JP6315092B2 - めっき用治具 - Google Patents
めっき用治具 Download PDFInfo
- Publication number
- JP6315092B2 JP6315092B2 JP2016529582A JP2016529582A JP6315092B2 JP 6315092 B2 JP6315092 B2 JP 6315092B2 JP 2016529582 A JP2016529582 A JP 2016529582A JP 2016529582 A JP2016529582 A JP 2016529582A JP 6315092 B2 JP6315092 B2 JP 6315092B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plating
- holding base
- locked
- locking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014131070 | 2014-06-26 | ||
JP2014131070 | 2014-06-26 | ||
PCT/JP2015/067951 WO2015199047A1 (ja) | 2014-06-26 | 2015-06-23 | めっき用治具 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018059538A Division JP6489259B2 (ja) | 2014-06-26 | 2018-03-27 | めっき用治具及びめっき装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015199047A1 JPWO2015199047A1 (ja) | 2017-04-27 |
JP6315092B2 true JP6315092B2 (ja) | 2018-04-25 |
Family
ID=54938129
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016529582A Active JP6315092B2 (ja) | 2014-06-26 | 2015-06-23 | めっき用治具 |
JP2018059538A Active JP6489259B2 (ja) | 2014-06-26 | 2018-03-27 | めっき用治具及びめっき装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018059538A Active JP6489259B2 (ja) | 2014-06-26 | 2018-03-27 | めっき用治具及びめっき装置 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6315092B2 (ko) |
KR (1) | KR101871624B1 (ko) |
CN (1) | CN106471162B (ko) |
WO (1) | WO2015199047A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106435701A (zh) * | 2016-12-14 | 2017-02-22 | 陕西宝光真空电器股份有限公司 | 一种具有均衡电阻值的电镀用挂具 |
CN108022869A (zh) * | 2017-12-29 | 2018-05-11 | 上海新阳半导体材料股份有限公司 | 晶圆挂具 |
KR102038875B1 (ko) * | 2018-02-09 | 2019-10-31 | 코리아테크노주식회사 | 웨이퍼 간격링의 이송장치와 웨이퍼 간격링의 이송방법 |
TWI641079B (zh) * | 2018-04-11 | 2018-11-11 | 姜力 | Wafer fixture for electroplating equipment |
CN110387571B (zh) * | 2018-04-17 | 2021-07-30 | 颀中科技(苏州)有限公司 | 用于电镀设备的晶圆夹具 |
CN110528041A (zh) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | 用于晶元的电镀加工方法、晶元及线路板 |
JP7421302B2 (ja) * | 2019-10-07 | 2024-01-24 | 上村工業株式会社 | 保持治具 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0730687Y2 (ja) * | 1987-10-22 | 1995-07-12 | セイコー電子工業株式会社 | バンプめっき装置 |
JP4037504B2 (ja) * | 1998-01-09 | 2008-01-23 | 株式会社荏原製作所 | 半導体ウエハのメッキ治具 |
JP2000150421A (ja) * | 1998-11-13 | 2000-05-30 | Ebara Corp | 基板のメッキ装置及びメッキ方法 |
US6444101B1 (en) * | 1999-11-12 | 2002-09-03 | Applied Materials, Inc. | Conductive biasing member for metal layering |
JP3979847B2 (ja) * | 2000-03-17 | 2007-09-19 | 株式会社荏原製作所 | めっき装置 |
JP2002294495A (ja) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | 液処理装置 |
US6540899B2 (en) * | 2001-04-05 | 2003-04-01 | All Wet Technologies, Inc. | Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces |
JP2003171791A (ja) * | 2001-12-03 | 2003-06-20 | Hitachi Kyowa Engineering Co Ltd | 自動めっき方法及びその装置 |
JP3778281B2 (ja) * | 2002-03-26 | 2006-05-24 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP4162440B2 (ja) * | 2002-07-22 | 2008-10-08 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
KR100980051B1 (ko) * | 2002-06-21 | 2010-09-06 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판홀더 및 도금장치 |
JP2006233296A (ja) * | 2005-02-25 | 2006-09-07 | Yamamoto Mekki Shikenki:Kk | 電気めっき用治具 |
JP4852338B2 (ja) * | 2006-04-26 | 2012-01-11 | 株式会社フジクラ | メッキシステム |
JP4463286B2 (ja) * | 2007-02-05 | 2010-05-19 | 株式会社荏原製作所 | 半導体ウエハのメッキ治具、治具装着装置、半導体ウエハのメッキ装置 |
US8286929B2 (en) * | 2008-04-01 | 2012-10-16 | Texas Instruments Incorporated | Clam shell two-pin wafer holder for metal plating |
US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
JP5766048B2 (ja) * | 2010-08-19 | 2015-08-19 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP5750327B2 (ja) * | 2010-10-21 | 2015-07-22 | 株式会社荏原製作所 | めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 |
JP5643239B2 (ja) * | 2012-01-30 | 2014-12-17 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
CN103469271B (zh) * | 2013-09-11 | 2016-02-17 | 深圳市创智成功科技有限公司 | 晶圆电镀的挂具 |
-
2015
- 2015-06-23 CN CN201580033875.4A patent/CN106471162B/zh active Active
- 2015-06-23 JP JP2016529582A patent/JP6315092B2/ja active Active
- 2015-06-23 KR KR1020167035904A patent/KR101871624B1/ko active IP Right Grant
- 2015-06-23 WO PCT/JP2015/067951 patent/WO2015199047A1/ja active Application Filing
-
2018
- 2018-03-27 JP JP2018059538A patent/JP6489259B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN106471162B (zh) | 2018-09-25 |
KR20170008299A (ko) | 2017-01-23 |
JP6489259B2 (ja) | 2019-03-27 |
JP2018090912A (ja) | 2018-06-14 |
KR101871624B1 (ko) | 2018-06-26 |
WO2015199047A1 (ja) | 2015-12-30 |
JPWO2015199047A1 (ja) | 2017-04-27 |
CN106471162A (zh) | 2017-03-01 |
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Legal Events
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A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180227 |
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