TWI746812B - 含有羧酸基之聚酯系黏接劑組成物 - Google Patents

含有羧酸基之聚酯系黏接劑組成物 Download PDF

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Publication number
TWI746812B
TWI746812B TW107107202A TW107107202A TWI746812B TW I746812 B TWI746812 B TW I746812B TW 107107202 A TW107107202 A TW 107107202A TW 107107202 A TW107107202 A TW 107107202A TW I746812 B TWI746812 B TW I746812B
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TW
Taiwan
Prior art keywords
polymer polyol
mass
parts
carboxylic acid
adhesive composition
Prior art date
Application number
TW107107202A
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English (en)
Chinese (zh)
Other versions
TW201840794A (zh
Inventor
薗田遼
伊藤武
Original Assignee
日商東洋紡股份有限公司
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Application filed by 日商東洋紡股份有限公司 filed Critical 日商東洋紡股份有限公司
Publication of TW201840794A publication Critical patent/TW201840794A/zh
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Publication of TWI746812B publication Critical patent/TWI746812B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW107107202A 2017-03-28 2018-03-05 含有羧酸基之聚酯系黏接劑組成物 TWI746812B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-062976 2017-03-28
JP2017062976 2017-03-28

Publications (2)

Publication Number Publication Date
TW201840794A TW201840794A (zh) 2018-11-16
TWI746812B true TWI746812B (zh) 2021-11-21

Family

ID=63674605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107107202A TWI746812B (zh) 2017-03-28 2018-03-05 含有羧酸基之聚酯系黏接劑組成物

Country Status (5)

Country Link
JP (1) JP7156267B2 (fr)
KR (1) KR102433526B1 (fr)
CN (1) CN110268030B (fr)
TW (1) TWI746812B (fr)
WO (1) WO2018179707A1 (fr)

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CN109666434B (zh) * 2018-12-27 2021-09-10 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用
CN112675714A (zh) * 2019-10-17 2021-04-20 滁州学院 一种聚芳酯复合纳滤膜及其制备方法
JP7211403B2 (ja) * 2019-10-23 2023-01-24 三菱ケミカル株式会社 接着剤組成物及び接着剤
TW202134381A (zh) * 2019-10-23 2021-09-16 日商三菱化學股份有限公司 撓性印刷電路板用黏接劑組成物、撓性印刷電路板用黏接劑、以及撓性印刷電路板
CN111040387B (zh) * 2019-12-28 2022-06-03 广东生益科技股份有限公司 一种无卤树脂组合物及包含其的挠性覆铜板
JP7127674B2 (ja) * 2020-02-21 2022-08-30 三菱ケミカル株式会社 接着剤組成物及び接着剤
CN115315499A (zh) * 2020-03-30 2022-11-08 东洋纺株式会社 粘接剂组合物和粘接片材、层叠体及印刷线路板
EP4230675A1 (fr) 2020-10-16 2023-08-23 Toyobo Co., Ltd. Résine de polyester réticulé
CN118076698A (zh) * 2021-10-14 2024-05-24 东洋纺株式会社 交联聚酯树脂、粘接剂组合物和粘接片
JPWO2023106206A1 (fr) * 2021-12-06 2023-06-15

Citations (3)

* Cited by examiner, † Cited by third party
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TW201033314A (en) * 2008-12-26 2010-09-16 Toyo Boseki Resin composition for adhesive, adhesive containing it, adhesive sheet and printed wiring board containing it as adhesive layer
TW201127928A (en) * 2009-06-30 2011-08-16 Hitachi Chemical Co Ltd Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same
TW201617423A (zh) * 2014-11-11 2016-05-16 Fujifilm Corp 假接著膜的製造方法、假接著膜、積層體、帶元件晶圓的積層體、假接著用組成物

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DE4317470C2 (de) * 1993-05-26 2001-06-07 Henkel Kgaa Thermisch vernetzbarer Heißsiegel-Klebstoff und dessen Verwendung
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JP5787202B2 (ja) * 2013-09-06 2015-09-30 Dic株式会社 ポリエステルポリオール、ラミネート接着剤用ポリオール剤、樹脂組成物、硬化性樹脂組成物、ラミネート用接着剤、及び太陽電池用バックシート
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201033314A (en) * 2008-12-26 2010-09-16 Toyo Boseki Resin composition for adhesive, adhesive containing it, adhesive sheet and printed wiring board containing it as adhesive layer
TW201127928A (en) * 2009-06-30 2011-08-16 Hitachi Chemical Co Ltd Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same
TW201617423A (zh) * 2014-11-11 2016-05-16 Fujifilm Corp 假接著膜的製造方法、假接著膜、積層體、帶元件晶圓的積層體、假接著用組成物

Also Published As

Publication number Publication date
WO2018179707A1 (fr) 2018-10-04
CN110268030B (zh) 2021-12-28
JPWO2018179707A1 (ja) 2020-02-06
JP7156267B2 (ja) 2022-10-19
CN110268030A (zh) 2019-09-20
KR20190126771A (ko) 2019-11-12
KR102433526B1 (ko) 2022-08-17
TW201840794A (zh) 2018-11-16

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