JP6579929B2 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
JP6579929B2
JP6579929B2 JP2015230740A JP2015230740A JP6579929B2 JP 6579929 B2 JP6579929 B2 JP 6579929B2 JP 2015230740 A JP2015230740 A JP 2015230740A JP 2015230740 A JP2015230740 A JP 2015230740A JP 6579929 B2 JP6579929 B2 JP 6579929B2
Authority
JP
Japan
Prior art keywords
workpiece
chuck table
unit
precut
workpieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015230740A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017098465A (ja
Inventor
山銅　英之
英之 山銅
万平 田中
万平 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2015230740A priority Critical patent/JP6579929B2/ja
Priority to KR1020160153194A priority patent/KR102463650B1/ko
Publication of JP2017098465A publication Critical patent/JP2017098465A/ja
Application granted granted Critical
Publication of JP6579929B2 publication Critical patent/JP6579929B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP2015230740A 2015-11-26 2015-11-26 加工装置 Active JP6579929B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015230740A JP6579929B2 (ja) 2015-11-26 2015-11-26 加工装置
KR1020160153194A KR102463650B1 (ko) 2015-11-26 2016-11-17 가공 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015230740A JP6579929B2 (ja) 2015-11-26 2015-11-26 加工装置

Publications (2)

Publication Number Publication Date
JP2017098465A JP2017098465A (ja) 2017-06-01
JP6579929B2 true JP6579929B2 (ja) 2019-09-25

Family

ID=58803853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015230740A Active JP6579929B2 (ja) 2015-11-26 2015-11-26 加工装置

Country Status (2)

Country Link
JP (1) JP6579929B2 (ko)
KR (1) KR102463650B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022083106A (ja) * 2020-11-24 2022-06-03 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
JP2022083118A (ja) * 2020-11-24 2022-06-03 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148275A (ja) * 1995-11-17 1997-06-06 Disco Abrasive Syst Ltd 大口径ウェーハのダイシングシステム
JP4339452B2 (ja) 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP2005129567A (ja) 2003-10-21 2005-05-19 Trecenti Technologies Inc 半導体装置の製造方法
KR100596505B1 (ko) * 2004-09-08 2006-07-05 삼성전자주식회사 소잉/소팅 시스템
JP2009302369A (ja) 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd 板状物の加工方法及び加工装置
JP2014093444A (ja) 2012-11-05 2014-05-19 Disco Abrasive Syst Ltd ウエーハの加工方法
JP6228058B2 (ja) 2014-03-28 2017-11-08 株式会社東京精密 半導体製造装置及び半導体の製造方法

Also Published As

Publication number Publication date
JP2017098465A (ja) 2017-06-01
KR20170061599A (ko) 2017-06-05
KR102463650B1 (ko) 2022-11-03

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