JP6039534B2 - カーボンナノチューブの生成方法及び配線形成方法 - Google Patents
カーボンナノチューブの生成方法及び配線形成方法 Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 341
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims description 259
- 239000002041 carbon nanotube Substances 0.000 title claims description 259
- 238000000034 method Methods 0.000 title claims description 78
- 230000015572 biosynthetic process Effects 0.000 title claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 126
- 239000002184 metal Substances 0.000 claims description 126
- 229910052799 carbon Inorganic materials 0.000 claims description 79
- 239000010419 fine particle Substances 0.000 claims description 77
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 72
- 239000005977 Ethylene Substances 0.000 claims description 72
- 230000003197 catalytic effect Effects 0.000 claims description 70
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 67
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 67
- 238000004519 manufacturing process Methods 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 29
- 230000009467 reduction Effects 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 2
- 239000007789 gas Substances 0.000 description 256
- 235000012431 wafers Nutrition 0.000 description 77
- 239000003054 catalyst Substances 0.000 description 51
- 238000012545 processing Methods 0.000 description 35
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 34
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 28
- 230000008569 process Effects 0.000 description 26
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 21
- 229910052786 argon Inorganic materials 0.000 description 17
- 125000004432 carbon atom Chemical group C* 0.000 description 16
- 238000012546 transfer Methods 0.000 description 16
- 230000002776 aggregation Effects 0.000 description 11
- 238000004220 aggregation Methods 0.000 description 10
- 239000011261 inert gas Substances 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 9
- 230000004913 activation Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 230000006837 decompression Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 229910021389 graphene Inorganic materials 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910021392 nanocarbon Inorganic materials 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- -1 argon gas Chemical compound 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/16—Preparation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/16—Preparation
- C01B32/162—Preparation characterised by catalysts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02606—Nanotubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53276—Conductive materials containing carbon, e.g. fullerenes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/08—Aligned nanotubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
- H01L2221/1068—Formation and after-treatment of conductors
- H01L2221/1094—Conducting structures comprising nanotubes or nanowires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
