JP5554503B2 - 再剥離性工程フィルム - Google Patents

再剥離性工程フィルム Download PDF

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Publication number: JP5554503B2
Authority: JP; Japan
Prior art keywords: process film; mass; film; printed wiring; pressure
Prior art date: 2008-03-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2009039490A

Other languages

English (en)

Japanese (ja)

Other versions

JP2010116532A (ja

Inventor

健司那須

晃史山田

雄一倉田

浩司田畠

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Lintec Corp

Original Assignee

Lintec Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-03-18

Filing date

2009-02-23

Publication date

2014-07-23

2009-02-23 Application filed by Lintec Corp filed Critical Lintec Corp

2009-02-23 Priority to JP2009039490A priority Critical patent/JP5554503B2/ja

2009-03-17 Priority to TW098108526A priority patent/TWI450941B/zh

2009-03-18 Priority to PCT/JP2009/056024 priority patent/WO2009116685A1/ja

2009-03-18 Priority to KR1020107020258A priority patent/KR101568443B1/ko

2009-03-18 Priority to CN2009801095985A priority patent/CN101978798B/zh

2010-05-27 Publication of JP2010116532A publication Critical patent/JP2010116532A/ja

2014-07-23 Application granted granted Critical

2014-07-23 Publication of JP5554503B2 publication Critical patent/JP5554503B2/ja

Status Active legal-status Critical Current

2029-02-23 Anticipated expiration legal-status Critical

Links

238000000034 method Methods 0.000 title claims description 180
230000008569 process Effects 0.000 title claims description 150
239000000853 adhesive Substances 0.000 claims description 85
230000001070 adhesive effect Effects 0.000 claims description 85
239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 67
239000010410 layer Substances 0.000 claims description 53
239000000178 monomer Substances 0.000 claims description 45
229920001577 copolymer Polymers 0.000 claims description 42
239000000463 material Substances 0.000 claims description 33
239000003431 cross linking reagent Substances 0.000 claims description 26
-1 polypropylene Polymers 0.000 claims description 25
238000003860 storage Methods 0.000 claims description 24
238000007731 hot pressing Methods 0.000 claims description 23
239000003795 chemical substances by application Substances 0.000 claims description 22
229920001721 polyimide Polymers 0.000 claims description 22
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 18
238000009826 distribution Methods 0.000 claims description 17
229920002554 vinyl polymer Polymers 0.000 claims description 17
239000004642 Polyimide Substances 0.000 claims description 16
239000011521 glass Substances 0.000 claims description 15
229920005989 resin Polymers 0.000 claims description 15
239000011347 resin Substances 0.000 claims description 15
FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 claims description 14
BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical group COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 13
239000012948 isocyanate Substances 0.000 claims description 12
150000002513 isocyanates Chemical class 0.000 claims description 12
229920001296 polysiloxane Polymers 0.000 claims description 12
CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical group CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 11
229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
239000005020 polyethylene terephthalate Substances 0.000 claims description 11
239000007769 metal material Substances 0.000 claims description 10
239000012790 adhesive layer Substances 0.000 claims description 9
125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
239000002985 plastic film Substances 0.000 claims description 9
DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 9
VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 8
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
230000008859 change Effects 0.000 claims description 8
229910010272 inorganic material Inorganic materials 0.000 claims description 8
239000011147 inorganic material Substances 0.000 claims description 8
239000004743 Polypropylene Substances 0.000 claims description 7
229920001155 polypropylene Polymers 0.000 claims description 7
238000000691 measurement method Methods 0.000 claims description 5
239000004065 semiconductor Substances 0.000 claims description 5
125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 5
239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
230000015572 biosynthetic process Effects 0.000 claims description 4
230000000295 complement effect Effects 0.000 claims description 4
229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
229910044991 metal oxide Inorganic materials 0.000 claims description 3
150000004706 metal oxides Chemical class 0.000 claims description 3
238000012360 testing method Methods 0.000 description 35
239000000758 substrate Substances 0.000 description 21
238000004519 manufacturing process Methods 0.000 description 18
NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 16
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 16
XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
238000001035 drying Methods 0.000 description 13
