JP6489259B2 - めっき用治具及びめっき装置 - Google Patents
めっき用治具及びめっき装置 Download PDFInfo
- Publication number
- JP6489259B2 JP6489259B2 JP2018059538A JP2018059538A JP6489259B2 JP 6489259 B2 JP6489259 B2 JP 6489259B2 JP 2018059538 A JP2018059538 A JP 2018059538A JP 2018059538 A JP2018059538 A JP 2018059538A JP 6489259 B2 JP6489259 B2 JP 6489259B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wafer
- jig
- covering member
- locking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrodes Of Semiconductors (AREA)
Description
7 ウェハ
10 めっき用治具
12 保持ベース
13 かぶせ部材
121 保持ベース本体
122 係止部
124 アーム逃げ溝
131 かぶせ部材本体
132 被係止部
135 ガイド部材
137 ストッパ
Claims (3)
- 被めっき基材であるウェハの一方の面に当接する保持ベース本体と、
該保持ベース本体と独立して、前記ウェハの面に対して平行に移動可能な複数の係止部と
を有する保持ベースと、
前記ウェハの他方の面の外縁に当接するかぶせ部材本体と、
該かぶせ部材本体から外側に向けて突出する複数の被係止部と
を有するかぶせ部材と
を備え、
前記ウェハの一方の面に当接するステージに、ウェハ供給アームを誘導するアーム逃げ溝を有し、
複数の前記係止部を移動させて複数の前記被係止部を係止し、前記ウェハを前記保持ベース及び前記かぶせ部材の間に挟んで保持することを特徴とするめっき用治具。 - 前記アーム逃げ溝は、めっき槽への移動方向と同一の方向に複数本設けられていることを特徴とする請求項1に記載のめっき用治具。
- 請求項1又は2に記載のめっき用治具を用いることを特徴とするめっき装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014131070 | 2014-06-26 | ||
JP2014131070 | 2014-06-26 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016529582A Division JP6315092B2 (ja) | 2014-06-26 | 2015-06-23 | めっき用治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018090912A JP2018090912A (ja) | 2018-06-14 |
JP6489259B2 true JP6489259B2 (ja) | 2019-03-27 |
Family
ID=54938129
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016529582A Active JP6315092B2 (ja) | 2014-06-26 | 2015-06-23 | めっき用治具 |
JP2018059538A Active JP6489259B2 (ja) | 2014-06-26 | 2018-03-27 | めっき用治具及びめっき装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016529582A Active JP6315092B2 (ja) | 2014-06-26 | 2015-06-23 | めっき用治具 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6315092B2 (ja) |
KR (1) | KR101871624B1 (ja) |
CN (1) | CN106471162B (ja) |
WO (1) | WO2015199047A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106435701A (zh) * | 2016-12-14 | 2017-02-22 | 陕西宝光真空电器股份有限公司 | 一种具有均衡电阻值的电镀用挂具 |
CN108022869A (zh) * | 2017-12-29 | 2018-05-11 | 上海新阳半导体材料股份有限公司 | 晶圆挂具 |
KR102038875B1 (ko) * | 2018-02-09 | 2019-10-31 | 코리아테크노주식회사 | 웨이퍼 간격링의 이송장치와 웨이퍼 간격링의 이송방법 |
TWI641079B (zh) * | 2018-04-11 | 2018-11-11 | 姜力 | Wafer fixture for electroplating equipment |
CN110387571B (zh) * | 2018-04-17 | 2021-07-30 | 颀中科技(苏州)有限公司 | 用于电镀设备的晶圆夹具 |
CN110528041A (zh) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | 用于晶元的电镀加工方法、晶元及线路板 |
JP7421302B2 (ja) * | 2019-10-07 | 2024-01-24 | 上村工業株式会社 | 保持治具 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0730687Y2 (ja) * | 1987-10-22 | 1995-07-12 | セイコー電子工業株式会社 | バンプめっき装置 |
JP4037504B2 (ja) * | 1998-01-09 | 2008-01-23 | 株式会社荏原製作所 | 半導体ウエハのメッキ治具 |
JP2000150421A (ja) * | 1998-11-13 | 2000-05-30 | Ebara Corp | 基板のメッキ装置及びメッキ方法 |
US6444101B1 (en) * | 1999-11-12 | 2002-09-03 | Applied Materials, Inc. | Conductive biasing member for metal layering |
WO2001068952A1 (fr) * | 2000-03-17 | 2001-09-20 | Ebara Corporation | Procede et appareil de plaquage electrolytique |
JP2002294495A (ja) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | 液処理装置 |
US6540899B2 (en) * | 2001-04-05 | 2003-04-01 | All Wet Technologies, Inc. | Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces |
JP2003171791A (ja) * | 2001-12-03 | 2003-06-20 | Hitachi Kyowa Engineering Co Ltd | 自動めっき方法及びその装置 |
JP3778281B2 (ja) * | 2002-03-26 | 2006-05-24 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
WO2004001813A2 (en) * | 2002-06-21 | 2003-12-31 | Ebara Corporation | Substrate holder and plating apparatus |
JP4162440B2 (ja) * | 2002-07-22 | 2008-10-08 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP2006233296A (ja) * | 2005-02-25 | 2006-09-07 | Yamamoto Mekki Shikenki:Kk | 電気めっき用治具 |
JP4852338B2 (ja) * | 2006-04-26 | 2012-01-11 | 株式会社フジクラ | メッキシステム |
JP4463286B2 (ja) | 2007-02-05 | 2010-05-19 | 株式会社荏原製作所 | 半導体ウエハのメッキ治具、治具装着装置、半導体ウエハのメッキ装置 |
US8286929B2 (en) * | 2008-04-01 | 2012-10-16 | Texas Instruments Incorporated | Clam shell two-pin wafer holder for metal plating |
US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
JP5766048B2 (ja) * | 2010-08-19 | 2015-08-19 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP5750327B2 (ja) * | 2010-10-21 | 2015-07-22 | 株式会社荏原製作所 | めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法 |
JP5643239B2 (ja) * | 2012-01-30 | 2014-12-17 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
CN103469271B (zh) * | 2013-09-11 | 2016-02-17 | 深圳市创智成功科技有限公司 | 晶圆电镀的挂具 |
-
2015
- 2015-06-23 CN CN201580033875.4A patent/CN106471162B/zh active Active
- 2015-06-23 WO PCT/JP2015/067951 patent/WO2015199047A1/ja active Application Filing
- 2015-06-23 JP JP2016529582A patent/JP6315092B2/ja active Active
- 2015-06-23 KR KR1020167035904A patent/KR101871624B1/ko active IP Right Grant
-
2018
- 2018-03-27 JP JP2018059538A patent/JP6489259B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20170008299A (ko) | 2017-01-23 |
KR101871624B1 (ko) | 2018-06-26 |
CN106471162A (zh) | 2017-03-01 |
CN106471162B (zh) | 2018-09-25 |
JP2018090912A (ja) | 2018-06-14 |
WO2015199047A1 (ja) | 2015-12-30 |
JP6315092B2 (ja) | 2018-04-25 |
JPWO2015199047A1 (ja) | 2017-04-27 |
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