JP6639175B2 - 乾燥装置及び乾燥処理方法 - Google Patents

乾燥装置及び乾燥処理方法 Download PDF

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Publication number: JP6639175B2
Authority: JP; Japan
Prior art keywords: substrate; pressure; drying; processing container; height position
Prior art date: 2015-09-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2015191651A

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English (en)

Japanese (ja)

Other versions

JP2017067343A (ja

Inventor

明典島村

林　輝幸

輝幸林

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Electron Ltd

Original Assignee

Tokyo Electron Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-09-29

Filing date

2015-09-29

Publication date

2020-02-05

2015-09-29 Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd

2015-09-29 Priority to JP2015191651A priority Critical patent/JP6639175B2/ja

2016-09-26 Priority to KR1020160123241A priority patent/KR101874521B1/ko

2016-09-26 Priority to CN201910012458.1A priority patent/CN110048027B/zh

2016-09-26 Priority to CN201610849761.3A priority patent/CN106972114B/zh

2016-09-26 Priority to TW105131096A priority patent/TWI637656B/zh

2017-04-06 Publication of JP2017067343A publication Critical patent/JP2017067343A/ja

2018-06-28 Priority to KR1020180074712A priority patent/KR101973016B1/ko

2020-02-05 Application granted granted Critical

2020-02-05 Publication of JP6639175B2 publication Critical patent/JP6639175B2/ja

Status Active legal-status Critical Current

2035-09-29 Anticipated expiration legal-status Critical

Links

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Images

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/811—Controlling the atmosphere during processing

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Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Drying Of Solid Materials (AREA)
Electroluminescent Light Sources (AREA)
Application Of Or Painting With Fluid Materials (AREA)

JP2015191651A 2015-09-29 2015-09-29 乾燥装置及び乾燥処理方法 Active JP6639175B2 (ja)

Priority Applications (6)

Application Number	Priority Date	Filing Date	Title
JP2015191651A JP6639175B2 (ja)	2015-09-29	2015-09-29	乾燥装置及び乾燥処理方法
KR1020160123241A KR101874521B1 (ko)	2015-09-29	2016-09-26	건조 장치 및 건조 처리 방법
CN201910012458.1A CN110048027B (zh)	2015-09-29	2016-09-26	干燥装置和干燥处理方法
CN201610849761.3A CN106972114B (zh)	2015-09-29	2016-09-26	干燥装置和干燥处理方法
TW105131096A TWI637656B (zh)	2015-09-29	2016-09-26	乾燥裝置及乾燥處理方法
KR1020180074712A KR101973016B1 (ko)	2015-09-29	2018-06-28	건조 장치 및 건조 처리 방법

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2015191651A JP6639175B2 (ja)	2015-09-29	2015-09-29	乾燥装置及び乾燥処理方法

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2019232727A Division JP6878557B2 (ja)	2019-12-24	2019-12-24	乾燥装置及び乾燥処理方法

Publications (2)

Publication Number	Publication Date
JP2017067343A JP2017067343A (ja)	2017-04-06
JP6639175B2 true JP6639175B2 (ja)	2020-02-05

Family

ID=58492131

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2015191651A Active JP6639175B2 (ja)	2015-09-29	2015-09-29	乾燥装置及び乾燥処理方法

Country Status (4)

