JP5379528B2 - キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板 - Google Patents

キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板 Download PDF

Info

Publication number: JP5379528B2
Authority: JP; Japan
Prior art keywords: electrolytic copper; foil; layer; copper foil; carrier foil
Prior art date: 2009-03-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2009072381A

Other languages

English (en)

Japanese (ja)

Other versions

JP2010222657A (ja

Inventor

裕昭津吉

真一小畠

歩立岡

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsui Mining and Smelting Co Ltd

Original Assignee

Mitsui Mining and Smelting Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-03-24

Filing date

2009-03-24

Publication date

2013-12-25

2009-03-24 Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd

2009-03-24 Priority to JP2009072381A priority Critical patent/JP5379528B2/ja

2010-02-26 Priority to TW099105608A priority patent/TWI452177B/zh

2010-03-24 Priority to KR1020100026149A priority patent/KR101133162B1/ko

2010-10-07 Publication of JP2010222657A publication Critical patent/JP2010222657A/ja

2013-12-25 Application granted granted Critical

2013-12-25 Publication of JP5379528B2 publication Critical patent/JP5379528B2/ja

Status Active legal-status Critical Current

2029-03-24 Anticipated expiration legal-status Critical

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 296
239000011888 foil Substances 0.000 title claims abstract description 267
239000011889 copper foil Substances 0.000 title claims abstract description 253
238000004519 manufacturing process Methods 0.000 title claims description 32
229910052751 metal Inorganic materials 0.000 claims abstract description 47
239000002184 metal Substances 0.000 claims abstract description 47
238000010438 heat treatment Methods 0.000 claims abstract description 20
239000012298 atmosphere Substances 0.000 claims abstract description 7
239000003795 chemical substances by application Substances 0.000 claims description 120
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 52
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 44
229910052802 copper Inorganic materials 0.000 claims description 43
239000010949 copper Substances 0.000 claims description 43
229910052759 nickel Inorganic materials 0.000 claims description 26
239000003870 refractory metal Substances 0.000 claims description 26
229920000642 polymer Polymers 0.000 claims description 21
230000003746 surface roughness Effects 0.000 claims description 17
238000000151 deposition Methods 0.000 claims description 14
230000008021 deposition Effects 0.000 claims description 12
239000003792 electrolyte Substances 0.000 claims description 12
238000001556 precipitation Methods 0.000 claims description 12
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 11
239000000460 chlorine Substances 0.000 claims description 11
229910052801 chlorine Inorganic materials 0.000 claims description 11
125000004122 cyclic group Chemical group 0.000 claims description 11
150000003242 quaternary ammonium salts Chemical class 0.000 claims description 10
229910000990 Ni alloy Inorganic materials 0.000 claims description 7
229910000531 Co alloy Inorganic materials 0.000 claims description 6
239000010941 cobalt Substances 0.000 claims description 6
229910017052 cobalt Inorganic materials 0.000 claims description 6
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 claims description 5
-1 nitrogen-containing organic compounds Chemical class 0.000 claims description 5
LMPMFQXUJXPWSL-UHFFFAOYSA-N 3-(3-sulfopropyldisulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSSCCCS(O)(=O)=O LMPMFQXUJXPWSL-UHFFFAOYSA-N 0.000 claims description 4
NJSSICCENMLTKO-HRCBOCMUSA-N [(1r,2s,4r,5r)-3-hydroxy-4-(4-methylphenyl)sulfonyloxy-6,8-dioxabicyclo[3.2.1]octan-2-yl] 4-methylbenzenesulfonate Chemical group C1=CC(C)=CC=C1S(=O)(=O)O[C@H]1C(O)[C@@H](OS(=O)(=O)C=2C=CC(C)=CC=2)[C@@H]2OC[C@H]1O2 NJSSICCENMLTKO-HRCBOCMUSA-N 0.000 claims description 3
238000005304 joining Methods 0.000 claims description 3
150000002736 metal compounds Chemical class 0.000 abstract 2
239000010410 layer Substances 0.000 description 253
239000000243 solution Substances 0.000 description 27
238000000034 method Methods 0.000 description 24
238000011282 treatment Methods 0.000 description 17
238000005554 pickling Methods 0.000 description 16
230000015572 biosynthetic process Effects 0.000 description 15
238000001179 sorption measurement Methods 0.000 description 13
230000000052 comparative effect Effects 0.000 description 12
239000000758 substrate Substances 0.000 description 12
238000004381 surface treatment Methods 0.000 description 12
239000008151 electrolyte solution Substances 0.000 description 11
230000000694 effects Effects 0.000 description 9
239000007788 liquid Substances 0.000 description 9
RUPBZQFQVRMKDG-UHFFFAOYSA-M Didecyldimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCC[N+](C)(C)CCCCCCCCCC RUPBZQFQVRMKDG-UHFFFAOYSA-M 0.000 description 8
238000009792 diffusion process Methods 0.000 description 7
238000012545 processing Methods 0.000 description 7
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
238000005259 measurement Methods 0.000 description 6
230000002265 prevention Effects 0.000 description 6
238000005868 electrolysis reaction Methods 0.000 description 5
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
229910021645 metal ion Inorganic materials 0.000 description 5
239000000203 mixture Substances 0.000 description 5
238000000465 moulding Methods 0.000 description 5
238000007788 roughening Methods 0.000 description 5
239000011248 coating agent Substances 0.000 description 4
238000000576 coating method Methods 0.000 description 4
239000000463 material Substances 0.000 description 4
229920001721 polyimide Polymers 0.000 description 4
230000003405 preventing effect Effects 0.000 description 4
238000004544 sputter deposition Methods 0.000 description 4
229920000106 Liquid crystal polymer Polymers 0.000 description 3
239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
229910052786 argon Inorganic materials 0.000 description 3
QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
