JP7405699B2 - 半導体被加工物処理システム - Google Patents
半導体被加工物処理システム Download PDFInfo
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Description
電子装置製造における最大の推進力は、より高い機能性を求める消費者の欲求であり、低コストで製造されるより小さな電子装置である。最大の推進力は、更なる小型化と製造効率の向上をはかる製造業者の起動力に変わる。その結果、製造業者は、可能な限り利益を求める。半導体装置の場合、従来の製造設備又はFABは、その心臓部(または、基礎的な組織構成)において、1以上の処理を半導体基板になす分離した処理ツール、例えばクラスターツールを有している。したがって、従来のFABは、処理ツール周辺において組織化されており、処理ツールは、半導体基板を所望の電子装置に加工するために所望の構成で配置されている。例えば、処理ツールを、処理ベイの従来のFAB内に配置してもよい。実現されているように、ツール間においては、基板は、SMF、FOUP等のキャリヤ内に保持されてもよいので、ツール間において、処理中の基板は、ツール内部と実質的に同様の清浄状態にある。ツール間の連絡は、基板キャリヤFAB内の所望の処理ツールに搬送できる(自動材料搬送システム、AMHS等の)処理システムによって与えられる。搬送システムと処理ツール間の連結は、例示目的のため、典型的には2つの部分を有するものとして考慮されてもよい。その2つの部分とは、搬送システムと処理ツールの積載ステーションへのキャリヤの積載/取り外しするためのツールとの間のインターフェースと、積載及び取り外しを許容する(個別又はグループの)キャリヤのインターフェース又はキャリヤとツール間の基板である。既知である従来のインターフェースシステムは、多数あり、キャリヤ及び材料運搬システムに処理ツールを連結する。従来のインターフェースシステムの多くは、複雑という点で欠点があり、1つ以上処理ツールインターフェース、キャリヤインターフェース、又は材料操作システムインタフェイスは、不要な特徴を有することとなり、それ故、コストが増大し、さもなければ、処理ツールの基板の積載及び取り外しが非効率となってしまう。以下により詳細に説明する典型実施例は、従来システムの問題を克服する。
半導体被加工物処理システムの典型実施例に従って、与えられる。システムは、被加工物を処理する少なくとも1つの処理装置と、第1搬送システムと、第2搬送システムと、第1搬送システムと第2搬送システムとの間における1以上のインターフェースと、を有する。第1搬送システムと第2搬送システムの各々は、実際的に等速度であり且つキューセクションにおいて1つ以上のセクションの実際的に等速度を有し、キュー部内において等速度部に通じている。
図示した典型実施例においては、上部及び下部は垂直又はZ軸に沿って配置される。代替実施例では、上部及び下部はいかなる他の軸に沿っても指向されてもよい。以下に上部及び下部開口部をより詳細に説明する。被加工物Sは、キャリヤの開口部204を通して、キャリヤよって画定されたチャンバ202の内外に搬送される。キャリヤの開口部204は、キャリヤ内に支持された被加工物の平面内(この実施例にいては、実質的にZ軸と直交した方向において)に実質的に配置される。以下に見られるように、キャリヤ200は、一般に、基部を有するケーシング部212及び閉止可能であるか又は可撤性のドア部を有する。ドア部が閉じられると、ドア部は、基部に係止され且つ封じられる。ドア部と基部との間の密閉によって、チャンバ202を外部大気から隔離してもよい。隔離されたチャンバ202は、清浄空気、不活性ガス等のいかなる所望の隔離された雰囲気を保持してもよく、又は真空を保持可能であってもよい。ドア部が開けられると、被加工物はキャリヤへ搭載又はキャリヤから取り外されることができる。典型実施例においては、キャリヤが開けられ、そこに被加工物/被加工物支持棚にアクセスされた時は、ドア部は取り外し可能であるか又は取り外された部分を意味する。図1の典型実施例においては、一般に、ケーシング200は、そこに被加工物を受け入れることが可能な凹又空洞部分214を有し、且つ壁部216(キャップ/カバー等)を有する。以下に説明するように、壁部216またはシェル214のどちらか一方がキャリヤドアとして作動してもよい。壁部とシェルは、キャリヤを閉じるために噛み合わせられ、且つキャリヤを開けるために分離される。典型実施例においては、シェルと壁部は、アルミニウム合金、またはどんな適当な工程で製造されたステンレス等の金属であってもよい。壁部若しくはシェル若しくはその両方は、1片の部材(単一構造)であってもよい。代替実施例においては、キャリヤケーシングは、適当な非金属材を含むいかなる他の適当な材料から製造されていてもよい。カセット210は壁部216に搭載されてもよい。代替実施例においては、カセットはシェルに取り付けられてもよい。ドア部が開けられる場合、シェル又はドアのどちらか一方へのカセットの搭載は、カセット又はそこの基板をキャリヤからの取り外しを容易になすために選択される。図示された実施例において、壁部216がシェルの上部に位置しているのが、代替実施例では、キャリヤケーシングは、上部にシェルがあり且つ下部に壁部がある構成を有してもよい。さらに、他の実施例においては、シェルは、上部及び下部の両方(すなわち、上部及び下部開口部を有するキャリヤにおいて可撤性壁部を有してもよい。他の代替実施例においては、可撤性壁部はキャリヤ側面に位置してもよい。典型実施例においては、ドア部は受動部品であってもよい(例えば、さらに以下に説明するように、ドアとキャリヤの間及びドアとツールインターフェースとの間において開閉する作用をなす可動部又は部品が実際上ない)。
Claims (7)
- 半導体基板を処理する2つ以上の基板処理ツールと、
