JPH0931427A - Anisotropic conductive adhesive and method for conductively connecting electronic parts using the same - Google Patents

Anisotropic conductive adhesive and method for conductively connecting electronic parts using the same

Info

Publication number
JPH0931427A
JPH0931427A JP20678195A JP20678195A JPH0931427A JP H0931427 A JPH0931427 A JP H0931427A JP 20678195 A JP20678195 A JP 20678195A JP 20678195 A JP20678195 A JP 20678195A JP H0931427 A JPH0931427 A JP H0931427A
Authority
JP
Japan
Prior art keywords
adhesive
anisotropic conductive
insulating adhesive
curing agent
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20678195A
Other languages
Japanese (ja)
Inventor
Osamu Okada
修 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP20678195A priority Critical patent/JPH0931427A/en
Publication of JPH0931427A publication Critical patent/JPH0931427A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Micro-Capsules (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent curing of an insulating adhesive even if accidentally heated before the use in an anisotropic conductive adhesive obtained by blending conductive particles in an insulating adhesive comprising a thermosetting resin. SOLUTION: This insulating adhesive 2 is composed of a thermoplastic resin (epoxy resin) blending a curing agent 4 coated with a covering film 5 in a main component (bisphenol A) 6. In usual states, the curing agent 4 coated with the covering film 5 can avoid contacting with the main component 6 and the covering film 5 can avoid to be destructed only by heating. Therefore, the insulating adhesive 2 can avoid to be cured even if accidentally heated before the use. On the other hand, when the adhesive is thermocompression bonded in the use, the curing agent 4 is contacted with the main component 6 by destroying the covering film 5 under the pressure, then the insulating adhesive 2 can be cured in the use.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】この発明は異方導電性接着剤
及びそれを用いた導電接続方法に関する。TECHNICAL FIELD The present invention relates to an anisotropic conductive adhesive and a conductive connection method using the same.

【０００２】[0002]

【従来の技術】異方導電性接着剤は、絶縁性接着剤中に
導電性粒子を混合したものからなり、回路基板等の一の
電子部品と回路基板等の他の電子部品との間に介在され
て熱圧着されることにより、導電性粒子により両電子部
品間を導電接続するとともに、絶縁性接着剤により両電
子部品を接着するのに用いられている。このような異方
導電性接着剤には、絶縁性接着剤として、主剤（樹脂）
中に硬化剤を混合してなる熱硬化性樹脂を用いたものが
ある。このような異方導電性接着剤では、両電子部品間
に介在されて熱圧着されると、硬化剤と主剤とが硬化反
応を起こして熱硬化性樹脂が硬化することにより、両電
子部品を接着することになる。2. Description of the Related Art An anisotropic conductive adhesive is composed of a mixture of electrically conductive particles in an insulating adhesive, and is used between one electronic component such as a circuit board and another electronic component such as a circuit board. By interposing and thermocompression-bonding, it is used to electrically connect both electronic components by conductive particles and to bond both electronic components with an insulating adhesive. Such an anisotropic conductive adhesive includes an insulating adhesive as a main agent (resin).
There is one using a thermosetting resin formed by mixing a curing agent therein. In such an anisotropically conductive adhesive, when interposed between both electronic components and thermocompression bonded, a curing reaction between the curing agent and the main component occurs and the thermosetting resin is cured, thereby curing both electronic components. It will be glued.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、従来の
このような異方導電性接着剤では、使用前に誤って加熱
された場合には、例えば不注意により常温よりも高い温
度下に保管された場合には、熱硬化性樹脂の硬化反応が
進行し、このような状態が長時間に及ぶと熱硬化性樹脂
が完全に硬化し、ひいては使用不能になってしまうこと
があるという問題があった。この発明の課題は、使用前
に誤って加熱されても熱硬化性樹脂が硬化しないように
することができ、一方、使用時には熱硬化性樹脂を硬化
させることができるようにすることである。However, in such a conventional anisotropically conductive adhesive, if it is accidentally heated before use, it is inadvertently stored at a temperature higher than room temperature. In this case, there is a problem that the curing reaction of the thermosetting resin proceeds, and if such a state lasts for a long time, the thermosetting resin may be completely cured and eventually become unusable. . An object of the present invention is to prevent the thermosetting resin from being cured even if it is erroneously heated before use, while allowing the thermosetting resin to be cured during use.

