TWI746812B - 含有羧酸基之聚酯系黏接劑組成物 - Google Patents
含有羧酸基之聚酯系黏接劑組成物 Download PDFInfo
- Publication number
- TWI746812B TWI746812B TW107107202A TW107107202A TWI746812B TW I746812 B TWI746812 B TW I746812B TW 107107202 A TW107107202 A TW 107107202A TW 107107202 A TW107107202 A TW 107107202A TW I746812 B TWI746812 B TW I746812B
- Authority
- TW
- Taiwan
- Prior art keywords
- polymer polyol
- mass
- parts
- carboxylic acid
- adhesive composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-062976 | 2017-03-28 | ||
JP2017062976 | 2017-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201840794A TW201840794A (zh) | 2018-11-16 |
TWI746812B true TWI746812B (zh) | 2021-11-21 |
Family
ID=63674605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107107202A TWI746812B (zh) | 2017-03-28 | 2018-03-05 | 含有羧酸基之聚酯系黏接劑組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7156267B2 (fr) |
KR (1) | KR102433526B1 (fr) |
CN (1) | CN110268030B (fr) |
TW (1) | TWI746812B (fr) |
WO (1) | WO2018179707A1 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109666434B (zh) * | 2018-12-27 | 2021-09-10 | 苏州赛伍应用技术股份有限公司 | 粘合剂及制备方法、包含其的胶膜和制备方法及应用 |
CN112675714A (zh) * | 2019-10-17 | 2021-04-20 | 滁州学院 | 一种聚芳酯复合纳滤膜及其制备方法 |
JP7211403B2 (ja) * | 2019-10-23 | 2023-01-24 | 三菱ケミカル株式会社 | 接着剤組成物及び接着剤 |
TW202134381A (zh) * | 2019-10-23 | 2021-09-16 | 日商三菱化學股份有限公司 | 撓性印刷電路板用黏接劑組成物、撓性印刷電路板用黏接劑、以及撓性印刷電路板 |
CN111040387B (zh) * | 2019-12-28 | 2022-06-03 | 广东生益科技股份有限公司 | 一种无卤树脂组合物及包含其的挠性覆铜板 |
JP7127674B2 (ja) * | 2020-02-21 | 2022-08-30 | 三菱ケミカル株式会社 | 接着剤組成物及び接着剤 |
CN115315499A (zh) * | 2020-03-30 | 2022-11-08 | 东洋纺株式会社 | 粘接剂组合物和粘接片材、层叠体及印刷线路板 |
EP4230675A1 (fr) | 2020-10-16 | 2023-08-23 | Toyobo Co., Ltd. | Résine de polyester réticulé |
CN118076698A (zh) * | 2021-10-14 | 2024-05-24 | 东洋纺株式会社 | 交联聚酯树脂、粘接剂组合物和粘接片 |
JPWO2023106206A1 (fr) * | 2021-12-06 | 2023-06-15 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201033314A (en) * | 2008-12-26 | 2010-09-16 | Toyo Boseki | Resin composition for adhesive, adhesive containing it, adhesive sheet and printed wiring board containing it as adhesive layer |
TW201127928A (en) * | 2009-06-30 | 2011-08-16 | Hitachi Chemical Co Ltd | Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
TW201617423A (zh) * | 2014-11-11 | 2016-05-16 | Fujifilm Corp | 假接著膜的製造方法、假接著膜、積層體、帶元件晶圓的積層體、假接著用組成物 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5137094B2 (fr) * | 1972-06-19 | 1976-10-13 | ||
DE4230116C2 (de) * | 1992-09-09 | 1995-10-05 | Vacuumschmelze Gmbh | Wäßrig alkalisch löslicher Klebstoff und dessen Verwendung |
DE4317470C2 (de) * | 1993-05-26 | 2001-06-07 | Henkel Kgaa | Thermisch vernetzbarer Heißsiegel-Klebstoff und dessen Verwendung |
JPH11106494A (ja) * | 1997-09-30 | 1999-04-20 | Tomoegawa Paper Co Ltd | ポリエステル樹脂、その製造方法およびその使用 |
JP5151003B2 (ja) | 2004-11-10 | 2013-02-27 | 東洋紡株式会社 | 接着剤およびそれを用いた回路基板 |