Country	Link
JP (1)	JP6639175B2 (zh)
KR (2)	KR101874521B1 (zh)
CN (2)	CN106972114B (zh)
TW (1)	TWI637656B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6886866B2 (ja) *	2017-05-31	2021-06-16	東京エレクトロン株式会社	減圧乾燥装置
CN107676498B (zh) *	2017-09-25	2019-05-07	武汉华星光电技术有限公司	软烤设备的排气阀组件
JP7119617B2 (ja) *	2018-06-15	2022-08-17	東京エレクトロン株式会社	塗布膜形成方法及び塗布膜形成装置
JP7076135B2 (ja)	2018-07-27	2022-05-27	株式会社Joled	有機ｅｌ表示パネルの製造方法
CN110328975A (zh) *	2019-07-01	2019-10-15	深圳市华星光电半导体显示技术有限公司	真空干燥装置
CN112254504B (zh) *	2020-10-19	2023-10-17	西安圣华农业科技股份有限公司	隔板可调的农产品烘干设备
CN112880307B (zh) *	2021-01-12	2022-11-22	扬州大学	多片晶圆干燥用的多孔介质型稳定可调节气悬浮流场的装置及实现方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3920699B2 (ja) *	2001-09-19	2007-05-30	東京エレクトロン株式会社	減圧乾燥装置及び塗布膜形成方法
JP4244555B2 (ja) *	2002-02-25	2009-03-25	東京エレクトロン株式会社	被処理体の支持機構
EP3318928A1 (en) *	2004-06-09	2018-05-09	Nikon Corporation	Exposure apparatus and method for producing a device
JP2006105524A (ja) *	2004-10-07	2006-04-20	Dainippon Screen Mfg Co Ltd	減圧乾燥装置および減圧乾燥方法
JP2007073833A (ja) *	2005-09-08	2007-03-22	Dainippon Screen Mfg Co Ltd	減圧乾燥装置及び基板乾燥方法
JP2007253043A (ja) *	2006-03-22	2007-10-04	Toshiba Corp	液滴噴射装置及び塗布体の製造方法
JP5172132B2 (ja)	2006-11-01	2013-03-27	凸版印刷株式会社	カラーフィルタの製造方法
JP4272230B2 (ja) *	2006-12-22	2009-06-03	東京エレクトロン株式会社	減圧乾燥装置
JP2008311250A (ja) *	2007-06-12	2008-12-25	Tokyo Electron Ltd	リフローシステムおよびリフロー方法
JP2010272382A (ja) *	2009-05-22	2010-12-02	Panasonic Corp	機能性素子の製造方法および装置
JP2013161946A (ja) *	2012-02-06	2013-08-19	Tokyo Electron Ltd	基板処理装置及び基板処理方法
JP6181358B2 (ja) *	2012-07-25	2017-08-16	東京エレクトロン株式会社	ベーク処理システム及び有機ｅｌ素子の有機機能膜の積層体の製造方法
JP6328434B2 (ja) *	2013-03-14	2018-05-23	東京エレクトロン株式会社	乾燥装置及び乾燥処理方法
US9053917B2 (en)	2013-03-29	2015-06-09	Agilent Technologies, Inc.	Vacuum fired and brazed ion pump element

2015
- 2015-09-29 JP JP2015191651A patent/JP6639175B2/ja active Active
2016
- 2016-09-26 CN CN201610849761.3A patent/CN106972114B/zh active Active
- 2016-09-26 CN CN201910012458.1A patent/CN110048027B/zh active Active
- 2016-09-26 KR KR1020160123241A patent/KR101874521B1/ko active IP Right Grant
- 2016-09-26 TW TW105131096A patent/TWI637656B/zh active
2018
- 2018-06-28 KR KR1020180074712A patent/KR101973016B1/ko active IP Right Grant

Also Published As

Publication number	Publication date
KR20180079263A (ko)	2018-07-10
KR101874521B1 (ko)	2018-07-04
CN106972114A (zh)	2017-07-21
KR101973016B1 (ko)	2019-04-26
TW201728230A (zh)	2017-08-01
KR20170038161A (ko)	2017-04-06
CN106972114B (zh)	2019-01-04
JP2017067343A (ja)	2017-04-06
TWI637656B (zh)	2018-10-01
CN110048027A (zh)	2019-07-23
CN110048027B (zh)	2021-09-28

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Publication	Publication Date	Title
JP6639175B2 (ja)	2020-02-05	乾燥装置及び乾燥処理方法
CN106206378B (zh)	2020-12-01	减压干燥装置
KR102060059B1 (ko)	2019-12-27	건조 장치
JP2014026764A5 (zh)	2015-06-11
KR20140113398A (ko)	2014-09-24	건조 장치 및 건조 처리 방법
KR101822936B1 (ko)	2018-01-29	건조 장치, 건조 처리 방법, 기판 홀더 및 용매 흡착 시트
JP5084236B2 (ja)	2012-11-28	デバイス製造装置およびデバイス製造方法
JP2011065967A (ja)	2011-03-31	有機ｅｌ用加熱乾燥装置
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