【０００４】[0004]

【課題を解決するための手段】請求項１記載の発明に係
る異方導電性接着剤は、絶縁性接着剤として、硬化剤を
被膜で被覆してなるものを主剤中に混合してなる熱硬化
性樹脂からなるものを用いたものである。請求項５記載
の発明に係る導電接続方法は、硬化剤を被膜で被覆して
なるものを主剤中に混合してなる熱硬化性樹脂である絶
縁性接着剤中に導電性粒子を混合してなる異方導電性接
着剤を一対の電子部品間に介在させ、熱圧着することに
より前記被膜を破壊して前記絶縁性接着剤を硬化させ、
この硬化した絶縁性接着剤を介して前記一対の電子部品
を接着するとともに、前記導電性粒子を介して前記一対
の電子部品間を導電接続するようにしたものである。The anisotropic conductive adhesive according to the first aspect of the present invention is a heat-insulating mixture prepared by mixing a hardener with a coating as a insulating adhesive in a main component. The one made of a curable resin is used. In the conductive connecting method according to the invention of claim 5, conductive particles are mixed in an insulating adhesive which is a thermosetting resin prepared by mixing a curing agent with a coating in a main component. An anisotropic conductive adhesive is interposed between a pair of electronic components, and the insulating adhesive is cured by thermocompression bonding to destroy the coating film,
The pair of electronic components are bonded via the cured insulating adhesive, and the pair of electronic components are conductively connected via the conductive particles.

【０００５】請求項１記載の発明によれば、通常の状態
においては被膜で被覆された硬化剤が主剤と接触しない
ようにすることができ、しかも加熱されただけでは被膜
が破壊されないようにすることができ、したがって使用
前に誤って加熱されても、熱硬化性樹脂からなる絶縁性
接着剤が硬化しないようにすることができる。一方、請
求項５記載の発明によれば、熱圧着されると、加圧によ
って被膜が破壊されることにより、硬化剤が主剤と接触
することとなり、したがって使用時には熱硬化性樹脂か
らなる絶縁性接着剤を硬化させることができる。According to the first aspect of the present invention, it is possible to prevent the curing agent coated with the coating from contacting the main component in a normal state, and prevent the coating from being destroyed only by heating. Therefore, it is possible to prevent the insulating adhesive made of the thermosetting resin from being cured even if it is accidentally heated before use. On the other hand, according to the invention of claim 5, when thermocompression bonding is applied, the coating is destroyed by pressure, so that the curing agent comes into contact with the main component, and therefore, when used, an insulating property made of a thermosetting resin is used. The adhesive can be cured.

【０００６】[0006]

【発明の実施の形態】図１はこの発明の一実施形態にお
ける異方導電性接着剤を示したものである。この異方導
電性接着剤１は、基本的には従来の場合と同じであっ
て、絶縁性接着剤２中に導電性粒子３を混合したものか
らなっている。このうち絶縁性接着剤２は、硬化剤４を
被膜５で被覆してなるものを主剤（ビスフェノールＡ）
６中に混合してなる熱硬化性樹脂（エポキシ樹脂）から
なっている。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an anisotropic conductive adhesive according to an embodiment of the present invention. This anisotropic conductive adhesive 1 is basically the same as the conventional case, and is composed of an insulating adhesive 2 and conductive particles 3 mixed therein. Of these, the insulating adhesive 2 is mainly composed of a hardener 4 coated with a coating 5 (bisphenol A).
6 is a thermosetting resin (epoxy resin) mixed.

【０００７】硬化剤４は、常温で固体であるもの、例え
ば、イミダゾール系硬化剤、イソシアネート系硬化剤、
アミン系硬化剤、アミド系硬化剤、酸無水系硬化剤、あ
るいはそれらの付加生成物や変性物からなっている。被
膜５は、ポリエチレンやポリプロピレン等のポリオレフ
ィン系樹脂、アクリル系樹脂等からなっている。硬化剤
４を被膜５で被覆する方法としては、粒子状の硬化剤４
の表面に被膜材料微粒子をぶつけて被膜５を形成する方
法、あるいは粒子状の硬化剤４の表面に正電荷または負
電荷を帯電させるとともに、被膜材料微粒子の表面にそ
れとは逆の電荷を帯電させ、そして静電気力により硬化
剤４の表面に被膜材料微粒子を引き付けて被膜５を形成
する方法等がある。The curing agent 4 is solid at room temperature, such as imidazole type curing agent, isocyanate type curing agent,
It is composed of an amine curing agent, an amide curing agent, an acid anhydride curing agent, or addition products or modified products thereof. The coating 5 is made of a polyolefin resin such as polyethylene or polypropylene, an acrylic resin, or the like. As a method for coating the curing agent 4 with the coating film 5, a particulate curing agent 4 is used.
To form a coating 5 by hitting the coating material fine particles on the surface of the coating material, or to charge the surface of the particulate curing agent 4 with a positive charge or a negative charge, and to charge the surface of the coating material particles with a charge opposite thereto. Then, there is a method of attracting the coating material particles to the surface of the curing agent 4 by electrostatic force to form the coating 5.