11 チャンバ
20 ガス供給部
20m アセチレンガス供給源
20n エチレンガス供給源
56 触媒金属微粒子
57 カーボンナノチューブ
Claims (10)
- 基板へ向けて炭素含有ガスを供給してカーボンナノチューブを生成するカーボンナノチューブの生成方法であって、
前記カーボンナノチューブの生成の初期段階に、前記炭素含有ガスとして前記アセチレンガスのみを供給する第1の炭素含有ガス供給ステップと、
前記第1の炭素含有ガス供給ステップの後に、前記炭素含有ガスとして少なくとも前記エチレンガスを供給する第2の炭素含有ガス供給ステップとを有し、
前記基板の温度を425℃以上且つ600℃未満に設定することを特徴とするカーボンナノチューブの生成方法。 - 前記第2の炭素含有ガス供給ステップにおける前記基板の温度を、前記第1の炭素含有ガス供給ステップにおける前記基板の温度よりも高くすることを特徴とする請求項1記載のカーボンナノチューブの生成方法。
- 前記第2の炭素含有ガス供給ステップにおいて、前記炭素含有ガスとして前記エチレンガスのみを供給することを特徴とする請求項1又は2記載のカーボンナノチューブの生成方法。
- 前記第2の炭素含有ガス供給ステップにおいて、前記炭素含有ガスとして前記エチレンガス及び前記アセチレンガスの混合ガスを供給することを特徴とする請求項1又は2記載のカーボンナノチューブの生成方法。
- 基板へ向けて炭素含有ガスを供給してカーボンナノチューブを生成するカーボンナノチューブの生成方法であって、
前記炭素含有ガスとして前記アセチレンガス及び前記エチレンガスの混合ガスを供給し、前記基板の温度を425℃以上且つ600℃未満に設定し、
前記混合ガスの流量を100%としたときの前記エチレンガスの流量を50%以上且つ80%以下に設定することを特徴とするカーボンナノチューブの生成方法。 - 前記混合ガスにおける前記アセチレンガス及び前記エチレンガスの流量比率を時間の経過とともに変化させることを特徴とする請求項5記載のカーボンナノチューブの生成方法。
- 前記混合ガスにおける前記エチレンガスの流量比率を時間の経過とともに増加させることを特徴とする請求項6記載のカーボンナノチューブの生成方法。
- 基板上に形成される三次元実装デバイスにおける深さ方向の配線形成方法であって、
前記基板へ向けて炭素含有ガスを供給してカーボンナノチューブを生成するカーボンナノチューブの生成ステップを有し、
前記カーボンナノチューブの生成ステップの初期段階に、前記炭素含有ガスとして前記アセチレンガスのみを供給する第1の炭素含有ガス供給ステップと、
前記第1の炭素含有ガス供給ステップの後に、前記炭素含有ガスとして少なくとも前記エチレンガスを供給する第2の炭素含有ガス供給ステップとを有し、
前記基板の温度を425℃以上且つ600℃未満に設定することを特徴とする配線形成方法。 - 基板上に形成された絶縁膜の凹部の底部に触媒金属層を形成する触媒金属層形成ステップと、前記触媒金属層から触媒金属微粒子を形成し、さらに該形成された触媒金属微粒子の表面を活性化する前処理ステップと、請求項1乃至7のいずれかのカーボンナノチューブ生成方法によって前記凹部においてカーボンナノチューブを成長させるカーボンナノチューブ生成ステップとを有することを特徴とする配線形成方法。
- 基板上に形成された絶縁膜の凹部の底部に予め形成された触媒金属層の表面を活性化する前処理ステップと、請求項1乃至7のいずれかのカーボンナノチューブ生成方法によって前記凹部においてカーボンナノチューブを成長させるカーボンナノチューブ生成ステップとを有することを特徴とする配線形成方法。
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JP2013234743A JP6039534B2 (ja) | 2013-11-13 | 2013-11-13 | カーボンナノチューブの生成方法及び配線形成方法 |
PCT/JP2014/077118 WO2015072254A1 (ja) | 2013-11-13 | 2014-10-03 | カーボンナノチューブの生成方法及び配線形成方法 |
KR1020167012069A KR20160083872A (ko) | 2013-11-13 | 2014-10-03 | 카본 나노 튜브의 생성 방법 및 배선 형성 방법 |
US15/151,760 US10378104B2 (en) | 2013-11-13 | 2016-05-11 | Process for producing carbon nanotubes and method for forming wiring |
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JP3913442B2 (ja) | 1999-12-02 | 2007-05-09 | 株式会社リコー | カーボンナノチューブ及びその作製方法、電子放出源 |
WO2002095097A1 (en) * | 2001-05-21 | 2002-11-28 | Trustees Of Boston College, The | Varied morphology carbon nanotubes and methods for their manufacture |
JP2003081699A (ja) * | 2001-09-06 | 2003-03-19 | Canon Inc | 炭素を主成分とするファイバーの製造方法および製造装置、並びに該ファイバーを用いた電子放出素子 |
JP3443646B1 (ja) | 2002-03-25 | 2003-09-08 | 名古屋大学長 | カーボンナノチューブの成長方法 |
JP2003277031A (ja) | 2002-03-26 | 2003-10-02 | Fujikura Ltd | カーボンナノチューブの製法 |
US6831017B1 (en) * | 2002-04-05 | 2004-12-14 | Integrated Nanosystems, Inc. | Catalyst patterning for nanowire devices |
WO2004071654A1 (ja) | 2003-02-14 | 2004-08-26 | Bussan Nanotech Research Institute Inc. | 単層カーボンナノチューブ製造用触媒金属微粒子形成方法 |
JP3837392B2 (ja) | 2003-03-25 | 2006-10-25 | 憲治郎 尾浦 | カーボンナノチューブの製造方法、カーボンナノチューブデバイスおよび電気二重層キャパシタ |
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