JP6545691B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6545691B2 JP6545691B2 JP2016548517A JP2016548517A JP6545691B2 JP 6545691 B2 JP6545691 B2 JP 6545691B2 JP 2016548517 A JP2016548517 A JP 2016548517A JP 2016548517 A JP2016548517 A JP 2016548517A JP 6545691 B2 JP6545691 B2 JP 6545691B2
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- 239000004065 semiconductor Substances 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000005530 etching Methods 0.000 claims description 77
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 37
- 239000010936 titanium Substances 0.000 claims description 37
- 229910052719 titanium Inorganic materials 0.000 claims description 37
- 238000002360 preparation method Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 55
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 32
- 229910021529 ammonia Inorganic materials 0.000 description 19
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 19
- -1 ammonia peroxide Chemical class 0.000 description 19
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 13
- 229910010271 silicon carbide Inorganic materials 0.000 description 12
- 238000000354 decomposition reaction Methods 0.000 description 10
- 238000001039 wet etching Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000007790 scraping Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 2
- OUUQCZGPVNCOIJ-UHFFFAOYSA-N hydroperoxyl Chemical compound O[O] OUUQCZGPVNCOIJ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010280 TiOH Inorganic materials 0.000 description 1
- 229910010275 TiOOH Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/38—Alkaline compositions for etching refractory metals
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- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/0495—Schottky electrodes
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28537—Deposition of Schottky electrodes
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
まず、ステップS100において、アンモニア過水液22を調合する。図4は、本発明の実施の形態にかかるエッチング液29の準備工程を示す図である。チタンが溶かされていないアンモニア水24、過酸化水素水26、および純水28を、順番に処理槽20に投入することで、アンモニア過水液22を作製する。事前に調合しておくと濃度が変化するため、液作製時にそれぞれ投入することが好ましい。アンモニア過水液22はエッチング使用前すなわち未使用のものなので、チタンなどの金属が含まれていない。
次に、ステップS102に進み、アンモニア過水液22にチタンと溶かす。図5は、本発明の実施の形態にかかるエッチング液29の準備工程を示す図である。図5では、一例として、シリコン(Si)などの半導体基板40上にチタン膜42を成膜した半導体ウェハ44を処理槽20内に投入することにより、アンモニア過水液22にチタン膜42を溶かす。半導体ウェハ44は、アンモニア過水液22に事前にチタンを溶かすためのものである。従って半導体ウェハ44には、エッチング処理対象のウェハとは異なりチタン膜42をパターニングするためのレジストが設けられていない。なお本発明は半導体ウェハ44を用いる実施形態に限られるものではなく、例えばチタン微粒子などを処理槽20に投入してもよい。ステップS102によりエッチング液29が完成する。
次に、ステップS104において、図2に示す装置構成において循環ポンプ32を駆動させてエッチング液29を循環する。本実施形態では、好ましい形態として、処理槽20のエッチング液29の濃度および温度を一定にするために、循環ポンプ32を用いて処理槽20内のエッチング液29を循環させるものとする。エッチング液29を循環させることで、エッチング均一性を向上させる。すなわち、処理槽20内のエッチング液29を循環ポンプ32で循環させることにより、処理槽20内のエッチング液29の濃度を均一に保つことができる。また、処理槽20に温度調節器34を取り付けてエッチング液29の温度が一定になるようにエッチング液29の循環を行っているので、温度変化によるエッチング速度の変化を抑制することもできる。
H2O2+OH ⇔ H2O+OOH ・・・(式1)
H2O2+OOH→O2+H2O+OH ・・・(式2)
TiOOH+NH3=NH2OH/TiOH ・・・(式3)