【０００８】導電性粒子３は、各種のタイプのものが考
えられるが、いずれのタイプのものであってもよい。例
えば、金属あるいは金属化合物の粒子であってもよい。
また、樹脂やガラス等からなるコアの表面にめっきや蒸
着等の方法によって金属からなる導電膜を被覆してなる
ものであってもよい。さらに、以上のようなものの表面
に樹脂からなる絶縁膜を被覆してなるものであってもよ
い。ただし、絶縁膜を有するものの場合には、熱圧着時
に絶縁膜が破壊されて内部のものが露出することによ
り、導電接続機能を発揮することになる。The conductive particles 3 may be of various types, but may be of any type. For example, particles of metal or metal compound may be used.
Alternatively, the core of resin or glass may be coated with a conductive film of metal by a method such as plating or vapor deposition. Further, the surface of the above may be covered with an insulating film made of resin. However, in the case of the one having an insulating film, the insulating film is destroyed during thermocompression bonding to expose the inside, so that the conductive connecting function is exhibited.

【０００９】このように、この異方導電性接着剤では、
絶縁性接着剤２として、硬化剤４を被膜５で被覆してな
るものを主剤６中に混合してなる熱硬化性樹脂からなる
ものを用いているので、通常の状態においては被膜５で
被覆された硬化剤４が主剤６と接触しないようにするこ
とができ、硬化剤４と主剤６とが硬化反応を起こすこと
がなく、しかも加熱されただけでは被膜５が破壊されな
いようにすることができる。したがって、使用前に誤っ
て加熱されても、熱硬化性樹脂からなる絶縁性接着剤２
が硬化しないようにすることができる。As described above, in this anisotropic conductive adhesive,
As the insulating adhesive 2, a thermosetting resin obtained by mixing the curing agent 4 with the coating 5 in the main agent 6 is used. Therefore, the insulating adhesive 2 is coated with the coating 5 in a normal state. It is possible to prevent the cured curing agent 4 from coming into contact with the main agent 6, so that the curing agent 4 and the main agent 6 do not cause a curing reaction, and the coating 5 is not destroyed only by being heated. it can. Therefore, even if it is accidentally heated before use, the insulating adhesive 2 made of a thermosetting resin is used.
Can be prevented from hardening.

【００１０】次に、図２はこの異方導電性接着剤１を用
いた導電接続構造の一例を示したものである。この例で
は、液晶表示パネルの透明基板１１の上面に設けられた
接続端子１２と、図示しない半導体チップが搭載された
ＴＡＢテープ１３の下面に設けられた接続端子１４とを
異方導電性接着剤１を介して導電接続している。Next, FIG. 2 shows an example of a conductive connection structure using the anisotropic conductive adhesive 1. In this example, the connection terminal 12 provided on the upper surface of the transparent substrate 11 of the liquid crystal display panel and the connection terminal 14 provided on the lower surface of the TAB tape 13 on which a semiconductor chip (not shown) is mounted are provided with an anisotropic conductive adhesive. Conductive connection via 1.

【００１１】このように導電接続する場合には、まず、
透明基板１１の接続端子１２を含む接続部分の上面に異
方導電性接着剤１を載置し、この載置した異方導電性接
着剤１の上面にＴＡＢテープ１３の接続端子１４を含む
接続部分を載置する。そして、透明基板１１の接続端子
１２を含む接続部分とＴＡＢテープ１３の接続端子１４
を含む接続部分とを熱圧着すると、主剤６の一部が流動
して逃げることにより、導電性粒子３の一部が透明基板
１１の接続端子１２とこの接続端子１２と対向するＴＡ
Ｂテープ１３の接続端子１４とに共に接触し、これによ
り相対向する接続端子１２、１４同士が導電接続される
ことになる。When conducting conductive connection in this way, first,
The anisotropic conductive adhesive 1 is placed on the upper surface of the connection portion including the connection terminals 12 of the transparent substrate 11, and the connection including the connection terminals 14 of the TAB tape 13 is placed on the upper surface of the placed anisotropic conductive adhesive 1. Place the part. Then, the connection portion including the connection terminal 12 of the transparent substrate 11 and the connection terminal 14 of the TAB tape 13
When thermocompression-bonded to the connection part including the part of the main agent 6 flows and escapes, a part of the conductive particles 3 faces the connection terminal 12 of the transparent substrate 11 and the connection terminal 12 facing the connection terminal 12.
The connection terminals 14 of the B tape 13 come into contact with each other, so that the connection terminals 12 and 14 facing each other are conductively connected.