229910000365 copper sulfate Inorganic materials 0.000 description 3
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
OMHYGQBGFWWXJK-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid;dihydrate Chemical compound O.O.OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O OMHYGQBGFWWXJK-UHFFFAOYSA-N 0.000 description 3
230000008034 disappearance Effects 0.000 description 3
238000001336 glow discharge atomic emission spectroscopy Methods 0.000 description 3
239000009719 polyimide resin Substances 0.000 description 3
239000011347 resin Substances 0.000 description 3
229920005989 resin Polymers 0.000 description 3
230000000087 stabilizing effect Effects 0.000 description 3
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
229910018487 Ni—Cr Inorganic materials 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
YUJRPTYFVGVHSW-UHFFFAOYSA-N [Co].P#[Sn] Chemical compound [Co].P#[Sn] YUJRPTYFVGVHSW-UHFFFAOYSA-N 0.000 description 2
QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 2
QZYDAIMOJUSSFT-UHFFFAOYSA-N [Co].[Ni].[Mo] Chemical compound [Co].[Ni].[Mo] QZYDAIMOJUSSFT-UHFFFAOYSA-N 0.000 description 2
IGOJDKCIHXGPTI-UHFFFAOYSA-N [P].[Co].[Ni] Chemical compound [P].[Co].[Ni] IGOJDKCIHXGPTI-UHFFFAOYSA-N 0.000 description 2
XLLNQZKHYSHONN-UHFFFAOYSA-N [Sn].[P].[Ni] Chemical compound [Sn].[P].[Ni] XLLNQZKHYSHONN-UHFFFAOYSA-N 0.000 description 2
239000007864 aqueous solution Substances 0.000 description 2
230000004888 barrier function Effects 0.000 description 2
VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
RYTYSMSQNNBZDP-UHFFFAOYSA-N cobalt copper Chemical compound [Co].[Cu] RYTYSMSQNNBZDP-UHFFFAOYSA-N 0.000 description 2
WHDPTDWLEKQKKX-UHFFFAOYSA-N cobalt molybdenum Chemical compound [Co].[Co].[Mo] WHDPTDWLEKQKKX-UHFFFAOYSA-N 0.000 description 2
JPNWDVUTVSTKMV-UHFFFAOYSA-N cobalt tungsten Chemical compound [Co].[W] JPNWDVUTVSTKMV-UHFFFAOYSA-N 0.000 description 2
239000004020 conductor Substances 0.000 description 2
239000000470 constituent Substances 0.000 description 2
238000011109 contamination Methods 0.000 description 2
229910001431 copper ion Inorganic materials 0.000 description 2
238000010586 diagram Methods 0.000 description 2
PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 2
238000004090 dissolution Methods 0.000 description 2
229910052809 inorganic oxide Inorganic materials 0.000 description 2
DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 2
MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 2
SIBIBHIFKSKVRR-UHFFFAOYSA-N phosphanylidynecobalt Chemical compound [Co]#P SIBIBHIFKSKVRR-UHFFFAOYSA-N 0.000 description 2
OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
230000010287 polarization Effects 0.000 description 2
238000003825 pressing Methods 0.000 description 2
150000003839 salts Chemical class 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
AZUHEGMJQWJCFQ-UHFFFAOYSA-N 1,1-bis(2h-benzotriazol-4-ylmethyl)urea Chemical compound C1=CC2=NNN=C2C(CN(CC=2C3=NNN=C3C=CC=2)C(=O)N)=C1 AZUHEGMJQWJCFQ-UHFFFAOYSA-N 0.000 description 1
WZRRRFSJFQTGGB-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trithione Chemical compound S=C1NC(=S)NC(=S)N1 WZRRRFSJFQTGGB-UHFFFAOYSA-N 0.000 description 1
NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
241000080590 Niso Species 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000006087 Silane Coupling Agent Substances 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
238000004458 analytical method Methods 0.000 description 1
239000012964 benzotriazole Substances 0.000 description 1
KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
239000004327 boric acid Substances 0.000 description 1
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
238000005266 casting Methods 0.000 description 1
ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
238000010668 complexation reaction Methods 0.000 description 1
239000012050 conventional carrier Substances 0.000 description 1
UGWKCNDTYUOTQZ-UHFFFAOYSA-N copper;sulfuric acid Chemical compound [Cu].OS(O)(=O)=O UGWKCNDTYUOTQZ-UHFFFAOYSA-N 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
238000005137 deposition process Methods 0.000 description 1
238000013461 design Methods 0.000 description 1
229910003460 diamond Inorganic materials 0.000 description 1
239000010432 diamond Substances 0.000 description 1
230000000447 dimerizing effect Effects 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
238000011049 filling Methods 0.000 description 1
239000011737 fluorine Substances 0.000 description 1
229910052731 fluorine Inorganic materials 0.000 description 1
238000009499 grossing Methods 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
229910010272 inorganic material Inorganic materials 0.000 description 1
239000011147 inorganic material Substances 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
238000010030 laminating Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
238000000691 measurement method Methods 0.000 description 1
229910044991 metal oxide Inorganic materials 0.000 description 1
150000004706 metal oxides Chemical class 0.000 description 1
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
239000012044 organic layer Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1
238000005498 polishing Methods 0.000 description 1
229920006122 polyamide resin Polymers 0.000 description 1
230000003449 preventive effect Effects 0.000 description 1
238000011160 research Methods 0.000 description 1
230000035945 sensitivity Effects 0.000 description 1
FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
239000011734 sodium Substances 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
159000000000 sodium salts Chemical class 0.000 description 1
FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
239000002904 solvent Substances 0.000 description 1
238000005507 spraying Methods 0.000 description 1
125000001424 substituent group Chemical group 0.000 description 1
229920005992 thermoplastic resin Polymers 0.000 description 1
238000005406 washing Methods 0.000 description 1
239000002699 waste material Substances 0.000 description 1
230000037303 wrinkles Effects 0.000 description 1

