JPS52137669A - Method of producing hybrid integrated circuit unit - Google Patents

Method of producing hybrid integrated circuit unit

Info

Publication number
JPS52137669A
JPS52137669A JP5468376A JP5468376A JPS52137669A JP S52137669 A JPS52137669 A JP S52137669A JP 5468376 A JP5468376 A JP 5468376A JP 5468376 A JP5468376 A JP 5468376A JP S52137669 A JPS52137669 A JP S52137669A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit unit
hybrid integrated
producing hybrid
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5468376A
Other languages
Japanese (ja)
Inventor
Shigeo Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5468376A priority Critical patent/JPS52137669A/en
Publication of JPS52137669A publication Critical patent/JPS52137669A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP5468376A 1976-05-12 1976-05-12 Method of producing hybrid integrated circuit unit Pending JPS52137669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5468376A JPS52137669A (en) 1976-05-12 1976-05-12 Method of producing hybrid integrated circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5468376A JPS52137669A (en) 1976-05-12 1976-05-12 Method of producing hybrid integrated circuit unit

Publications (1)

Publication Number Publication Date
JPS52137669A true JPS52137669A (en) 1977-11-17

Family

ID=12977579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5468376A Pending JPS52137669A (en) 1976-05-12 1976-05-12 Method of producing hybrid integrated circuit unit

Country Status (1)

Country Link
JP (1) JPS52137669A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826026U (en) * 1981-08-14 1983-02-19 日本電気株式会社 display board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826026U (en) * 1981-08-14 1983-02-19 日本電気株式会社 display board
JPH0214028Y2 (en) * 1981-08-14 1990-04-17

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