TWI732836B - 電磁波屏蔽膜 - Google Patents

電磁波屏蔽膜 Download PDF

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Publication number
TWI732836B
TWI732836B TW106109519A TW106109519A TWI732836B TW I732836 B TWI732836 B TW I732836B TW 106109519 A TW106109519 A TW 106109519A TW 106109519 A TW106109519 A TW 106109519A TW I732836 B TWI732836 B TW I732836B
Authority
TW
Taiwan
Prior art keywords
electromagnetic wave
layer
wave shielding
shielding film
adhesive layer
Prior art date
Application number
TW106109519A
Other languages
English (en)
Chinese (zh)
Other versions
TW201802208A (zh
Inventor
柳善治
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201802208A publication Critical patent/TW201802208A/zh
Application granted granted Critical
Publication of TWI732836B publication Critical patent/TWI732836B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
TW106109519A 2016-03-23 2017-03-22 電磁波屏蔽膜 TWI732836B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-059059 2016-03-23
JP2016059059 2016-03-23

Publications (2)

Publication Number Publication Date
TW201802208A TW201802208A (zh) 2018-01-16
TWI732836B true TWI732836B (zh) 2021-07-11

Family

ID=59899408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106109519A TWI732836B (zh) 2016-03-23 2017-03-22 電磁波屏蔽膜

Country Status (5)

Country Link
JP (1) JP7023836B2 (ko)
KR (1) KR102280175B1 (ko)
CN (1) CN108702863B (ko)
TW (1) TWI732836B (ko)
WO (1) WO2017164174A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6546975B2 (ja) * 2017-10-16 2019-07-17 タツタ電線株式会社 導電性接着剤
CN109868077B (zh) * 2019-01-08 2021-06-15 信维通信（江苏）有限公司 一种隔磁片及其制作方法
TWI812889B (zh) 2020-03-03 2023-08-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
WO2023243621A1 (ja) * 2022-06-14 2023-12-21 株式会社スリーボンド 導電性樹脂組成物およびその硬化物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277145A (ja) * 2004-03-25 2005-10-06 Dainippon Ink & Chem Inc 電磁波シールド用粘着シート
TW201322836A (zh) * 2011-11-24 2013-06-01 Tatsuta Densen Kk 遮罩膜、遮罩印刷電路板以及遮罩膜的製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05222346A (ja) * 1992-02-10 1993-08-31 Surion Tec:Kk 導電性粘着テープ
JP4201548B2 (ja) 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP4403360B2 (ja) 2003-02-28 2010-01-27 Ｄｉｃ株式会社 導電性粘着シート
TWI360386B (en) 2005-02-18 2012-03-11 Toyo Ink Mfg Co Electro-magnetic wave shielding adhesive sheet, pr
JP4974803B2 (ja) 2007-08-03 2012-07-11 タツタ電線株式会社 プリント配線板用シールドフィルム及びプリント配線板
JP5291316B2 (ja) * 2007-09-26 2013-09-18 日東電工株式会社 導電性粘着テープ
JP5353426B2 (ja) * 2008-05-12 2013-11-27 新日鐵住金株式会社 表面処理金属板
WO2011082058A1 (en) * 2009-12-29 2011-07-07 Rogers Corporation Conductive polymer foams, method of manufacture, and uses thereof
JP2012178469A (ja) 2011-02-25 2012-09-13 Ist Corp 電波吸収体の製造方法、電波吸収体
JP2014056967A (ja) * 2012-09-13 2014-03-27 Dic Corp 導電性薄型粘着シート
KR101819529B1 (ko) * 2013-11-20 2018-01-17 디아이씨 가부시끼가이샤 도전성 점착 시트 및 전자 기기
CN204259357U (zh) * 2014-12-16 2015-04-08 苏州城邦达力材料科技有限公司 一种带有金属镀层的电磁屏蔽膜
JP5861790B1 (ja) 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277145A (ja) * 2004-03-25 2005-10-06 Dainippon Ink & Chem Inc 電磁波シールド用粘着シート
TW201322836A (zh) * 2011-11-24 2013-06-01 Tatsuta Densen Kk 遮罩膜、遮罩印刷電路板以及遮罩膜的製造方法

Also Published As

Publication number Publication date
KR20180122597A (ko) 2018-11-13
WO2017164174A1 (ja) 2017-09-28
JPWO2017164174A1 (ja) 2019-02-14
CN108702863A (zh) 2018-10-23
TW201802208A (zh) 2018-01-16
CN108702863B (zh) 2021-04-13
JP7023836B2 (ja) 2022-02-22
KR102280175B1 (ko) 2021-07-20

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