JP7417429B2 - 樹脂成形装置、樹脂成形品の製造方法 - Google Patents
樹脂成形装置、樹脂成形品の製造方法 Download PDFInfo
- Publication number
- JP7417429B2 JP7417429B2 JP2020006406A JP2020006406A JP7417429B2 JP 7417429 B2 JP7417429 B2 JP 7417429B2 JP 2020006406 A JP2020006406 A JP 2020006406A JP 2020006406 A JP2020006406 A JP 2020006406A JP 7417429 B2 JP7417429 B2 JP 7417429B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- release film
- resin
- film
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 title claims description 176
- 229920005989 resin Polymers 0.000 title claims description 176
- 238000000465 moulding Methods 0.000 title claims description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000007788 liquid Substances 0.000 claims description 72
- 230000007246 mechanism Effects 0.000 claims description 31
- 230000007723 transport mechanism Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 13
- 230000032258 transport Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 51
- 239000007789 gas Substances 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 11
- 238000003860 storage Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
- B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C2043/3205—Particular pressure exerting means for making definite articles
- B29C2043/3222—Particular pressure exerting means for making definite articles pressurized gas, e.g. air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
- B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
本実施形態の樹脂成形装置1の構成について、図1、2を参照して説明する。図1に示される樹脂成形装置1は、圧縮成形法により樹脂成形を行う樹脂成形装置1である。
次に、本実施形態の樹脂搬送機構21及びフィルム吸着台24の構成について、図3~図5を参照して説明する。
本実施形態の樹脂成形装置1を用いた本実施形態の樹脂成形品の製造方法の一例について図1~9を参照して説明する。まず、図1に示すように、成形前基板収納部45に収容されているチップが搭載された成形前基板5の下側に吸着ハンド42を挿入し、成形前基板5を吸着した後、成形前基板収納部45から成形前基板5を取り出す。ここで、基板は、チップの搭載側を上側として成形前基板収納部45から取り出される。
フィルム載置台13とフィルム吸着台24を共通化して、フィルム吸着台24のみとする構成としてもよい。この場合、フィルム吸着台24は、X、Y、Z方向に移動することができ、離型フィルム切断モジュール10と樹脂供給モジュール20の間を移動することができる。離型フィルム12が配置されたフィルム吸着台24を、樹脂供給モジュール20の樹脂吐出部下方まで移動させ、この状態で、離型フィルム11上に低粘度の液状樹脂70を吐出する。
5 成形前基板
6 成形済基板
10 離型フィルム切断モジュール
11 ロール状離型フィルム
12 離型フィルム
13 フィルム載置台
14 フィルムグリッパ
20 樹脂供給モジュール
21 樹脂搬送機構
22 フィルム回収機構
23 樹脂吐出部
24 フィルム吸着台
24a 吸着孔
25 チャンバ部
25a 孔部
25b シール部材
31 成形型
32 下型
32a 側面部材
32b 底面部材
322a 吸着溝
322b 吸着溝
33 キャビティ
34 上型
35 型締め機構
40 搬送モジュール
41 基板ローダ
42 吸着ハンド移動機構
43 吸着ハンド
45 成形前基板収納部
46 成形済基板収納部
50 加圧部
60 チャンバ
70 液状樹脂
Claims (7)
- 上型と前記上型に対向する下型とを含む成形型と、
前記成形型を型締めする型締め機構と、
離型フィルムを吸着する吸着台であって、外周部よりも中央部が低い上面を有するフィルム吸着台と、
前記離型フィルムに液状樹脂を吐出する樹脂吐出部と、
前記離型フィルムが下面に配置されたチャンバの上面と側面とを構成するチャンバ部と、
を備え、
前記チャンバ部は、前記チャンバ部内に気体を供給するための孔部を有する、樹脂成形装置。 - 上型と前記上型に対向する下型とを含む成形型と、
前記成形型を型締めする型締め機構と、
離型フィルムを吸着する吸着台であって、外周部よりも中央部が低い上面を有するフィルム吸着台と、
前記離型フィルムに液状樹脂を吐出する樹脂吐出部と、
前記離型フィルムが下面に配置されたチャンバの上面と側面とを構成するチャンバ部と、
前記チャンバ部内に気体を供給して前記チャンバ部内を加圧する加圧部と、
を備える、樹脂成形装置。 - 上型と前記上型に対向する下型とを含む成形型と、
前記成形型を型締めする型締め機構と、
離型フィルムを吸着する吸着台であって、外周部よりも中央部が低い上面を有するフィルム吸着台と、
前記離型フィルムに液状樹脂を吐出する樹脂吐出部と、
前記離型フィルムが下面に配置されたチャンバの上面と側面とを構成するチャンバ部と、
を備え、
前記フィルム吸着台は、離型フィルムを吸着する吸着台の上面が外周部から中央部に向かって低くなるように湾曲している、樹脂成形装置。 - 前記チャンバ部は、樹脂搬送機構に備えられている、請求項1から3のいずれか一項に記載の樹脂成形装置。
- 前記樹脂搬送機構は、前記液状樹脂が供給された前記離型フィルムを前記成形型に搬送する、請求項4に記載の樹脂成形装置。
- 前記離型フィルムを前記チャンバ部の端部下面との間で挟持するクランパをさらに備える、請求項1から5のいずれか一項に記載の樹脂成形装置。
- 請求項1から請求項6のいずれか一項に記載された樹脂成形装置を用いて樹脂成形品を製造する方法であって、
前記チャンバ部内に気体を供給した状態で、前記離型フィルムを成形型へ搬送する樹脂搬送工程と、
前記離型フィルムが搬送された前記成形型を型締めして樹脂成形を行う樹脂成形工程と、
を含む樹脂成形品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020006406A JP7417429B2 (ja) | 2020-01-17 | 2020-01-17 | 樹脂成形装置、樹脂成形品の製造方法 |
CN202011245436.9A CN113134924B (zh) | 2020-01-17 | 2020-11-10 | 树脂成形装置及树脂成形品的制造方法 |
TW109140126A TWI753656B (zh) | 2020-01-17 | 2020-11-17 | 樹脂成形裝置及樹脂成形品的製造方法 |
KR1020200159537A KR102361912B1 (ko) | 2020-01-17 | 2020-11-25 | 수지 성형 장치, 수지 성형품의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020006406A JP7417429B2 (ja) | 2020-01-17 | 2020-01-17 | 樹脂成形装置、樹脂成形品の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021112864A JP2021112864A (ja) | 2021-08-05 |
JP2021112864A5 JP2021112864A5 (ja) | 2022-12-14 |
JP7417429B2 true JP7417429B2 (ja) | 2024-01-18 |
Family
