JP6315092B2 - めっき用治具 - Google Patents

めっき用治具 Download PDF

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Publication number
JP6315092B2
JP6315092B2 JP2016529582A JP2016529582A JP6315092B2 JP 6315092 B2 JP6315092 B2 JP 6315092B2 JP 2016529582 A JP2016529582 A JP 2016529582A JP 2016529582 A JP2016529582 A JP 2016529582A JP 6315092 B2 JP6315092 B2 JP 6315092B2
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JP
Japan
Prior art keywords
wafer
plating
holding base
locked
locking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016529582A
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English (en)
Japanese (ja)
Other versions
JPWO2015199047A1 (ja
Inventor
高史 秋野
高史 秋野
啓 荒井
啓 荒井
山根　茂樹
茂樹 山根
航 中島
航 中島
中山　直樹
直樹 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2015199047A1 publication Critical patent/JPWO2015199047A1/ja
Application granted granted Critical
Publication of JP6315092B2 publication Critical patent/JP6315092B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2016529582A 2014-06-26 2015-06-23 めっき用治具 Active JP6315092B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014131070 2014-06-26
JP2014131070 2014-06-26
PCT/JP2015/067951 WO2015199047A1 (ja) 2014-06-26 2015-06-23 めっき用治具

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018059538A Division JP6489259B2 (ja) 2014-06-26 2018-03-27 めっき用治具及びめっき装置

Publications (2)

Publication Number Publication Date
JPWO2015199047A1 JPWO2015199047A1 (ja) 2017-04-27
JP6315092B2 true JP6315092B2 (ja) 2018-04-25

Family

ID=54938129

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016529582A Active JP6315092B2 (ja) 2014-06-26 2015-06-23 めっき用治具
JP2018059538A Active JP6489259B2 (ja) 2014-06-26 2018-03-27 めっき用治具及びめっき装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018059538A Active JP6489259B2 (ja) 2014-06-26 2018-03-27 めっき用治具及びめっき装置

Country Status (4)

Country Link
JP (2) JP6315092B2 (ko)
KR (1) KR101871624B1 (ko)
CN (1) CN106471162B (ko)
WO (1) WO2015199047A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106435701A (zh) * 2016-12-14 2017-02-22 陕西宝光真空电器股份有限公司 一种具有均衡电阻值的电镀用挂具
CN108022869A (zh) * 2017-12-29 2018-05-11 上海新阳半导体材料股份有限公司 晶圆挂具
KR102038875B1 (ko) * 2018-02-09 2019-10-31 코리아테크노주식회사 웨이퍼 간격링의 이송장치와 웨이퍼 간격링의 이송방법
TWI641079B (zh) * 2018-04-11 2018-11-11 姜力 Wafer fixture for electroplating equipment
CN110387571B (zh) * 2018-04-17 2021-07-30 颀中科技（苏州）有限公司 用于电镀设备的晶圆夹具
CN110528041A (zh) * 2019-08-13 2019-12-03 广州兴森快捷电路科技有限公司 用于晶元的电镀加工方法、晶元及线路板
JP7421302B2 (ja) * 2019-10-07 2024-01-24 上村工業株式会社 保持治具

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730687Y2 (ja) * 1987-10-22 1995-07-12 セイコー電子工業株式会社 バンプめっき装置
JP4037504B2 (ja) * 1998-01-09 2008-01-23 株式会社荏原製作所 半導体ウエハのメッキ治具
JP2000150421A (ja) * 1998-11-13 2000-05-30 Ebara Corp 基板のメッキ装置及びメッキ方法
US6444101B1 (en) * 1999-11-12 2002-09-03 Applied Materials, Inc. Conductive biasing member for metal layering
JP3979847B2 (ja) * 2000-03-17 2007-09-19 株式会社荏原製作所 めっき装置
JP2002294495A (ja) * 2001-03-29 2002-10-09 Tokyo Electron Ltd 液処理装置
US6540899B2 (en) * 2001-04-05 2003-04-01 All Wet Technologies, Inc. Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
JP2003171791A (ja) * 2001-12-03 2003-06-20 Hitachi Kyowa Engineering Co Ltd 自動めっき方法及びその装置
JP3778281B2 (ja) * 2002-03-26 2006-05-24 株式会社荏原製作所 基板ホルダ及びめっき装置
JP4162440B2 (ja) * 2002-07-22 2008-10-08 株式会社荏原製作所 基板ホルダ及びめっき装置
KR100980051B1 (ko) * 2002-06-21 2010-09-06 가부시키가이샤 에바라 세이사꾸쇼 기판홀더 및 도금장치
JP2006233296A (ja) * 2005-02-25 2006-09-07 Yamamoto Mekki Shikenki:Kk 電気めっき用治具
JP4852338B2 (ja) * 2006-04-26 2012-01-11 株式会社フジクラ メッキシステム
JP4463286B2 (ja) * 2007-02-05 2010-05-19 株式会社荏原製作所 半導体ウエハのメッキ治具、治具装着装置、半導体ウエハのメッキ装置
US8286929B2 (en) * 2008-04-01 2012-10-16 Texas Instruments Incorporated Clam shell two-pin wafer holder for metal plating
US8236151B1 (en) * 2009-10-30 2012-08-07 Cypress Semiconductor Corporation Substrate carrier for wet chemical processing
JP5766048B2 (ja) * 2010-08-19 2015-08-19 株式会社荏原製作所 基板ホルダ及びめっき装置
JP5750327B2 (ja) * 2010-10-21 2015-07-22 株式会社荏原製作所 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
JP5643239B2 (ja) * 2012-01-30 2014-12-17 株式会社荏原製作所 基板ホルダ及びめっき装置
JP5782398B2 (ja) * 2012-03-27 2015-09-24 株式会社荏原製作所 めっき方法及びめっき装置
CN103469271B (zh) * 2013-09-11 2016-02-17 深圳市创智成功科技有限公司 晶圆电镀的挂具

Also Published As

Publication number Publication date
CN106471162B (zh) 2018-09-25
KR20170008299A (ko) 2017-01-23
JP6489259B2 (ja) 2019-03-27
JP2018090912A (ja) 2018-06-14
KR101871624B1 (ko) 2018-06-26
WO2015199047A1 (ja) 2015-12-30
JPWO2015199047A1 (ja) 2017-04-27
CN106471162A (zh) 2017-03-01

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