JP7308647B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP7308647B2 JP7308647B2 JP2019072329A JP2019072329A JP7308647B2 JP 7308647 B2 JP7308647 B2 JP 7308647B2 JP 2019072329 A JP2019072329 A JP 2019072329A JP 2019072329 A JP2019072329 A JP 2019072329A JP 7308647 B2 JP7308647 B2 JP 7308647B2
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/42—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4185—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Debugging And Monitoring (AREA)
- Testing And Monitoring For Control Systems (AREA)
- Numerical Control (AREA)
Description
上述した実施形態では、オペレータによる操作に従って、加工装置1のログ情報による解析用データを外部記憶装置200に出力するとともに、オペレータが事前に登録した送信先へ自動送信する例を説明した。しかしながら、本発明に係る加工装置1は、この例に特に限定される必要はなく、たとえば、オペレータが事前に登録した設定に従って、解析用データを自動的に変換し、送信するようにしてもよい。
なお、本発明に係る加工装置1は、上記実施形態に限定されるものではなく、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。たとえば、加工装置1は、切削装置以外の研削装置やレーザー加工装置であってもよい。
10 チャックテーブル
20 加工ユニット
80 制御ユニット
81 データ記録部
82 データ処理部
821 変換部
822 出力部
823 送信先登録部
824 自動送信部
825 自動送信設定登録部
826 自動変換部
90 通信ユニット
100 タッチパネル
110 コネクタ
Claims (6)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工手段と、加工状況を監視するための項目として事前に設定された監視項目ごとに時系列で記録された該加工状況を示す情報をログ情報として記録する記録部と、データ処理部と
を備える加工装置であって、
該データ処理部は、
該記録部に記録された該ログ情報を監視項目ごとに解析可能な解析用データに変換する変換部を備え、
該監視項目に応じて解析対象期間及び出力データ形式が事前に設定されていることを特徴とする加工装置。 - 該変換部は、
該ログ情報をグラフまたは表に変換することを特徴とする請求項1に記載の加工装置。 - 該監視項目は、
加工装置の稼働状況、被加工物、加工手段、及び加工装置にて発生したエラー信号のうちの少なくともいずれか一つに関し、
該ログ情報は、該監視項目に関して測定した数値データと加工装置において発生したエラー内容を示す文字データとが紐付いて該加工状況を示す情報を含むことを特徴とする請求項1に記載の加工装置。 - 該加工装置は、
外部記録媒体を該加工装置に接続可能にする接続部を更に備え、
該データ処理部は、
該解析用データを該外部記録媒体に出力する出力部を
更に備えることを特徴とする請求項1から3のいずれか1項に記載の加工装置。 - 該加工装置は、任意の情報機器にネットワークを経由して接続され、
該データ処理部は、
該解析用データの送信先を登録する送信先登録部と、
該送信先に該解析用データを送信する自動送信部と
を更に備えることを特徴とする請求項1から3のいずれか1項に記載の加工装置。 - 該データ処理部は、
該解析用データの送信要求日時と、該解析用データの解析対象期間と、該解析用データの解析対象項目とを自動送信設定情報として事前に登録する自動送信設定登録部と、
該自動送信設定登録部に登録されている該自動送信設定情報に従って、該記録部に記録された該ログ情報を該解析用データに変換する自動変換部とを更に備え、
該自動送信部は、
該自動変換部により変換された該解析用データを該送信先登録部に登録された該送信先へ送信することを特徴とする請求項5に記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019072329A JP7308647B2 (ja) | 2019-04-04 | 2019-04-04 | 加工装置 |
KR1020200034877A KR20200117858A (ko) | 2019-04-04 | 2020-03-23 | 가공 장치 |
CN202010207177.4A CN111799192A (zh) | 2019-04-04 | 2020-03-23 | 加工装置 |
TW109110895A TW202038035A (zh) | 2019-04-04 | 2020-03-30 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019072329A JP7308647B2 (ja) | 2019-04-04 | 2019-04-04 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020170411A JP2020170411A (ja) | 2020-10-15 |
JP7308647B2 true JP7308647B2 (ja) | 2023-07-14 |
Family
ID=72747314
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019072329A Active JP7308647B2 (ja) | 2019-04-04 | 2019-04-04 | 加工装置 |
Country Status (4)
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JP (1) | JP7308647B2 (ja) |
KR (1) | KR20200117858A (ja) |
CN (1) | CN111799192A (ja) |
TW (1) | TW202038035A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220035741A (ko) | 2020-09-14 | 2022-03-22 | 주식회사 엘지에너지솔루션 | 초음파 절삭기를 포함하는 전극조립체 제조장치 및 이를 이용한 전극조립체 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005309805A (ja) | 2004-04-22 | 2005-11-04 | Toshiba Corp | レポート配信システム、及び、レポート配信方法 |
JP2018041136A (ja) | 2016-09-05 | 2018-03-15 | 株式会社ディスコ | 加工装置及びその作動方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11118528A (ja) * | 1997-10-09 | 1999-04-30 | Kokusai Electric Co Ltd | 測定データ表示装置 |
-
2019
- 2019-04-04 JP JP2019072329A patent/JP7308647B2/ja active Active
-
2020
- 2020-03-23 KR KR1020200034877A patent/KR20200117858A/ko active Search and Examination
- 2020-03-23 CN CN202010207177.4A patent/CN111799192A/zh active Pending
- 2020-03-30 TW TW109110895A patent/TW202038035A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005309805A (ja) | 2004-04-22 | 2005-11-04 | Toshiba Corp | レポート配信システム、及び、レポート配信方法 |
JP2018041136A (ja) | 2016-09-05 | 2018-03-15 | 株式会社ディスコ | 加工装置及びその作動方法 |
Also Published As
Publication number | Publication date |
---|---|
CN111799192A (zh) | 2020-10-20 |
JP2020170411A (ja) | 2020-10-15 |
TW202038035A (zh) | 2020-10-16 |
KR20200117858A (ko) | 2020-10-14 |
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