JP7156267B2 - カルボン酸基含有ポリエステル系接着剤組成物 - Google Patents

カルボン酸基含有ポリエステル系接着剤組成物 Download PDF

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Publication number
JP7156267B2
JP7156267B2 JP2019508607A JP2019508607A JP7156267B2 JP 7156267 B2 JP7156267 B2 JP 7156267B2 JP 2019508607 A JP2019508607 A JP 2019508607A JP 2019508607 A JP2019508607 A JP 2019508607A JP 7156267 B2 JP7156267 B2 JP 7156267B2
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carboxylic acid
mass
parts
polyol
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JPWO2018179707A1 (ja
Inventor
遼 薗田
武 伊藤
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Toyobo Co Ltd
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Toyobo Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2019508607A 2017-03-28 2018-01-22 カルボン酸基含有ポリエステル系接着剤組成物 Active JP7156267B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017062976 2017-03-28
JP2017062976 2017-03-28
PCT/JP2018/001765 WO2018179707A1 (fr) 2017-03-28 2018-01-22 Composition adhésive de polyester contenant un groupe acide carboxylique

Publications (2)

Publication Number Publication Date
JPWO2018179707A1 JPWO2018179707A1 (ja) 2020-02-06
JP7156267B2 true JP7156267B2 (ja) 2022-10-19

Family

ID=63674605

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JP2019508607A Active JP7156267B2 (ja) 2017-03-28 2018-01-22 カルボン酸基含有ポリエステル系接着剤組成物

Country Status (5)

Country Link
JP (1) JP7156267B2 (fr)
KR (1) KR102433526B1 (fr)
CN (1) CN110268030B (fr)
TW (1) TWI746812B (fr)
WO (1) WO2018179707A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109666434B (zh) * 2018-12-27 2021-09-10 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用
CN112675714A (zh) * 2019-10-17 2021-04-20 滁州学院 一种聚芳酯复合纳滤膜及其制备方法
JP7211403B2 (ja) * 2019-10-23 2023-01-24 三菱ケミカル株式会社 接着剤組成物及び接着剤
TW202134381A (zh) * 2019-10-23 2021-09-16 日商三菱化學股份有限公司 撓性印刷電路板用黏接劑組成物、撓性印刷電路板用黏接劑、以及撓性印刷電路板
CN111040387B (zh) * 2019-12-28 2022-06-03 广东生益科技股份有限公司 一种无卤树脂组合物及包含其的挠性覆铜板
JP7127674B2 (ja) * 2020-02-21 2022-08-30 三菱ケミカル株式会社 接着剤組成物及び接着剤
CN115315499A (zh) * 2020-03-30 2022-11-08 东洋纺株式会社 粘接剂组合物和粘接片材、层叠体及印刷线路板
EP4230675A1 (fr) 2020-10-16 2023-08-23 Toyobo Co., Ltd. Résine de polyester réticulé
CN118076698A (zh) * 2021-10-14 2024-05-24 东洋纺株式会社 交联聚酯树脂、粘接剂组合物和粘接片
JPWO2023106206A1 (fr) * 2021-12-06 2023-06-15

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137793A (ja) 2004-11-10 2006-06-01 Toyobo Co Ltd 接着剤およびそれを用いた回路基板
WO2008069298A1 (fr) 2006-12-08 2008-06-12 Toyo Ink Mfg. Co., Ltd. Composition adhésive, son procédé de fabrication et stratifié l'utilisant
JP2008143995A (ja) 2006-12-08 2008-06-26 Toyo Ink Mfg Co Ltd 感圧式接着剤組成物
JP2010013528A (ja) 2008-07-02 2010-01-21 Toyobo Co Ltd ポリエステル樹脂、光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板
WO2015015889A1 (fr) 2013-07-29 2015-02-05 東洋紡株式会社 Polyester contenant un groupe carboxyle et composition de résine thermodurcissable le comprenant