【００１２】一方、熱圧着時には熱と圧力が加わるの
で、図１に示す被膜５は加圧によって破壊されるととも
に加熱によって溶融される。すると、硬化剤４が主剤６
と接触して反応し、これにより熱硬化性樹脂からなる絶
縁性接着剤２の硬化反応が進行することになる。したが
って、熱圧着時には絶縁性接着剤２が硬化することにな
る。この結果、この硬化した絶縁性接着剤２を介して、
透明基板１１の接続端子１２を含む接続部分とＴＡＢテ
ープ１３の接続端子１４を含む接続部分とが接着される
ことになる。On the other hand, since heat and pressure are applied during thermocompression bonding, the coating 5 shown in FIG. 1 is destroyed by pressure and melted by heating. Then, the curing agent 4 is the main agent 6
When they contact with each other and react with each other, the curing reaction of the insulating adhesive 2 made of a thermosetting resin proceeds. Therefore, the insulating adhesive 2 is cured during thermocompression bonding. As a result, through the cured insulating adhesive 2,
The connection portion including the connection terminal 12 of the transparent substrate 11 and the connection portion including the connection terminal 14 of the TAB tape 13 are bonded.

【００１３】なお、上記実施形態では、絶縁性接着剤２
として、硬化剤４を被膜５で被覆してなるものを主剤６
中に混合してなる熱硬化性樹脂を用いた場合について説
明したが、これに限らず、上記のような熱硬化性樹脂と
ポリエチレン、ポリプロピレン、ポリスチレン等からな
る熱可塑性樹脂とを混合してなるものであってもよい。In the above embodiment, the insulating adhesive 2
As the main agent 6 which is obtained by coating the curing agent 4 with the coating film 5.
Although the case of using the thermosetting resin mixed in the inside has been described, the present invention is not limited to this, and the thermosetting resin as described above is mixed with a thermoplastic resin such as polyethylene, polypropylene or polystyrene. It may be one.

【００１４】[0014]

【発明の効果】以上説明したように、請求項１記載の発
明によれば、通常の状態においては被膜で被覆された硬
化剤が主剤と接触しないようにすることができ、しかも
加熱されただけでは被膜が破壊されないようにすること
ができ、したがって使用前に誤って加熱されても、熱硬
化性樹脂からなる絶縁性接着剤が硬化しないようにする
ことができる。一方、請求項５記載の発明によれば、熱
圧着されると、加圧によって被膜が破壊されることによ
り、硬化剤が主剤と接触することとなり、したがって使
用時には熱硬化性樹脂からなる絶縁性接着剤を硬化させ
ることができる。As described above, according to the first aspect of the present invention, it is possible to prevent the curing agent coated with the coating from contacting the main agent in a normal state, and only when heated. Can prevent the coating from being destroyed, and thus prevent the insulating adhesive made of a thermosetting resin from being cured even if it is accidentally heated before use. On the other hand, according to the invention of claim 5, when the thermocompression bonding is applied, the coating is destroyed by the pressurization, so that the curing agent comes into contact with the main component. The adhesive can be cured.

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明の一実施形態における異方導電性接着
剤の断面図。FIG. 1 is a cross-sectional view of an anisotropic conductive adhesive according to an embodiment of the present invention.

【図２】図１に示す異方導電性接着剤を用いた導電接続
構造の一例を示す断面図。FIG. 2 is a sectional view showing an example of a conductive connection structure using the anisotropic conductive adhesive shown in FIG.

