JP6571379B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP6571379B2 JP6571379B2 JP2015092100A JP2015092100A JP6571379B2 JP 6571379 B2 JP6571379 B2 JP 6571379B2 JP 2015092100 A JP2015092100 A JP 2015092100A JP 2015092100 A JP2015092100 A JP 2015092100A JP 6571379 B2 JP6571379 B2 JP 6571379B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- pair
- cutting
- auxiliary
- temporary placement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015092100A JP6571379B2 (ja) | 2015-04-28 | 2015-04-28 | 切削装置 |
TW105107380A TWI699265B (zh) | 2015-04-28 | 2016-03-10 | 切削裝置 |
KR1020160047471A KR102402403B1 (ko) | 2015-04-28 | 2016-04-19 | 절삭 장치 |
CN201610274144.5A CN106079122B (zh) | 2015-04-28 | 2016-04-28 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015092100A JP6571379B2 (ja) | 2015-04-28 | 2015-04-28 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016207987A JP2016207987A (ja) | 2016-12-08 |
JP6571379B2 true JP6571379B2 (ja) | 2019-09-04 |
Family
ID=57487351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015092100A Active JP6571379B2 (ja) | 2015-04-28 | 2015-04-28 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6571379B2 (zh) |
KR (1) | KR102402403B1 (zh) |
CN (1) | CN106079122B (zh) |
TW (1) | TWI699265B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6607175B2 (ja) * | 2016-12-07 | 2019-11-20 | 株式会社ダイフク | 移載機 |
JP7233813B2 (ja) * | 2018-12-04 | 2023-03-07 | 株式会社ディスコ | 加工装置 |
JP7191472B2 (ja) * | 2019-01-25 | 2022-12-19 | 株式会社ディスコ | 加工装置の使用方法 |
JP7463032B2 (ja) | 2020-05-22 | 2024-04-08 | 株式会社ディスコ | 被加工物の保持機構及び加工装置 |
JP7297392B2 (ja) * | 2020-09-11 | 2023-06-26 | 東芝三菱電機産業システム株式会社 | リード線切断装置 |
CN117276161B (zh) * | 2023-11-22 | 2024-02-02 | 和研半导体设备(沈阳)有限公司 | 一种晶圆加工***及方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05338728A (ja) * | 1992-06-05 | 1993-12-21 | Fujitsu Ltd | ウエーハ搬送方法及び装置 |
JP3493282B2 (ja) * | 1997-07-02 | 2004-02-03 | 株式会社ディスコ | 切削方法 |
JP3203364B2 (ja) * | 1997-12-01 | 2001-08-27 | 株式会社東京精密 | アライメント方法及びその装置 |
JP3203365B2 (ja) * | 1997-12-02 | 2001-08-27 | 株式会社東京精密 | ダイシング装置におけるワーク切断方法 |
JPH11204461A (ja) * | 1998-01-09 | 1999-07-30 | Disco Abrasive Syst Ltd | フレーム位置決め装置及びフレーム位置決め方法 |
JP2001053034A (ja) * | 1999-08-13 | 2001-02-23 | Tokyo Seimitsu Co Ltd | ワークテーブルの送り機構及びダイシング装置 |
JP2002299288A (ja) * | 2001-04-02 | 2002-10-11 | Tokyo Seimitsu Co Ltd | バーコードリーダ付半導体製造装置 |
JP3956643B2 (ja) * | 2001-04-27 | 2007-08-08 | 株式会社東京精密 | ダイシングマシン |
US6826986B2 (en) * | 2001-05-05 | 2004-12-07 | Ah Beng Lim | Bi-directional singulation system and method |
JP4796249B2 (ja) | 2001-09-14 | 2011-10-19 | 株式会社ディスコ | 板状物の搬送機構および搬送機構を備えたダイシング装置 |
JP2004235250A (ja) * | 2003-01-28 | 2004-08-19 | Disco Abrasive Syst Ltd | 切削装置 |
JP4564832B2 (ja) * | 2004-11-30 | 2010-10-20 | 株式会社ディスコ | 矩形基板の分割装置 |
JP4813855B2 (ja) | 2005-09-12 | 2011-11-09 | 株式会社ディスコ | 切削装置および加工方法 |
JP2010003876A (ja) * | 2008-06-20 | 2010-01-07 | Disco Abrasive Syst Ltd | 切削装置 |
JP5964548B2 (ja) | 2011-02-24 | 2016-08-03 | 株式会社ディスコ | ウエーハ加工装置 |
-
2015
- 2015-04-28 JP JP2015092100A patent/JP6571379B2/ja active Active
-
2016
- 2016-03-10 TW TW105107380A patent/TWI699265B/zh active
- 2016-04-19 KR KR1020160047471A patent/KR102402403B1/ko active IP Right Grant
- 2016-04-28 CN CN201610274144.5A patent/CN106079122B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR102402403B1 (ko) | 2022-05-25 |
KR20160128223A (ko) | 2016-11-07 |
TWI699265B (zh) | 2020-07-21 |
CN106079122B (zh) | 2019-09-06 |
JP2016207987A (ja) | 2016-12-08 |
CN106079122A (zh) | 2016-11-09 |
TW201700244A (zh) | 2017-01-01 |
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