl is poor.
以上述べた如く従来の端子部の構造では
(1) 低温(−40〜−50℃)における信頼性が低か
つた。 As described above, the conventional terminal structure has (1) low reliability at low temperatures (-40 to -50°C);
(2) 捕強材の硬化時間が長く、製作に時間がかか
る。(2) The curing time of the reinforcing material is long, so it takes time to manufacture.
(3) リードに耐熱ビニールの絶縁被覆がある時、
耐熱ビニールとエポキシ樹脂との接着性が悪
い。(3) When the lead has a heat-resistant vinyl insulation coating,
Adhesion between heat-resistant vinyl and epoxy resin is poor.
という欠点があつた。There was a drawback.
本考案の目的は上記の欠点を除き信頼性が高
く、製作容易な端子部構造を有する表示板を提供
することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a display board having a terminal structure that is highly reliable and easy to manufacture, while eliminating the above-mentioned drawbacks.
本考案による表示板の端子部の構造は、先に述
べた従来の端子部構造のシリコンゴムの保護層と
エポキシ樹脂の保護層の各保護層の材質を互いに
逆転し、その上、エポキシ樹脂に変えて紫外線硬
化性接着材を用いた構造としたものである。 The structure of the terminal part of the display board according to the present invention is that the materials of the silicone rubber protective layer and the epoxy resin protective layer of the conventional terminal part structure described above are reversed, and in addition, the epoxy resin is used. Instead, it has a structure that uses an ultraviolet curable adhesive.
本考案によれば、電気信号により数字、文字等
を表示する表示板において表示板の電極と外部リ
ードとの接続部にその接続部分を覆うように紫外
線硬化性接着剤の第1の保護層を設け、さらにこ
の第1の保護層を覆うようにシリコンゴムの第2
の保護層を設けたことを特徴とする表示板が得ら
れる。 According to the present invention, in a display board that displays numbers, characters, etc. using electrical signals, a first protective layer of ultraviolet curable adhesive is applied to the connection portion between the electrode of the display board and the external lead so as to cover the connection portion. A second layer of silicone rubber is provided to cover the first protective layer.
A display board characterized by having a protective layer provided thereon is obtained.
即ち、本考案による表示板は、紫外線硬化性接
着剤を用いることにより、硬化の為の時間がほと
んどいらない為、表示板製作時間を大幅に短縮す
ることが出来、更にシリコンゴムの保護層で覆う
ことにより端子接続部が低温でのはがれ、割れの
発生を防止して低温における信頼性を向上させる
ことが出来た。又、外部リードの保護材である耐
熱ビニールとシリコンゴムとの接着性も優れてお
り、外部回路との接続が容易なフラツトケーブル
を用いた場合にも、耐熱ビニールで出来たケーブ
ルの表面で保護材の剥離が起こらず、この面でも
信頼性の高い表示板が得られる。 In other words, the display board according to the present invention uses an ultraviolet curable adhesive, which requires almost no time for curing, so the display board production time can be significantly shortened, and it is also covered with a protective layer of silicone rubber. This prevents the terminal connections from peeling off or cracking at low temperatures, thereby improving reliability at low temperatures. In addition, the adhesion between the heat-resistant vinyl and silicone rubber that protects the external leads is excellent, and even when using a flat cable that is easy to connect to an external circuit, the surface of the cable made of heat-resistant vinyl can be easily bonded. Peeling of the protective material does not occur, and a highly reliable display board can be obtained in this respect as well.
とくに本考案によれば、表示板の電極と表示板
の電極との接続部を除いた部分が耐熱性のビニー
ルで被覆されたリードを接続する端子部に接続部
分を覆うように硬化後の硬度がシヨアDスケール
60〜85の紫外線硬化接着材の第1の保護層を設
け、更にこの第1の保護層及び上記耐熱ビニール
被覆部を覆うようにシリコンゴムの第2の保護層
を設けたことをも特徴とする表示板が得られる。 In particular, according to the present invention, the terminal part for connecting the lead is coated with heat-resistant vinyl, except for the connection part between the electrodes of the display board and the electrode of the display board, and the hardness after curing is applied to cover the connection part. is Shore D scale
It is also characterized by providing a first protective layer of an ultraviolet curable adhesive having a rating of 60 to 85, and further providing a second protective layer of silicone rubber to cover this first protective layer and the heat-resistant vinyl coating. A display board is obtained.