Images

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Electrochemistry (AREA)
Thermal Sciences (AREA)
Physics & Mathematics (AREA)
Chemical Kinetics & Catalysis (AREA)
Microelectronics & Electronic Packaging (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating Methods And Accessories (AREA)
Laminated Bodies (AREA)
Electroplating And Plating Baths Therefor (AREA)

JP2009072381A 2009-03-24 2009-03-24 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板 Active JP5379528B2 (ja)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
JP2009072381A JP5379528B2 (ja)	2009-03-24	2009-03-24	キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
TW099105608A TWI452177B (zh)	2009-03-24	2010-02-26	An electrolytic copper foil having a carrier foil, a method for producing an electrolytic copper foil having a carrier foil, and a copper clad laminate obtained by using the electrolytic copper foil having a carrier foil
KR1020100026149A KR101133162B1 (ko)	2009-03-24	2010-03-24	캐리어박 부착 전해 동박, 캐리어박 부착 전해 동박의 제조 방법, 및 그 캐리어박 부착 전해 동박을 이용해 얻어지는 동박 적층판

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2009072381A JP5379528B2 (ja)	2009-03-24	2009-03-24	キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2013179909A Division JP5503789B2 (ja)	2013-08-30	2013-08-30	キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板

Publications (2)

Publication Number	Publication Date
JP2010222657A JP2010222657A (ja)	2010-10-07
JP5379528B2 true JP5379528B2 (ja)	2013-12-25

Family

ID=43040160

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2009072381A Active JP5379528B2 (ja)	2009-03-24	2009-03-24	キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板

Country Status (3)

Country	Link
JP (1)	JP5379528B2 (ko)
KR (1)	KR101133162B1 (ko)
TW (1)	TWI452177B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103154327A (zh) *	2010-10-06	2013-06-12	古河电气工业株式会社	铜箔及其制备方法、带有载体的铜箔及其制备方法、印刷电路板、多层印刷电路板
TWI561138B (en) *	2011-03-30	2016-12-01	Mitsui Mining & Smelting Co	Method of manufacturing multi-layer printed wiring board and multi-layer printed wiring board obtained by the manufacturing method
US9585261B2 (en)	2011-03-30	2017-02-28	Mitsui Mining & Smelting Co., Ltd.	Manufacturing method of multilayer printed wiring board
JP5816230B2 (ja) *	2012-05-11	2015-11-18	Jx日鉱日石金属株式会社	表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
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JP6140481B2 (ja) *	2013-03-05	2017-05-31	Ｊｘ金属株式会社	キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
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