JP6571379B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP6571379B2
JP6571379B2 JP2015092100A JP2015092100A JP6571379B2 JP 6571379 B2 JP6571379 B2 JP 6571379B2 JP 2015092100 A JP2015092100 A JP 2015092100A JP 2015092100 A JP2015092100 A JP 2015092100A JP 6571379 B2 JP6571379 B2 JP 6571379B2
Authority
JP
Japan
Prior art keywords
workpiece
pair
cutting
auxiliary
temporary placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015092100A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016207987A (ja
Inventor
大河原　聡
聡 大河原
惇 八木原
惇 八木原
健太郎 寺師
健太郎 寺師
勝彦 赤瀬
勝彦 赤瀬
伸太郎 松岡
伸太郎 松岡
万平 田中
万平 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2015092100A priority Critical patent/JP6571379B2/ja
Priority to TW105107380A priority patent/TWI699265B/zh
Priority to KR1020160047471A priority patent/KR102402403B1/ko
Priority to CN201610274144.5A priority patent/CN106079122B/zh
Publication of JP2016207987A publication Critical patent/JP2016207987A/ja
Application granted granted Critical
Publication of JP6571379B2 publication Critical patent/JP6571379B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2015092100A 2015-04-28 2015-04-28 切削装置 Active JP6571379B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015092100A JP6571379B2 (ja) 2015-04-28 2015-04-28 切削装置
TW105107380A TWI699265B (zh) 2015-04-28 2016-03-10 切削裝置
KR1020160047471A KR102402403B1 (ko) 2015-04-28 2016-04-19 절삭 장치
CN201610274144.5A CN106079122B (zh) 2015-04-28 2016-04-28 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015092100A JP6571379B2 (ja) 2015-04-28 2015-04-28 切削装置

Publications (2)

Publication Number Publication Date
JP2016207987A JP2016207987A (ja) 2016-12-08
JP6571379B2 true JP6571379B2 (ja) 2019-09-04

Family

ID=57487351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015092100A Active JP6571379B2 (ja) 2015-04-28 2015-04-28 切削装置

Country Status (4)

Country Link
JP (1) JP6571379B2 (zh)
KR (1) KR102402403B1 (zh)
CN (1) CN106079122B (zh)
TW (1) TWI699265B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6607175B2 (ja) * 2016-12-07 2019-11-20 株式会社ダイフク 移載機
JP7233813B2 (ja) * 2018-12-04 2023-03-07 株式会社ディスコ 加工装置
JP7191472B2 (ja) * 2019-01-25 2022-12-19 株式会社ディスコ 加工装置の使用方法
JP7463032B2 (ja) 2020-05-22 2024-04-08 株式会社ディスコ 被加工物の保持機構及び加工装置
JP7297392B2 (ja) * 2020-09-11 2023-06-26 東芝三菱電機産業システム株式会社 リード線切断装置
CN117276161B (zh) * 2023-11-22 2024-02-02 和研半导体设备(沈阳)有限公司 一种晶圆加工***及方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05338728A (ja) * 1992-06-05 1993-12-21 Fujitsu Ltd ウエーハ搬送方法及び装置
JP3493282B2 (ja) * 1997-07-02 2004-02-03 株式会社ディスコ 切削方法
JP3203364B2 (ja) * 1997-12-01 2001-08-27 株式会社東京精密 アライメント方法及びその装置
JP3203365B2 (ja) * 1997-12-02 2001-08-27 株式会社東京精密 ダイシング装置におけるワーク切断方法
JPH11204461A (ja) * 1998-01-09 1999-07-30 Disco Abrasive Syst Ltd フレーム位置決め装置及びフレーム位置決め方法
JP2001053034A (ja) * 1999-08-13 2001-02-23 Tokyo Seimitsu Co Ltd ワークテーブルの送り機構及びダイシング装置
JP2002299288A (ja) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd バーコードリーダ付半導体製造装置
JP3956643B2 (ja) * 2001-04-27 2007-08-08 株式会社東京精密 ダイシングマシン
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP4796249B2 (ja) 2001-09-14 2011-10-19 株式会社ディスコ 板状物の搬送機構および搬送機構を備えたダイシング装置
JP2004235250A (ja) * 2003-01-28 2004-08-19 Disco Abrasive Syst Ltd 切削装置
JP4564832B2 (ja) * 2004-11-30 2010-10-20 株式会社ディスコ 矩形基板の分割装置
JP4813855B2 (ja) 2005-09-12 2011-11-09 株式会社ディスコ 切削装置および加工方法
JP2010003876A (ja) * 2008-06-20 2010-01-07 Disco Abrasive Syst Ltd 切削装置
JP5964548B2 (ja) 2011-02-24 2016-08-03 株式会社ディスコ ウエーハ加工装置

Also Published As

Publication number Publication date
KR102402403B1 (ko) 2022-05-25
KR20160128223A (ko) 2016-11-07
TWI699265B (zh) 2020-07-21
CN106079122B (zh) 2019-09-06
JP2016207987A (ja) 2016-12-08
CN106079122A (zh) 2016-11-09
TW201700244A (zh) 2017-01-01

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