第2図は本考案による表示板端子構造の1例を
示す断面図で、8は紫外線により硬化し、硬度が
シヨアDスケール60〜85になる接着材第1の保護
層で、硬化に要する時間は数秒から10分程度とな
り大幅な工程短縮がなされた。さらに硬化後のシ
ヨア硬度の値が示す様にハードであることは勿
論、ガラス基板との接着強度も大きくかつ耐湿性
にも優れ第1図の様な構造では発生し易い端子間
のマイグレーシヨン現象なども大幅に減少するこ
とが判明した。但し、低温(−40〜50℃)での可
とう性がやや欠けるので、リードと電極との接続
部にのみ塗布する。9は常温で硬化するシリコン
ゴムの第2の保護層で、第1の保護層8及びリー
ドの耐熱ビニール被覆部を覆うべく塗布されてい
る。このシリコンゴムは柔軟で低温における可と
う性にすぐれ−50℃においてもガラス基板との接
着界面におけるはがれ、割れの発生はなかつた。
その上、耐熱ビニールとの接着性も優れている。 Figure 2 is a cross-sectional view showing an example of the display board terminal structure according to the present invention, and 8 is the first protective layer of adhesive that is cured by ultraviolet rays and has a hardness of 60 to 85 on the Shore D scale, and the time required for curing. The process was significantly shortened from a few seconds to about 10 minutes. Furthermore, as shown by the Shore hardness value after curing, it is not only hard, but also has high adhesion strength to the glass substrate and excellent moisture resistance, which prevents the migration phenomenon between terminals that tends to occur in a structure like the one shown in Figure 1. It was also found that there was a significant decrease in However, it lacks flexibility at low temperatures (-40 to 50°C), so it should be applied only to the connection between the lead and electrode. Reference numeral 9 denotes a second protective layer of silicone rubber that hardens at room temperature, and is applied to cover the first protective layer 8 and the heat-resistant vinyl coating of the lead. This silicone rubber is flexible and has excellent flexibility at low temperatures, with no peeling or cracking occurring at the adhesive interface with the glass substrate even at -50°C.
Furthermore, it has excellent adhesion to heat-resistant vinyl.
この紫外線硬化接着材としては、明星チヤーチ
ル製フオートボンド100、シリコンゴムとして信
越化学製KE347T等が利用出来る。 As this ultraviolet curable adhesive, FOOTBOND 100 manufactured by Myojo Churchill, and as the silicone rubber, KE347T manufactured by Shin-Etsu Chemical, etc. can be used.
以上述べた如く、紫外線硬化接着材とシリコン
ゴムの性質を巧みに利用した本考案によれば、表
示板の信頼性の向上及び工程の短縮が計られる。 As described above, according to the present invention, which skillfully utilizes the properties of the ultraviolet curing adhesive and silicone rubber, it is possible to improve the reliability of the display board and shorten the manufacturing process.
第1図は従来の表示板の端子部の断面図、第2
図は本考案の一実施例の断面図である。
1……電極ガラス基板、2……電極、3……封
止部、4……リード、5……半田、6,9……シ
リコンゴム、7……エポキシ樹脂、8……紫外線
硬化接着材。
Figure 1 is a sectional view of the terminal section of a conventional display board;
The figure is a sectional view of one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Electrode glass substrate, 2... Electrode, 3... Sealing part, 4... Lead, 5... Solder, 6, 9... Silicon rubber, 7... Epoxy resin, 8... Ultraviolet curing adhesive material .
Claims (1)
において、表示板の電極と耐熱ビニール被覆部を
有する外部リードとの接続部に前記耐熱ビニール
被覆部を避けてその接続部分を覆うように紫外線
硬化接着材の第1の保護層を設け、さらにこの第
1の保護層と前記耐熱ビニール被覆部とを覆うよ
うにシリコンゴムの第2の保護層を設けたことを
特徴とする表示板。 In a display board that displays numbers, characters, etc. using electrical signals, ultraviolet curing adhesive is applied to the connecting part between the electrode of the display board and an external lead having a heat-resistant vinyl coating so as to cover the connection part while avoiding the heat-resistant vinyl coating. 1. A display board comprising: a first protective layer made of silicone rubber; and a second protective layer made of silicone rubber to cover the first protective layer and the heat-resistant vinyl coating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979138868U JPS6141110Y2 (en) | 1979-10-05 | 1979-10-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979138868U JPS6141110Y2 (en) | 1979-10-05 | 1979-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5655874U JPS5655874U (en) | 1981-05-15 |
JPS6141110Y2 true JPS6141110Y2 (en) | 1986-11-22 |
Family
ID=29370226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1979138868U Expired JPS6141110Y2 (en) | 1979-10-05 | 1979-10-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6141110Y2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2511752Y2 (en) * | 1988-10-14 | 1996-09-25 | 松下電工株式会社 | Electric tool |
KR100814819B1 (en) * | 2006-10-31 | 2008-03-20 | 삼성에스디아이 주식회사 | Plasma display device |
JP2009283341A (en) * | 2008-05-23 | 2009-12-03 | Autonetworks Technologies Ltd | Waterproofing structure of electric wire splice portion |
KR101065315B1 (en) | 2009-04-30 | 2011-09-16 | 삼성모바일디스플레이주식회사 | Flat display panel |
JP6354608B2 (en) * | 2015-01-29 | 2018-07-11 | 株式会社オートネットワーク技術研究所 | Covered wire with terminal |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5760044Y2 (en) * | 1976-10-22 | 1982-12-21 |
-
1979
- 1979-10-05 JP JP1979138868U patent/JPS6141110Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5655874U (en) | 1981-05-15 |
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