KR102433526B1 - 카르복실산 기 함유 폴리에스테르계 접착제 조성물 - Google Patents

카르복실산 기 함유 폴리에스테르계 접착제 조성물 Download PDF

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Publication number
KR102433526B1
KR102433526B1 KR1020197022212A KR20197022212A KR102433526B1 KR 102433526 B1 KR102433526 B1 KR 102433526B1 KR 1020197022212 A KR1020197022212 A KR 1020197022212A KR 20197022212 A KR20197022212 A KR 20197022212A KR 102433526 B1 KR102433526 B1 KR 102433526B1
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KR
South Korea
Prior art keywords
carboxylic acid
adhesive composition
polymer polyol
preferable
less
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KR1020197022212A
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English (en)
Korean (ko)
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KR20190126771A (ko
Inventor
료 소노다
다케시 이토
Original Assignee
도요보 가부시키가이샤
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Application filed by 도요보 가부시키가이샤 filed Critical 도요보 가부시키가이샤
Publication of KR20190126771A publication Critical patent/KR20190126771A/ko
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Publication of KR102433526B1 publication Critical patent/KR102433526B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
KR1020197022212A 2017-03-28 2018-01-22 카르복실산 기 함유 폴리에스테르계 접착제 조성물 KR102433526B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017062976 2017-03-28
JPJP-P-2017-062976 2017-03-28
PCT/JP2018/001765 WO2018179707A1 (fr) 2017-03-28 2018-01-22 Composition adhésive de polyester contenant un groupe acide carboxylique

Publications (2)

Publication Number Publication Date
KR20190126771A KR20190126771A (ko) 2019-11-12
KR102433526B1 true KR102433526B1 (ko) 2022-08-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197022212A KR102433526B1 (ko) 2017-03-28 2018-01-22 카르복실산 기 함유 폴리에스테르계 접착제 조성물

Country Status (5)

Country Link
JP (1) JP7156267B2 (fr)
KR (1) KR102433526B1 (fr)
CN (1) CN110268030B (fr)
TW (1) TWI746812B (fr)
WO (1) WO2018179707A1 (fr)

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CN109666434B (zh) * 2018-12-27 2021-09-10 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用
CN112675714A (zh) * 2019-10-17 2021-04-20 滁州学院 一种聚芳酯复合纳滤膜及其制备方法
JP7211403B2 (ja) * 2019-10-23 2023-01-24 三菱ケミカル株式会社 接着剤組成物及び接着剤
TW202134381A (zh) * 2019-10-23 2021-09-16 日商三菱化學股份有限公司 撓性印刷電路板用黏接劑組成物、撓性印刷電路板用黏接劑、以及撓性印刷電路板
CN111040387B (zh) * 2019-12-28 2022-06-03 广东生益科技股份有限公司 一种无卤树脂组合物及包含其的挠性覆铜板
JP7127674B2 (ja) * 2020-02-21 2022-08-30 三菱ケミカル株式会社 接着剤組成物及び接着剤
CN115315499A (zh) * 2020-03-30 2022-11-08 东洋纺株式会社 粘接剂组合物和粘接片材、层叠体及印刷线路板
EP4230675A1 (fr) 2020-10-16 2023-08-23 Toyobo Co., Ltd. Résine de polyester réticulé
CN118076698A (zh) * 2021-10-14 2024-05-24 东洋纺株式会社 交联聚酯树脂、粘接剂组合物和粘接片
JPWO2023106206A1 (fr) * 2021-12-06 2023-06-15

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137793A (ja) 2004-11-10 2006-06-01 Toyobo Co Ltd 接着剤およびそれを用いた回路基板
JP2010013528A (ja) 2008-07-02 2010-01-21 Toyobo Co Ltd ポリエステル樹脂、光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板

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JPH11106494A (ja) * 1997-09-30 1999-04-20 Tomoegawa Paper Co Ltd ポリエステル樹脂、その製造方法およびその使用
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JP2013039784A (ja) * 2011-08-19 2013-02-28 Keiichi Uno ポリエステル系接着剤およびそれを用いたシート状積層体
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JP5692476B1 (ja) * 2013-07-29 2015-04-01 東洋紡株式会社 カルボキシル基含有ポリエステル及びそれを含む熱硬化性樹脂組成物
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137793A (ja) 2004-11-10 2006-06-01 Toyobo Co Ltd 接着剤およびそれを用いた回路基板
JP2010013528A (ja) 2008-07-02 2010-01-21 Toyobo Co Ltd ポリエステル樹脂、光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板

Also Published As

Publication number Publication date
WO2018179707A1 (fr) 2018-10-04
CN110268030B (zh) 2021-12-28
JPWO2018179707A1 (ja) 2020-02-06
JP7156267B2 (ja) 2022-10-19
CN110268030A (zh) 2019-09-20
KR20190126771A (ko) 2019-11-12
TWI746812B (zh) 2021-11-21
TW201840794A (zh) 2018-11-16

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