ID=76809874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020006406A Active JP7417429B2 (ja) | 2020-01-17 | 2020-01-17 | 樹脂成形装置、樹脂成形品の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7417429B2 (ja) |
KR (1) | KR102361912B1 (ja) |
CN (1) | CN113134924B (ja) |
TW (1) | TWI753656B (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004148621A (ja) | 2002-10-30 | 2004-05-27 | Apic Yamada Corp | 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5576197B2 (ja) * | 2010-07-08 | 2014-08-20 | Towa株式会社 | 電子部品の圧縮成形方法及び成形装置 |
JP6169516B2 (ja) | 2014-03-31 | 2017-07-26 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6430143B2 (ja) | 2014-04-30 | 2018-11-28 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法並びに成形製品の製造方法 |
JP6310773B2 (ja) | 2014-05-22 | 2018-04-11 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6298719B2 (ja) | 2014-06-09 | 2018-03-20 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP6612172B2 (ja) * | 2016-04-25 | 2019-11-27 | Towa株式会社 | 樹脂成形装置、樹脂成形方法、樹脂成形品の製造方法及び製品の製造方法 |
JP6672103B2 (ja) * | 2016-08-01 | 2020-03-25 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
JP6423399B2 (ja) * | 2016-09-27 | 2018-11-14 | アピックヤマダ株式会社 | 樹脂成形方法、フィルム搬送装置および樹脂成形装置 |
JP6723185B2 (ja) * | 2017-03-29 | 2020-07-15 | Towa株式会社 | 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法 |
JP6804409B2 (ja) * | 2017-08-04 | 2020-12-23 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
JP6854784B2 (ja) * | 2018-01-15 | 2021-04-07 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
-
2020
- 2020-01-17 JP JP2020006406A patent/JP7417429B2/ja active Active
- 2020-11-10 CN CN202011245436.9A patent/CN113134924B/zh active Active
- 2020-11-17 TW TW109140126A patent/TWI753656B/zh active
- 2020-11-25 KR KR1020200159537A patent/KR102361912B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004148621A (ja) | 2002-10-30 | 2004-05-27 | Apic Yamada Corp | 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具 |
Also Published As
Publication number | Publication date |
---|---|
TWI753656B (zh) | 2022-01-21 |
KR102361912B1 (ko) | 2022-02-14 |
CN113134924B (zh) | 2023-04-07 |
KR20210093149A (ko) | 2021-07-27 |
TW202129779A (zh) | 2021-08-01 |
JP2021112864A (ja) | 2021-08-05 |
CN113134924A (zh) | 2021-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2007251094A (ja) | 半導体チップの樹脂封止成形装置 | |
US20060186576A1 (en) | Resin sealing method for electronic part and mold used for the method | |
JP7068094B2 (ja) | ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法 | |
JP6180206B2 (ja) | 樹脂封止方法および圧縮成形装置 | |
KR100931295B1 (ko) | 전자 부품 몰딩 장치 및 전자 부품 몰딩 방법 | |
JP6307374B2 (ja) | 成形金型、成形装置および成形品の製造方法 | |
KR102182956B1 (ko) | 절단 장치 및 반도체 패키지의 반송 방법 | |
JP2014231185A (ja) | 樹脂モールド装置および樹脂モールド方法 | |
WO2020137386A1 (ja) | 樹脂モールド装置 | |
JP7417429B2 (ja) | 樹脂成形装置、樹脂成形品の製造方法 | |
JP5433736B2 (ja) | フィルム状樹脂積層装置 | |
TW202249128A (zh) | 樹脂密封裝置以及樹脂密封方法 | |
TWI736381B (zh) | 樹脂成形裝置及樹脂成形品的製造方法 | |
TWI499098B (zh) | 用於模塑電子器件的襯底載體 | |
JP6019471B2 (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
JP2021112864A5 (ja) | ||
JP7417774B1 (ja) | 成形型、樹脂成形装置、及び、樹脂成形品の製造方法 | |
TWI796685B (zh) | 樹脂成形裝置、蓋板及樹脂成形品的製造方法 | |
KR102498113B1 (ko) | 수지 성형 장치 및 수지 성형품의 제조 방법 | |
JP2005236133A (ja) | 樹脂封止成形方法 | |
TW202210267A (zh) | 樹脂洩漏防止用部件、樹脂洩漏防止用部件供給機構、樹脂成型裝置及樹脂成型品的製造方法 | |
TW202314872A (zh) | 樹脂密封裝置以及樹脂密封方法 | |
JP2022100341A (ja) | ワーク搬送装置及び樹脂モールド装置 | |
JP2014221527A (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
TW202312291A (zh) | 半導體裝置的製造方法、工件一體化裝置、薄膜積層體及半導體裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221205 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221205 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230822 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20231003 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231013 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231212 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240105 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7417429 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |