JP6284717B2 - 電子部品、及び電子部品の製造方法 - Google Patents
電子部品、及び電子部品の製造方法 Download PDFInfo
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- JP6284717B2 JP6284717B2 JP2013164474A JP2013164474A JP6284717B2 JP 6284717 B2 JP6284717 B2 JP 6284717B2 JP 2013164474 A JP2013164474 A JP 2013164474A JP 2013164474 A JP2013164474 A JP 2013164474A JP 6284717 B2 JP6284717 B2 JP 6284717B2
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- pads
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- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 80
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000012212 insulator Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000010897 surface acoustic wave method Methods 0.000 description 88
- 239000004065 semiconductor Substances 0.000 description 34
- 238000009826 distribution Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 238000004088 simulation Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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Description
12、14、16、18 パッド
20 半導体装置
22 SAWデバイス
23、23a、23b、23c 領域
24 バンプ
25 ツール
100、200、300 電子部品
Claims (6)
- セラミックにより形成され、上面に複数のパッドを有する基板と、
複数のパッドとそれぞれ接合する複数のバンプを用いて前記基板の上面にフリップチップ実装された複数の部品と、
前記基板の下面に設けられ、絶縁体により形成されており、互いに接合された前記複数のパッド及び前記複数のバンプにより形成される複数のパッド及びバンプ対それぞれにおいてパッド及びバンプの小さい方の少なくとも一部と重なる複数の付加膜と、を具備し、
前記複数の付加膜が前記複数の部品に対応して設けられ、
前記複数の付加膜のそれぞれは、対応する部品の複数のパッド及びバンプ対のうち全てのパッド及びパンプ対においてパッド及びバンプの小さい方の少なくとも一部と重なり、前記対応する部品より小さいことを特徴とする電子部品。 - 前記付加膜は金属により形成されていることを特徴とする請求項1記載の電子部品。
- 前記複数の付加膜は、対応する部品の複数のパッド及びバンプ対のうち全てのパッド及びパンプ対においてパッド及びバンプの小さい方の全体と重なることを特徴とする請求項1または2記載の電子部品。
- セラミックにより形成された基板の下面に、絶縁体により形成される複数の付加膜を形成する工程と、
前記複数の付加膜を形成する工程の後に、前記基板の上面に設けられた複数のパッドに複数のバンプをそれぞれ接合することで、前記複数の付加膜が互いに接合された前記複数のパッド及び前記複数のバンプにより形成される複数のパッド及びバンプ対のそれぞれにおいてパッド及びバンプの小さい方の少なくとも一部と重なるように、複数の部品をフリップチップ実装する工程と、を有し、
前記複数の部品をフリップチップ実装する工程は、前記複数の部品の上面を各々ツールを用い前記基板方向に押圧することで、前記複数の付加膜に対応して前記複数の部品をフリップチップ実装する工程を含み、
前記複数の付加膜のそれぞれは、対応する部品の複数のパッド及びバンプ対のうち全てのパッド及びパンプ対においてパッド及びバンプの小さい方の少なくとも一部と重なり、前記対応する部品より小さいことを特徴とする電子部品の製造方法。 - 前記フリップチップ実装する工程は、超音波を用いて前記部品を前記基板の上面が広がる方向に振動させながらフリップチップ実装する工程であることを特徴とする請求項4記載の電子部品の製造方法。
- 前記複数の付加膜は、対応する部品の複数のパッド及びバンプ対のうち全てのパッド及びパンプ対においてパッド及びバンプの小さい方の全体と重なることを特徴とする請求項4または5記載の電子部品の製造方法。
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WO2017154643A1 (ja) * | 2016-03-11 | 2017-09-14 | 本田技研工業株式会社 | 電子回路基板および超音波接合方法 |
JP6653647B2 (ja) * | 2016-12-21 | 2020-02-26 | 太陽誘電株式会社 | 弾性波デバイス |
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