JP7023836B2 - 電磁波シールドフィルム - Google Patents

電磁波シールドフィルム Download PDF

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Publication number
JP7023836B2
JP7023836B2 JP2018507336A JP2018507336A JP7023836B2 JP 7023836 B2 JP7023836 B2 JP 7023836B2 JP 2018507336 A JP2018507336 A JP 2018507336A JP 2018507336 A JP2018507336 A JP 2018507336A JP 7023836 B2 JP7023836 B2 JP 7023836B2
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Japan
Prior art keywords
electromagnetic wave
adhesive layer
layer
wave shielding
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018507336A
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English (en)
Japanese (ja)
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JPWO2017164174A1 (ja
Inventor
善治 柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of JPWO2017164174A1 publication Critical patent/JPWO2017164174A1/ja
Application granted granted Critical
Publication of JP7023836B2 publication Critical patent/JP7023836B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2018507336A 2016-03-23 2017-03-21 電磁波シールドフィルム Active JP7023836B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016059059 2016-03-23
JP2016059059 2016-03-23
PCT/JP2017/011234 WO2017164174A1 (ja) 2016-03-23 2017-03-21 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
JPWO2017164174A1 JPWO2017164174A1 (ja) 2019-02-14
JP7023836B2 true JP7023836B2 (ja) 2022-02-22

Family

ID=59899408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018507336A Active JP7023836B2 (ja) 2016-03-23 2017-03-21 電磁波シールドフィルム

Country Status (5)

Country Link
JP (1) JP7023836B2 (ko)
KR (1) KR102280175B1 (ko)
CN (1) CN108702863B (ko)
TW (1) TWI732836B (ko)
WO (1) WO2017164174A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6546975B2 (ja) * 2017-10-16 2019-07-17 タツタ電線株式会社 導電性接着剤
CN109868077B (zh) * 2019-01-08 2021-06-15 信维通信（江苏）有限公司 一种隔磁片及其制作方法
TWI812889B (zh) 2020-03-03 2023-08-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
WO2023243621A1 (ja) * 2022-06-14 2023-12-21 株式会社スリーボンド 導電性樹脂組成物およびその硬化物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263030A (ja) 2003-02-28 2004-09-24 Dainippon Ink & Chem Inc 導電性粘着シート
JP2009079127A (ja) 2007-09-26 2009-04-16 Nitto Denko Corp 導電性粘着テープ
JP2009299186A (ja) 2008-05-12 2009-12-24 Nippon Steel Corp 表面処理金属板
JP2012178469A (ja) 2011-02-25 2012-09-13 Ist Corp 電波吸収体の製造方法、電波吸収体
JP2014056967A (ja) 2012-09-13 2014-03-27 Dic Corp 導電性薄型粘着シート
WO2015076174A1 (ja) 2013-11-20 2015-05-28 Dic株式会社 導電性粘着シート及び電子機器
JP5861790B1 (ja) 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05222346A (ja) * 1992-02-10 1993-08-31 Surion Tec:Kk 導電性粘着テープ
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2005277145A (ja) * 2004-03-25 2005-10-06 Dainippon Ink & Chem Inc 電磁波シールド用粘着シート
TWI360386B (en) 2005-02-18 2012-03-11 Toyo Ink Mfg Co Electro-magnetic wave shielding adhesive sheet, pr
JP4974803B2 (ja) 2007-08-03 2012-07-11 タツタ電線株式会社 プリント配線板用シールドフィルム及びプリント配線板
WO2011082058A1 (en) * 2009-12-29 2011-07-07 Rogers Corporation Conductive polymer foams, method of manufacture, and uses thereof
KR20140099258A (ko) * 2011-11-24 2014-08-11 다츠다 덴센 가부시키가이샤 차폐 필름, 차폐 프린트 배선판, 및 차폐 필름의 제조 방법
CN204259357U (zh) * 2014-12-16 2015-04-08 苏州城邦达力材料科技有限公司 一种带有金属镀层的电磁屏蔽膜

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263030A (ja) 2003-02-28 2004-09-24 Dainippon Ink & Chem Inc 導電性粘着シート
JP2009079127A (ja) 2007-09-26 2009-04-16 Nitto Denko Corp 導電性粘着テープ
JP2009299186A (ja) 2008-05-12 2009-12-24 Nippon Steel Corp 表面処理金属板
JP2012178469A (ja) 2011-02-25 2012-09-13 Ist Corp 電波吸収体の製造方法、電波吸収体
JP2014056967A (ja) 2012-09-13 2014-03-27 Dic Corp 導電性薄型粘着シート
WO2015076174A1 (ja) 2013-11-20 2015-05-28 Dic株式会社 導電性粘着シート及び電子機器
JP5861790B1 (ja) 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Also Published As

Publication number Publication date
KR20180122597A (ko) 2018-11-13
TWI732836B (zh) 2021-07-11
WO2017164174A1 (ja) 2017-09-28
JPWO2017164174A1 (ja) 2019-02-14
CN108702863A (zh) 2018-10-23
TW201802208A (zh) 2018-01-16
CN108702863B (zh) 2021-04-13
KR102280175B1 (ko) 2021-07-20

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