238000005259 measurement Methods 0.000 description 13
239000007787 solid Substances 0.000 description 13
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
238000011109 contamination Methods 0.000 description 9
238000011156 evaluation Methods 0.000 description 9
239000002904 solvent Substances 0.000 description 9
OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
239000011248 coating agent Substances 0.000 description 8
238000000576 coating method Methods 0.000 description 8
238000005227 gel permeation chromatography Methods 0.000 description 8
SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
239000003822 epoxy resin Substances 0.000 description 7
229920000647 polyepoxide Polymers 0.000 description 7
238000006116 polymerization reaction Methods 0.000 description 7
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
230000000052 comparative effect Effects 0.000 description 6
CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
239000000654 additive Substances 0.000 description 5
239000000123 paper Substances 0.000 description 5
238000002360 preparation method Methods 0.000 description 5
RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
229910001873 dinitrogen Inorganic materials 0.000 description 4
238000010528 free radical solution polymerization reaction Methods 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
239000004698 Polyethylene Substances 0.000 description 3
DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
230000000996 additive effect Effects 0.000 description 3
150000001336 alkenes Chemical class 0.000 description 3
239000012298 atmosphere Substances 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
238000006073 displacement reaction Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
238000007654 immersion Methods 0.000 description 3
238000010030 laminating Methods 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000002184 metal Substances 0.000 description 3
239000000203 mixture Substances 0.000 description 3
229920000573 polyethylene Polymers 0.000 description 3
239000005056 polyisocyanate Substances 0.000 description 3
229920001228 polyisocyanate Polymers 0.000 description 3
238000004080 punching Methods 0.000 description 3
238000010526 radical polymerization reaction Methods 0.000 description 3
238000010992 reflux Methods 0.000 description 3
238000011160 research Methods 0.000 description 3
230000037303 wrinkles Effects 0.000 description 3
SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
239000004793 Polystyrene Substances 0.000 description 2
WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
239000002390 adhesive tape Substances 0.000 description 2
229920000180 alkyd Polymers 0.000 description 2
125000000217 alkyl group Chemical group 0.000 description 2
229920003235 aromatic polyamide Polymers 0.000 description 2
125000003118 aryl group Chemical group 0.000 description 2
238000005452 bending Methods 0.000 description 2
239000004020 conductor Substances 0.000 description 2
238000007334 copolymerization reaction Methods 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
238000003851 corona treatment Methods 0.000 description 2
150000001993 dienes Chemical class 0.000 description 2
229920001971 elastomer Polymers 0.000 description 2
238000000605 extraction Methods 0.000 description 2
125000000524 functional group Chemical group 0.000 description 2
239000001257 hydrogen Substances 0.000 description 2
229910052739 hydrogen Inorganic materials 0.000 description 2
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
238000002156 mixing Methods 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
229920000642 polymer Polymers 0.000 description 2
229920000098 polyolefin Polymers 0.000 description 2
229920002223 polystyrene Polymers 0.000 description 2
238000012545 processing Methods 0.000 description 2
230000009257 reactivity Effects 0.000 description 2
239000000126 substance Substances 0.000 description 2
238000004381 surface treatment Methods 0.000 description 2
239000008096 xylene Substances 0.000 description 2
JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
208000023514 Barrett esophagus Diseases 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
239000004971 Cross linker Substances 0.000 description 1
SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
239000005058 Isophorone diisocyanate Substances 0.000 description 1
229920000106 Liquid crystal polymer Polymers 0.000 description 1
239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
239000004696 Poly ether ether ketone Substances 0.000 description 1
239000004697 Polyetherimide Substances 0.000 description 1
OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
239000006096 absorbing agent Substances 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
238000000862 absorption spectrum Methods 0.000 description 1
238000010306 acid treatment Methods 0.000 description 1
150000003926 acrylamides Chemical class 0.000 description 1
239000002313 adhesive film Substances 0.000 description 1
125000002723 alicyclic group Chemical group 0.000 description 1
125000001931 aliphatic group Chemical group 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