【符号の説明】[Explanation of symbols]

１ 異方導電性接着剤 ２ 絶縁性接着剤 ３ 導電性粒子 ４ 硬化剤 ５ 被膜 ６ 主剤 1 Anisotropic Conductive Adhesive 2 Insulating Adhesive 3 Conductive Particles 4 Curing Agent 5 Coating 6 Base Material

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 絶縁性接着剤中に導電性粒子を混合して
なる異方導電性接着剤において、前記絶縁性接着剤は、
硬化剤を被膜で被覆してなるものを主剤中に混合してな
る熱硬化性樹脂からなることを特徴とする異方導電性接
着剤。1. An anisotropic conductive adhesive obtained by mixing conductive particles in an insulating adhesive, wherein the insulating adhesive is
An anisotropic conductive adhesive comprising a thermosetting resin obtained by mixing a curing agent with a coating in a main agent. 【請求項２】 請求項１記載の発明において、前記絶縁
性接着剤は前記熱硬化性樹脂と熱可塑性樹脂とを混合し
てなるものからなることを特徴とする異方導電性接着
剤。2. The anisotropic conductive adhesive according to claim 1, wherein the insulating adhesive is a mixture of the thermosetting resin and a thermoplastic resin. 【請求項３】 請求項１または２記載の発明において、
前記硬化剤は常温で固体であるものからなることを特徴
とする異方導電性接着剤。3. The method according to claim 1, wherein
The anisotropic conductive adhesive, wherein the curing agent is a solid at room temperature. 【請求項４】 請求項１〜３のいずれかに記載の発明に
おいて、前記主剤はビスフェノールＡからなることを特
徴とする異方導電性接着剤。4. The anisotropic conductive adhesive according to any one of claims 1 to 3, wherein the main component is bisphenol A. 【請求項５】 硬化剤を被膜で被覆してなるものを主剤
中に混合してなる熱硬化性樹脂である絶縁性接着剤中に
導電性粒子を混合してなる異方導電性接着剤を一対の電
子部品間に介在させ、熱圧着することにより前記被膜を
破壊して前記絶縁性接着剤を硬化させ、この硬化した絶
縁性接着剤を介して前記一対の電子部品を接着するとと
もに、前記導電性粒子を介して前記一対の電子部品間を
導電接続することを特徴とする異方導電性接着剤を用い
た導電接続方法。5. An anisotropic conductive adhesive obtained by mixing conductive particles in an insulating adhesive, which is a thermosetting resin prepared by mixing a curing agent with a coating in a main component. By interposing between a pair of electronic components, the film is destroyed by thermocompression to cure the insulating adhesive, and the pair of electronic components are bonded via the cured insulating adhesive, and A conductive connection method using an anisotropic conductive adhesive, characterized in that the pair of electronic components are conductively connected via conductive particles. 【請求項６】 請求項２〜４のいずれかに記載の異方導
電性接着剤を一対の電子部品間に介在させ、熱圧着する
ことにより前記被膜を破壊して前記絶縁性接着剤を硬化
させ、この硬化した絶縁性接着剤を介して前記一対の電
子部品を接着するとともに、前記導電性粒子を介して前
記一対の電子部品間を導電接続することを特徴とする異
方導電性接着剤を用いた導電接続方法。6. The anisotropic conductive adhesive according to any one of claims 2 to 4 is interposed between a pair of electronic components and thermocompression bonded to destroy the coating film to cure the insulating adhesive. Then, while adhering the pair of electronic components via the cured insulating adhesive, the anisotropic conductive adhesive is characterized in that the pair of electronic components is conductively connected via the conductive particles. Conductive connection method using.
JP20678195A 1995-07-21 1995-07-21 Anisotropic conductive adhesive and method for conductively connecting electronic parts using the same Pending JPH0931427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20678195A JPH0931427A (en) 1995-07-21 1995-07-21 Anisotropic conductive adhesive and method for conductively connecting electronic parts using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20678195A JPH0931427A (en) 1995-07-21 1995-07-21 Anisotropic conductive adhesive and method for conductively connecting electronic parts using the same

Publications (1)

Publication Number Publication Date
JPH0931427A true JPH0931427A (en) 1997-02-04

Family

ID=16528990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20678195A Pending JPH0931427A (en) 1995-07-21 1995-07-21 Anisotropic conductive adhesive and method for conductively connecting electronic parts using the same

Country Status (1)

Country Link
JP (1) JPH0931427A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5363989B2 (en) * 2007-10-22 2013-12-11 日本化学工業株式会社 Coated conductive powder and conductive adhesive using the same.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5363989B2 (en) * 2007-10-22 2013-12-11 日本化学工業株式会社 Coated conductive powder and conductive adhesive using the same.

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