伸長され且つ運動方向を画定する第1搬送部であって、前記第1搬送部が、基板保持容器に相互作用する部分を有し、前記運動方向に沿って前記基板保持容器を支持して搬送し、且つ、前記2つ以上の基板処理ツールのうちの1つの基板処理ツールを前記2つ以上の基板処理ツールのうちの別の基板処理ツールに接続する、第1搬送部と、
前記第1搬送部と分離して別個である第2搬送部であって、前記第2搬送部が、前記2つ以上の基板処理ツールの上方で前記第1搬送部に相互作用し、且つ前記第1搬送部と前記2つ以上の基板処理ツールとの間で前記基板保持容器を搬送するように構成され、前記第2搬送部が、前記2つ以上の基板処理ツールの上方に配置された少なくとも1つのオーバーヘッド構造体を含み、少なくとも1つのオーバーヘッド構造体のうちのそれぞれのオーバーヘッド構造体が、前記2つ以上の基板処理ツールの2つ以上のロードポートのうちのそれぞれのロードポートにアクセスするように構成されている、第2搬送部と、を備え、
前記オーバーヘッド構造体は、前記第1搬送部と密接して連結され、且つ前記第1搬送部に直接相互作用し、前記第2搬送部の前記オーバーヘッド構造体は、前記第1搬送部から前記基板保持容器を拾い上げ、前記基板保持容器を前記第1搬送部から前記2つ以上の基板処理ツールの前記2つ以上のロードポートのうちの所定のロードポートへ1つの連続移動で搬送し、且つ、異なる基板保持容器の前記第1搬送部からバッファへの異なる1つの連続移動で、前記第1搬送部上の前記異なる基板保持容器を前記バッファへ搬送し、前記バッファは、前記2つ以上の基板処理ツールのうちの少なくとも1つの基板処理ツールの上方の水平面に配置されたバッファストレージに配列されていることを特徴とする半導体被加工物処理システム。 - 前記少なくとも1つのオーバーヘッド構造体は、少なくとも3つの自由度を有する少なくとも1つのオーバーヘッドキャリヤを含むことを特徴とする請求項1記載の半導体被加工物処理システム。
- 前記基板保持容器はアクセス側面を有し、前記少なくとも1つのオーバーヘッドキャリヤは、前記少なくとも1つのオーバーヘッドキャリヤによって運ばれる前記基板保持容器を回転させて前記アクセス側面が向いている方向を変化させるように構成された回転駆動部を含むことを特徴とする請求項2記載の半導体被加工物処理システム。
- 前記バッファは、前記2つ以上の基板処理ツールのうちの少なくとも1つの基板処理ツールの上方に配列して配置された少なくとも1つのオーバーヘッド蓄積ステーションを備え、前記第2搬送部は、前記基板保持容器を前記少なくとも1つのオーバーヘッド蓄積ステーションへ、および前記少なくとも1つのオーバーヘッド蓄積ステーションから搬送するように構成されていることを特徴する請求項1記載の半導体被加工物処理システム。
- 前記少なくとも1つのオーバーヘッド構造体は、前記2つ以上の基板処理ツールの、異なって配置されたロードポートに基板保持容器を搬送するように構成され、前記異なって配置されたロードポートは、互いに対してそれぞれ異なる方向を向くように異なる向きを有し、前記異なって配置されたロードポート上に配置される前記基板保持容器が前記それぞれ異なる方向に向くことを特徴する請求項1記載の半導体被加工物処理システム。
- 前記少なくとも1つのオーバーヘッド構造体は、前記基板保持容器の向きが前記異なって配置されたロードポートのそれぞれの1つの向きに対応するように、少なくとも1つのオーバーヘッドキャリヤによって運ばれる前記基板保持容器を回転させるように構成されている前記少なくとも1つのオーバーヘッドキャリヤを含むことを特徴する請求項5記載の半導体被加工物処理システム。
- 前記少なくとも1つのオーバーヘッドキャリヤは前記基板保持容器のその場での回転のために構成されていることを特徴する請求項6記載の半導体被加工物処理システム。
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- 2006-11-07 EP EP06837141.8A patent/EP1945541B1/en active Active
- 2006-11-07 KR KR1020087013732A patent/KR20080075164A/ko not_active Application Discontinuation
- 2006-11-07 WO PCT/US2006/043462 patent/WO2007056443A2/en active Application Filing
- 2006-11-07 US US11/594,365 patent/US7798758B2/en active Active
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JP2018110268A (ja) | 2018-07-12 |
US20110008136A1 (en) | 2011-01-13 |
WO2007056443A2 (en) | 2007-05-18 |
WO2007056443A3 (en) | 2008-04-03 |
JP2020167420A (ja) | 2020-10-08 |
JP2014220523A (ja) | 2014-11-20 |
JP2023067972A (ja) | 2023-05-16 |
US20070189880A1 (en) | 2007-08-16 |
EP1945541A2 (en) | 2008-07-23 |
KR20080075164A (ko) | 2008-08-14 |
KR20140091768A (ko) | 2014-07-22 |
JP2016192582A (ja) | 2016-11-10 |
EP1945541B1 (en) | 2013-04-10 |
JP6356519B2 (ja) | 2018-07-11 |
US7798758B2 (en) | 2010-09-21 |
EP1945541A4 (en) | 2011-07-06 |
JP2009515368A (ja) | 2009-04-09 |
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