238000004458 analytical method Methods 0.000 description 1
239000003963 antioxidant agent Substances 0.000 description 1
239000004760 aramid Substances 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
229920001400 block copolymer Polymers 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
125000004432 carbon atom Chemical group C* 0.000 description 1
150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
150000001735 carboxylic acids Chemical class 0.000 description 1
239000004359 castor oil Substances 0.000 description 1
235000019438 castor oil Nutrition 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
229940018557 citraconic acid Drugs 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
230000003750 conditioning effect Effects 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
238000004132 cross linking Methods 0.000 description 1
LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
125000005442 diisocyanate group Chemical group 0.000 description 1
CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical class C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
239000000806 elastomer Substances 0.000 description 1
238000010292 electrical insulation Methods 0.000 description 1
238000000921 elemental analysis Methods 0.000 description 1
229920006351 engineering plastic Polymers 0.000 description 1
239000003344 environmental pollutant Substances 0.000 description 1
229920006332 epoxy adhesive Polymers 0.000 description 1
150000002148 esters Chemical group 0.000 description 1
238000005530 etching Methods 0.000 description 1
UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
239000000284 extract Substances 0.000 description 1
239000005329 float glass Substances 0.000 description 1
239000011737 fluorine Substances 0.000 description 1
229910052731 fluorine Inorganic materials 0.000 description 1
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
238000004817 gas chromatography Methods 0.000 description 1
230000009477 glass transition Effects 0.000 description 1
239000011086 glassine Substances 0.000 description 1
239000003292 glue Substances 0.000 description 1
ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
229920000578 graft copolymer Polymers 0.000 description 1
RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
150000002431 hydrogen Chemical class 0.000 description 1
238000003384 imaging method Methods 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
230000006872 improvement Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
239000004611 light stabiliser Substances 0.000 description 1
239000007788 liquid Substances 0.000 description 1
230000014759 maintenance of location Effects 0.000 description 1
VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
239000011976 maleic acid Substances 0.000 description 1
LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
238000013508 migration Methods 0.000 description 1
230000005012 migration Effects 0.000 description 1
125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
125000005487 naphthalate group Chemical group 0.000 description 1
SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
150000002825 nitriles Chemical class 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
125000005498 phthalate group Chemical class 0.000 description 1
238000009832 plasma treatment Methods 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920006255 plastic film Polymers 0.000 description 1
238000007747 plating Methods 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
231100000719 pollutant Toxicity 0.000 description 1
229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
229920002492 poly(sulfone) Polymers 0.000 description 1
229920001230 polyarylate Polymers 0.000 description 1
229920002857 polybutadiene Polymers 0.000 description 1
229920001707 polybutylene terephthalate Polymers 0.000 description 1
229920006289 polycarbonate film Polymers 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
229920002530 polyetherether ketone Polymers 0.000 description 1
229920001601 polyetherimide Polymers 0.000 description 1
239000011112 polyethylene naphthalate Substances 0.000 description 1
229920005672 polyolefin resin Polymers 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
238000011002 quantification Methods 0.000 description 1
239000007870 radical polymerization initiator Substances 0.000 description 1
229920005604 random copolymer Polymers 0.000 description 1
239000013557 residual solvent Substances 0.000 description 1
239000005060 rubber Substances 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
229920002050 silicone resin Polymers 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
239000002356 single layer Substances 0.000 description 1
230000000087 stabilizing effect Effects 0.000 description 1
125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
229920005992 thermoplastic resin Polymers 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
229920001567 vinyl ester resin Polymers 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical Kinetics & Catalysis (AREA)
Adhesive Tapes (AREA)
Adhesives Or Adhesive Processes (AREA)
Laminated Bodies (AREA)