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JPS5137094B2 (fr) * 1972-06-19 1976-10-13
DE4230116C2 (de) * 1992-09-09 1995-10-05 Vacuumschmelze Gmbh Wäßrig alkalisch löslicher Klebstoff und dessen Verwendung
DE4317470C2 (de) * 1993-05-26 2001-06-07 Henkel Kgaa Thermisch vernetzbarer Heißsiegel-Klebstoff und dessen Verwendung
JPH11106494A (ja) * 1997-09-30 1999-04-20 Tomoegawa Paper Co Ltd ポリエステル樹脂、その製造方法およびその使用
JP4672505B2 (ja) * 2005-04-13 2011-04-20 信越化学工業株式会社 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
JP5286740B2 (ja) 2007-10-19 2013-09-11 東洋インキＳｃホールディングス株式会社 接着剤組成物、それを用いた接着剤シート、および補強材付きフレキシブルプリント配線板
JP5304152B2 (ja) 2008-09-30 2013-10-02 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板
CN102264855B (zh) * 2008-12-26 2014-03-12 东洋纺织株式会社 粘合剂用树脂组合物、含有它的粘合剂、粘合片以及将粘合片作为粘合层含有的印制线路板
US20120133061A1 (en) * 2009-06-30 2012-05-31 Kazuyuki Mitsukura Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same
WO2011081163A1 (fr) * 2009-12-28 2011-07-07 日東電工株式会社 Composition adhésive à base de polyester
JP4978753B2 (ja) * 2010-04-14 2012-07-18 東洋紡績株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板
CN102822304B (zh) * 2010-04-14 2014-04-30 东洋纺织株式会社 胶粘剂用树脂组合物、含有该组合物的胶粘剂、胶粘性片及含有该片作为胶粘剂层的印制线路板
CN102270749A (zh) * 2011-04-18 2011-12-07 电子科技大学 一种柔性发光器件用基板及其制备方法
JP2013039784A (ja) * 2011-08-19 2013-02-28 Keiichi Uno ポリエステル系接着剤およびそれを用いたシート状積層体
CN103265907A (zh) * 2013-04-29 2013-08-28 广东普赛特电子科技股份有限公司 一种耐磨导电胶组合物
JP5787202B2 (ja) * 2013-09-06 2015-09-30 Dic株式会社 ポリエステルポリオール、ラミネート接着剤用ポリオール剤、樹脂組成物、硬化性樹脂組成物、ラミネート用接着剤、及び太陽電池用バックシート
JP6515809B2 (ja) * 2013-12-09 2019-05-22 東洋紡株式会社 ポリエステル樹脂組成物および接着剤組成物
JP6473462B2 (ja) * 2014-11-11 2019-02-20 富士フイルム株式会社 仮接着膜の製造方法、仮接着膜、積層体、デバイスウエハ付き積層体、仮接着用組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137793A (ja) 2004-11-10 2006-06-01 Toyobo Co Ltd 接着剤およびそれを用いた回路基板
WO2008069298A1 (fr) 2006-12-08 2008-06-12 Toyo Ink Mfg. Co., Ltd. Composition adhésive, son procédé de fabrication et stratifié l'utilisant
JP2008143995A (ja) 2006-12-08 2008-06-26 Toyo Ink Mfg Co Ltd 感圧式接着剤組成物
JP2010013528A (ja) 2008-07-02 2010-01-21 Toyobo Co Ltd ポリエステル樹脂、光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板
WO2015015889A1 (fr) 2013-07-29 2015-02-05 東洋紡株式会社 Polyester contenant un groupe carboxyle et composition de résine thermodurcissable le comprenant

Also Published As

Publication number Publication date
WO2018179707A1 (fr) 2018-10-04
CN110268030B (zh) 2021-12-28
JPWO2018179707A1 (ja) 2020-02-06
CN110268030A (zh) 2019-09-20
KR20190126771A (ko) 2019-11-12
TWI746812B (zh) 2021-11-21
KR102433526B1 (ko) 2022-08-17
TW201840794A (zh) 2018-11-16

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