JP4672505B2 (ja) * | 2005-04-13 | 2011-04-20 | 信越化学工業株式会社 | 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板 |
JP2008143995A (ja) * | 2006-12-08 | 2008-06-26 | Toyo Ink Mfg Co Ltd | 感圧式接着剤組成物 |
WO2008069298A1 (fr) * | 2006-12-08 | 2008-06-12 | Toyo Ink Mfg. Co., Ltd. | Composition adhésive, son procédé de fabrication et stratifié l'utilisant |
JP5286740B2 (ja) | 2007-10-19 | 2013-09-11 | 東洋インキScホールディングス株式会社 | 接着剤組成物、それを用いた接着剤シート、および補強材付きフレキシブルプリント配線板 |
JP2010013528A (ja) | 2008-07-02 | 2010-01-21 | Toyobo Co Ltd | ポリエステル樹脂、光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板 |
JP5304152B2 (ja) | 2008-09-30 | 2013-10-02 | 東洋紡株式会社 | 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板 |
WO2011081163A1 (fr) * | 2009-12-28 | 2011-07-07 | 日東電工株式会社 | Composition adhésive à base de polyester |
JP4978753B2 (ja) * | 2010-04-14 | 2012-07-18 | 東洋紡績株式会社 | 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板 |
CN102822304B (zh) * | 2010-04-14 | 2014-04-30 | 东洋纺织株式会社 | 胶粘剂用树脂组合物、含有该组合物的胶粘剂、胶粘性片及含有该片作为胶粘剂层的印制线路板 |
CN102270749A (zh) * | 2011-04-18 | 2011-12-07 | 电子科技大学 | 一种柔性发光器件用基板及其制备方法 |
JP2013039784A (ja) * | 2011-08-19 | 2013-02-28 | Keiichi Uno | ポリエステル系接着剤およびそれを用いたシート状積層体 |
CN103265907A (zh) * | 2013-04-29 | 2013-08-28 | 广东普赛特电子科技股份有限公司 | 一种耐磨导电胶组合物 |
JP5692476B1 (ja) * | 2013-07-29 | 2015-04-01 | 東洋紡株式会社 | カルボキシル基含有ポリエステル及びそれを含む熱硬化性樹脂組成物 |
JP5787202B2 (ja) * | 2013-09-06 | 2015-09-30 | Dic株式会社 | ポリエステルポリオール、ラミネート接着剤用ポリオール剤、樹脂組成物、硬化性樹脂組成物、ラミネート用接着剤、及び太陽電池用バックシート |
JP6515809B2 (ja) * | 2013-12-09 | 2019-05-22 | 東洋紡株式会社 | ポリエステル樹脂組成物および接着剤組成物 |
-
2018
- 2018-01-22 KR KR1020197022212A patent/KR102433526B1/ko active IP Right Grant
- 2018-01-22 WO PCT/JP2018/001765 patent/WO2018179707A1/fr active Application Filing
- 2018-01-22 CN CN201880008572.0A patent/CN110268030B/zh active Active
- 2018-01-22 JP JP2019508607A patent/JP7156267B2/ja active Active
- 2018-03-05 TW TW107107202A patent/TWI746812B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201033314A (en) * | 2008-12-26 | 2010-09-16 | Toyo Boseki | Resin composition for adhesive, adhesive containing it, adhesive sheet and printed wiring board containing it as adhesive layer |
TW201127928A (en) * | 2009-06-30 | 2011-08-16 | Hitachi Chemical Co Ltd | Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
TW201617423A (zh) * | 2014-11-11 | 2016-05-16 | Fujifilm Corp | 假接著膜的製造方法、假接著膜、積層體、帶元件晶圓的積層體、假接著用組成物 |
Also Published As
Publication number | Publication date |
---|---|
WO2018179707A1 (fr) | 2018-10-04 |
CN110268030B (zh) | 2021-12-28 |
JPWO2018179707A1 (ja) | 2020-02-06 |
JP7156267B2 (ja) | 2022-10-19 |
CN110268030A (zh) | 2019-09-20 |
KR20190126771A (ko) | 2019-11-12 |
KR102433526B1 (ko) | 2022-08-17 |
TW201840794A (zh) | 2018-11-16 |
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