JP6600588B2 - 基板搬送機構の洗浄方法及び基板処理システム - Google Patents
基板搬送機構の洗浄方法及び基板処理システム Download PDFInfo
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- JP6600588B2 JP6600588B2 JP2016054260A JP2016054260A JP6600588B2 JP 6600588 B2 JP6600588 B2 JP 6600588B2 JP 2016054260 A JP2016054260 A JP 2016054260A JP 2016054260 A JP2016054260 A JP 2016054260A JP 6600588 B2 JP6600588 B2 JP 6600588B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
- B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
また、上記目的を達成するために、本発明の基板搬送機構の洗浄方法は、熱で生成物を昇華させる熱処理室内へ基板を搬入する基板搬送機構の洗浄方法であって、前記基板搬送機構が有する前記基板を保持する保持部が、前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返すことにより、前記保持部の加熱及び冷却が連続して繰り返されることを特徴とする。
さらに、上記目的を達成するために、本発明の基板処理システムは、熱で生成物を昇華させる熱処理室と、該熱処理室内へ基板を搬入する基板搬送機構とを備える基板処理システムにおいて、前記基板搬送機構は前記基板を保持する保持部を有し、前記保持部が、前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返すことにより、前記保持部の加熱及び冷却が連続して繰り返されることを特徴とする。
10 基板処理システム
12 トランスファモジュール
13 PHT処理モジュール
14 搬送アーム
15 ステージ
32 リフトピン
38 ピック
Claims (10)
- 熱で生成物を昇華させる熱処理室内へ基板を搬入する基板搬送機構の洗浄方法であって、
前記基板搬送機構が有する前記基板を保持する保持部が、前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返し、
前記熱処理室内には前記基板を載置して加熱する載置台と、該載置台から前記基板を離間させる離間機構とが配置され、
前記保持部は重ねて配置された少なくとも2つ以上の保持手段を有し、
前記離間機構が前記載置台によって加熱された基板を前記載置台から支持して離間させたときに、前記保持部が前記載置台及び前記離間した基板の間に進入することを特徴とする基板搬送機構の洗浄方法。 - 前記保持部が前記載置台及び前記離間した基板の間に進入した後、前記離間した基板側の前記保持手段が前記離間した基板を保持することを特徴とする請求項1記載の基板搬送機構の洗浄方法。
- 前記保持部が前記載置台及び前記離間した基板の間に進入した後も、前記離間機構が前記離間した基板を支持し続けることを特徴とする請求項1記載の基板搬送機構の洗浄方法。
- 前記基板搬送機構は搬送室内に配置され、
前記保持部が前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返す際、前記搬送室内の圧力は前記熱処理室内の圧力よりも高く設定されることを特徴とする請求項1乃至3のいずれか1項に記載の基板搬送機構の洗浄方法。 - 前記保持部が前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返す際、前記保持部の温度を所定の温度以上に維持することを特徴とする請求項1乃至4のいずれか1項に記載の基板搬送機構の洗浄方法。
- 熱で生成物を昇華させる熱処理室と、該熱処理室内へ基板を搬入する基板搬送機構とを備える基板処理システムにおいて、
前記基板搬送機構は前記基板を保持する保持部を有し、
前記保持部が、前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返し、
前記熱処理室内には前記基板を載置して加熱する載置台と、該載置台から前記基板を離間させる離間機構とが配置され、
前記保持部は重ねて配置された少なくとも2つ以上の保持手段を有し、
前記離間機構が前記載置台によって加熱された基板を前記載置台から支持して離間させたときに、前記保持部が前記載置台及び前記離間した基板の間に進入することを特徴とする基板処理システム。 - 熱で生成物を昇華させる熱処理室内へ基板を搬入する基板搬送機構の洗浄方法であって、
前記基板搬送機構が有する前記基板を保持する保持部が、前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返すことにより、前記保持部の加熱及び冷却が連続して繰り返されることを特徴とする基板搬送機構の洗浄方法。 - 前記保持部が前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返す際、前記保持部の温度を所定の温度以上に維持することを特徴とする請求項7記載の基板搬送機構の洗浄方法。
- 前記保持部が前記熱処理室内から退出した後、前記保持部の温度が前記所定の温度まで低下しない内に前記保持部を再度前記熱処理室内に進入させることを特徴とする請求項8記載の基板搬送機構の洗浄方法。
- 熱で生成物を昇華させる熱処理室と、該熱処理室内へ基板を搬入する基板搬送機構とを備える基板処理システムにおいて、
前記基板搬送機構は前記基板を保持する保持部を有し、
前記保持部が、前記熱処理室内への進入及び前記熱処理室内からの退出を繰り返すことにより、前記保持部の加熱及び冷却が連続して繰り返されることを特徴とする基板処理システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2016054260A JP6600588B2 (ja) | 2016-03-17 | 2016-03-17 | 基板搬送機構の洗浄方法及び基板処理システム |
US15/457,884 US10569310B2 (en) | 2016-03-17 | 2017-03-13 | Method for cleaning substrate transfer mechanism and substrate processing system |
TW106108445A TWI770012B (zh) | 2016-03-17 | 2017-03-15 | 基板搬送機構之洗淨方法及基板處理系統 |
KR1020170032695A KR102002210B1 (ko) | 2016-03-17 | 2017-03-15 | 기판 반송 기구의 세정 방법 및 기판 처리 시스템 |