JP2009039490A 2008-03-18 2009-02-23 再剥離性工程フィルム Active JP5554503B2 (ja)

Priority Applications (5)

Application Number	Priority Date	Filing Date	Title
JP2009039490A JP5554503B2 (ja)	2008-03-18	2009-02-23	再剥離性工程フィルム
TW098108526A TWI450941B (zh)	2008-03-18	2009-03-17	再剝離性加工薄膜
PCT/JP2009/056024 WO2009116685A1 (ja)	2008-03-18	2009-03-18	再剥離性工程フィルム
KR1020107020258A KR101568443B1 (ko)	2008-03-18	2009-03-18	재박리성 공정필름
CN2009801095985A CN101978798B (zh)	2008-03-18	2009-03-18	再剥离性工程薄膜

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JP2008069899		2008-03-18
JP2008069899		2008-03-18
JP2008267698		2008-10-16
JP2008267698		2008-10-16
JP2009039490A JP5554503B2 (ja)	2008-03-18	2009-02-23	再剥離性工程フィルム

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JP5554503B2 true JP5554503B2 (ja)	2014-07-23

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KR (1)	KR101568443B1 (zh)
CN (1)	CN101978798B (zh)
TW (1)	TWI450941B (zh)
WO (1)	WO2009116685A1 (zh)

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JP2011068822A (ja) *	2009-09-28	2011-04-07	Hitachi Kasei Polymer Co Ltd	セパレータ付き接着フィルム
JP2011243502A (ja)	2010-05-20	2011-12-01	Ichikoh Ind Ltd	車両用灯具
JP2013147664A (ja) *	2010-11-30	2013-08-01	Nitto Denko Corp	表面保護シート
JP5875318B2 (ja) *	2010-11-30	2016-03-02	日東電工株式会社	表面保護シート
JP2013177603A (ja) *	2010-11-30	2013-09-09	Nitto Denko Corp	表面保護シート
JP6231254B2 (ja) *	2010-11-30	2017-11-15	日東電工株式会社	表面保護シート
JP6001258B2 (ja) *	2011-11-28	2016-10-05	日東電工株式会社	保護シートおよびその製造方法
JP6009189B2 (ja) *	2012-03-28	2016-10-19	リンテック株式会社	電子部品加工用粘着シートおよび半導体装置の製造方法
CN103366636B (zh) *	2012-03-28	2016-08-17	深圳坤邦标价用品有限公司	一种模内标签及其制造方法
JP5850498B2 (ja) *	2012-07-13	2016-02-03	フィスコインタ−ナショナル株式会社	再剥離性絶縁シート
CN106063018B (zh) *	2014-03-06	2018-09-28	琳得科株式会社	带薄膜的固体电解质膜及其制造方法
JP6291679B2 (ja) *	2014-03-31	2018-03-14	リンテック株式会社	透明導電性基板用表面保護フィルムの製造方法、透明導電性基板用表面保護フィルムおよび積層体
WO2016006719A1 (ja) *	2014-07-07	2016-01-14	リンテック株式会社	表面保護フィルム
JP6613516B2 (ja) *	2014-07-07	2019-12-04	リンテック株式会社	表面保護フィルム
JP6418872B2 (ja) *	2014-09-26	2018-11-07	ソマール株式会社	配線基板製造工程用バックアップフィルム
JP6537248B2 (ja) *	2014-10-31	2019-07-03	株式会社康井精機	機能性物質薄膜素材の製造方法並びに機能性物質薄膜素材およびその積層体
JP6176270B2 (ja) *	2015-02-21	2017-08-09	三菱ケミカル株式会社	離型フィルム
CN107406726B (zh) *	2015-03-11	2020-07-07	中岛橡胶工业股份公司	粘接片
JP6263812B2 (ja) *	2015-06-24	2018-01-24	藤森工業株式会社	粘着フィルム及び表面保護フィルム
JP6611252B2 (ja) *	2016-03-28	2019-11-27	リンテック株式会社	半導体加工用シート
JP6337059B2 (ja) *	2016-10-26	2018-06-06	藤森工業株式会社	粘着フィルム及び表面保護フィルム
TWI645005B (zh) *	2017-03-03	2018-12-21	得萬利科技股份有限公司	熱壓用保護離型膠及其應用
JP6601884B2 (ja) *	2018-05-07	2019-11-06	藤森工業株式会社	粘着剤組成物、粘着フィルム及び表面保護フィルム
JP2020063425A (ja) *	2018-10-05	2020-04-23	三菱ケミカル株式会社	活性エネルギー線硬化性剥離型粘着剤組成物および剥離型粘着シート
JP7137434B2 (ja) *	2018-10-15	2022-09-14	大塚化学株式会社	粘着剤組成物および粘着フィルム
JP7038091B2 (ja) *	2019-09-30	2022-03-17	三菱製紙株式会社	粘着シート
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TWI450941B (zh)	2014-09-01
CN101978798B (zh)	2013-04-24
KR101568443B1 (ko)	2015-11-20
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