ヒドロペルオキシルラジカルは、ヒドロキシルアミンを生成するのに優先的に消費される。ヒドロキシルアミンすなわちNH2OHは、チタンの塩である。式3の反応があるため、式2に示すヒドロペルオキシルラジカルによる過酸化水素の分解反応を抑制することができる。アンモニア過水液22にチタンを溶かす量は、上記式2の反応を十分に抑制できるように実験的に定めればよい。
次に、ステップS106において、SiCウェハ10を処理槽20に入れてエッチング液29に浸す。図6は、本発明の実施の形態にかかるエッチング工程を示す図である。エッチングを行うSiCウェハ10は、SiC基板12にチタン膜14を積層し、チタン膜14上にレジスト膜16を積層し、レジスト膜16を所望の形状にパターニングしたものである。図6では、チタン膜14にエッチング溝15が形成されている様子を示している。
Claims (5)
- エッチング使用前のアンモニア過水液に予めチタンを溶かした液体をエッチング液として準備する準備工程と、
前記準備工程の後に、処理槽の中での前記エッチング液の濃度を均一にするように、前記エッチング液の流動を行う流動工程と、
前記流動工程を開始した後に、レジスト膜および金属膜を備えた半導体ウェハを前記処理槽内に入れることで、前記エッチング液で前記金属膜をエッチングする処理工程と、
を備える半導体装置の製造方法。 - 前記金属膜がチタンで形成された請求項1に記載の半導体装置の製造方法。
- 温度調節器を経由して流れるように前記エッチング液を流動させることで前記エッチング液の温度を調節する請求項1に記載の半導体装置の製造方法。
- 前記処理槽が、前記エッチング液が貯留される第1槽と、前記第1槽から溢れた前記エッチング液が流入する第2槽と、前記第1槽と前記第2槽とを接続する流路と、を備え、
前記流動工程は、前記流路を介して前記第2槽から前記第1槽へと前記エッチング液を循環させる請求項1に記載の半導体装置の製造方法。 - 前記半導体ウェハがSiCウェハであり、前記金属膜は前記SiCウェハにショットキー接合した請求項1に記載の半導体装置の製造方法。
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PCT/JP2014/074881 WO2016042667A1 (ja) | 2014-09-19 | 2014-09-19 | 半導体装置の製造方法 |
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JPWO2016042667A1 JPWO2016042667A1 (ja) | 2017-06-01 |
JP6545691B2 true JP6545691B2 (ja) | 2019-07-17 |
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US (1) | US9881818B2 (ja) |
JP (1) | JP6545691B2 (ja) |
KR (1) | KR101900631B1 (ja) |
CN (2) | CN114438494A (ja) |
DE (1) | DE112014006962T5 (ja) |
WO (1) | WO2016042667A1 (ja) |
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CN111659665B (zh) * | 2020-05-29 | 2022-02-01 | 徐州鑫晶半导体科技有限公司 | 硅片的清洗方法及硅片的清洗设备 |
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JPH07166373A (ja) * | 1993-12-15 | 1995-06-27 | Tanaka Kikinzoku Kogyo Kk | はんだバンプのバリヤメタル用エッチング液 |
JPH0942600A (ja) * | 1995-08-02 | 1997-02-14 | Hitachi Ltd | 薬液供給装置 |
JPH09275098A (ja) * | 1996-04-03 | 1997-10-21 | Casio Comput Co Ltd | エッチング方法 |
JPH10223595A (ja) * | 1997-02-03 | 1998-08-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US6399517B2 (en) * | 1999-03-30 | 2002-06-04 | Tokyo Electron Limited | Etching method and etching apparatus |
KR100396695B1 (ko) | 2000-11-01 | 2003-09-02 | 엘지.필립스 엘시디 주식회사 | 에천트 및 이를 이용한 전자기기용 기판의 제조방법 |
JP3939630B2 (ja) * | 2002-10-31 | 2007-07-04 | エム・エフエスアイ株式会社 | 沸騰薬液の管理方法 |
JP2004214243A (ja) * | 2002-12-27 | 2004-07-29 | Toshiba Corp | 半導体ウェーハのエッチング方法及びエッチング装置 |
JP4363061B2 (ja) * | 2003-03-04 | 2009-11-11 | 株式会社デンソー | 抵抗体を備えた半導体装置の製造方法 |
JP4471094B2 (ja) * | 2004-05-11 | 2010-06-02 | 三菱瓦斯化学株式会社 | チタンまたはチタン合金のエッチング液 |
JP4551229B2 (ja) * | 2005-01-31 | 2010-09-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法およびエッチング液 |
US20060247803A1 (en) * | 2005-03-29 | 2006-11-02 | Kazushi Mori | Control system, control method, process system, and computer readable storage medium and computer program |
JP4978548B2 (ja) | 2008-04-25 | 2012-07-18 | 三菱化学株式会社 | エッチング方法及び半導体デバイス用基板の製造方法 |
JP2014011342A (ja) * | 2012-06-29 | 2014-01-20 | Denso Corp | 炭化珪素半導体装置 |
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2014
- 2014-09-19 CN CN202210120071.XA patent/CN114438494A/zh active Pending
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