US16/734,807 US11148179B2 (en) | 2016-03-17 | 2020-01-06 | Method for cleaning substrate transfer mechanism and substrate processing system |
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JP2016054260A JP6600588B2 (ja) | 2016-03-17 | 2016-03-17 | 基板搬送機構の洗浄方法及び基板処理システム |
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JP6600588B2 true JP6600588B2 (ja) | 2019-10-30 |
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JP (1) | JP6600588B2 (ja) |
KR (1) | KR102002210B1 (ja) |
TW (1) | TWI770012B (ja) |
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TWI635559B (zh) * | 2017-07-25 | 2018-09-11 | 春田科技顧問股份有限公司 | 裝載埠的吹淨裝置及其吹淨方法 |
JP7142494B2 (ja) * | 2018-06-25 | 2022-09-27 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
CN112956010A (zh) * | 2018-11-14 | 2021-06-11 | 东京毅力科创株式会社 | 基板处理装置和基板输送方法 |
JP7253955B2 (ja) * | 2019-03-28 | 2023-04-07 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP7403234B2 (ja) | 2019-04-25 | 2023-12-22 | 東京エレクトロン株式会社 | 基板処理装置、及び基板処理方法 |
US20230069085A1 (en) * | 2021-08-27 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company Limited | Process tool and method for handling semiconductor substrate |
CN116197159B (zh) * | 2023-04-24 | 2023-07-04 | 保定通力电器设备有限公司 | 一种避雷器生产的残留胶料去除装置 |
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JPH11354503A (ja) | 1998-06-08 | 1999-12-24 | Hitachi Ltd | エッチング装置およびその操作方法ならびに半導体装置の製造方法 |
KR100568256B1 (ko) * | 2003-12-11 | 2006-04-07 | 삼성전자주식회사 | 반도체 소자 제조 장비의 세정 방법 |
WO2007018157A1 (ja) * | 2005-08-05 | 2007-02-15 | Tokyo Electron Limited | 基板処理装置およびそれに用いる基板載置台 |
JP5046506B2 (ja) * | 2005-10-19 | 2012-10-10 | 東京エレクトロン株式会社 | 基板処理装置,基板処理方法,プログラム,プログラムを記録した記録媒体 |
JP4854317B2 (ja) * | 2006-01-31 | 2012-01-18 | 東京エレクトロン株式会社 | 基板処理方法 |
JP2008135517A (ja) | 2006-11-28 | 2008-06-12 | Tokyo Electron Ltd | 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体 |
JP5084250B2 (ja) * | 2006-12-26 | 2012-11-28 | 東京エレクトロン株式会社 | ガス処理装置およびガス処理方法ならびに記憶媒体 |
JP5106331B2 (ja) | 2008-09-16 | 2012-12-26 | 東京エレクトロン株式会社 | 基板載置台の降温方法、コンピュータ読み取り可能な記憶媒体および基板処理システム |
JP5715904B2 (ja) | 2011-07-29 | 2015-05-13 | 東京エレクトロン株式会社 | 熱処理装置、及びこれに基板を搬送する基板搬送方法 |
JP5886023B2 (ja) * | 2011-12-16 | 2016-03-16 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法および装置 |
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- 2017-03-13 US US15/457,884 patent/US10569310B2/en active Active
- 2017-03-15 TW TW106108445A patent/TWI770012B/zh active
- 2017-03-15 KR KR1020170032695A patent/KR102002210B1/ko active IP Right Grant
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Also Published As
Publication number | Publication date |
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TW201801812A (zh) | 2018-01-16 |
US11148179B2 (en) | 2021-10-19 |
KR102002210B1 (ko) | 2019-07-19 |
US20170266700A1 (en) | 2017-09-21 |
JP2017168738A (ja) | 2017-09-21 |
US20200139413A1 (en) | 2020-05-07 |
KR20170108866A (ko) | 2017-09-27 |
US10569310B2 (en) | 2020-02-25 |
TWI770012B (zh) | 2022-07-11 |
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