JP5209844B2 - 電子素子及びその製造方法、演算素子並びに表示素子 - Google Patents
電子素子及びその製造方法、演算素子並びに表示素子 Download PDFInfo
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- JP5209844B2 JP5209844B2 JP2005284928A JP2005284928A JP5209844B2 JP 5209844 B2 JP5209844 B2 JP 5209844B2 JP 2005284928 A JP2005284928 A JP 2005284928A JP 2005284928 A JP2005284928 A JP 2005284928A JP 5209844 B2 JP5209844 B2 JP 5209844B2
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- tetracarboxylic dianhydride
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- 238000000034 method Methods 0.000 title claims description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 26
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- 229920001721 polyimide Polymers 0.000 claims description 63
- 229920005575 poly(amic acid) Polymers 0.000 claims description 62
- 125000004432 carbon atom Chemical group C* 0.000 claims description 59
- 239000004642 Polyimide Substances 0.000 claims description 58
- 239000012212 insulator Substances 0.000 claims description 53
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- 125000000217 alkyl group Chemical group 0.000 claims description 33
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- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 28
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 17
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 125000002947 alkylene group Chemical group 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 7
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- 125000002345 steroid group Chemical group 0.000 claims description 4
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- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical group N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 4
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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Description
請求項10に記載の発明は、電子素子の製造方法において、請求項7に記載の電子素子を製造する方法であって、前記第一の絶縁体層に紫外線でパターン露光する工程と、該第一の絶縁体層のパターン露光された領域に前記第一の電極層を形成する工程を有することを特徴とする。
請求項10に記載の発明によれば、第一の電極層の微細なパターニングをすることができる。
請求項11に記載の発明は、請求項10に記載の電子素子の製造方法において、インクジェット法を用いて前記第一の電極層を形成することを特徴とする。
請求項11に記載の発明によれば、第一の電極層の微細なパターニングをすることができる。
[テトラカルボン酸二無水物]
1,2,3,4−シクロブタンテトラカルボン酸二無水物(構造式(1)):CBDA
1,2,4,5−シクロヘキサンテトラカルボン酸二無水物(構造式(7)):CHDA
ピロメリット酸二無水物(構造式(38)):PMDA
[ジアミン]
4,4’−ジアミノジフェニルメタン(構造式(51)):DDM
2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(構造式(93)):BAPP
5−{4−[2−(4−n−ペンチルシクロヘキシル)エチル]シクロヘキシル}フェニルメチル−1,3−ジアミノベンゼン(式(I−25);R43=C7H15):7Ch2Ch
[溶媒]
N−メチル−2−ピロリドン:NMP
ブチルセロソルブ(エチレングリコールモノブチルエーテル):BC
<ポリアミック酸の合成>
[合成例1]
温度計、攪拌機、原料投入仕込み口及び窒素ガス導入口を備えた100mlの四つ口フラスコに、DDM2.9831g(15.0mmol)及び脱水NMP60.0gを仕込み、乾燥窒素気流下で攪拌し、溶解させた。次に、CBDA2.3606g(12.0mmol)及びPMDA0.6563g(3.0mmol)を添加し、室温環境下で30時間反応させた。反応中に反応温度が上昇する場合は、反応温度を約70℃以下に抑えて反応させた。
[合成例2]
温度計、攪拌機、原料投入仕込み口及び窒素ガス導入口を備えた100mlの四つ口フラスコに、DDMを2.9128g(14.7mmol)及び脱水NMP60.0gを仕込み、乾燥窒素気流下で攪拌し、溶解させた。次に、CHDA1.6466g(7.35mmol)及びCBDA1.4406g(7.35mmol)を添加し、室温環境下で30時間反応させた。反応中に反応温度が上昇する場合は、反応温度を約70℃以下に抑えて反応させた。
[合成例3]
温度計、攪拌機、原料投入仕込み口及び窒素ガス導入口を備えた100mlの四つ口フラスコに、7Ch2Chを4.1747g(8.50mmol)及び脱水NMP60gを仕込み、乾燥窒素気流下で攪拌し、溶解させた。次に、CBDA0.3350g(1.70mmol)及びPMDA1.4903g(6.80mmol)を添加し、室温環境下で30時間反応させた。反応中に反応温度が上昇する場合は、反応温度を約70℃以下に抑えて反応させた。
[合成例4]
温度計、攪拌機、原料投入仕込み口及び窒素ガス導入口を備えた100mlの四つ口フラスコに、DDMを0.5800g(2.925mmol)、7Ch2Chを3.3362g(6.825mmol)及び脱水NMP60.0gを仕込み、乾燥窒素気流下で攪拌し、溶解させた。次に、CBDA0.3824g(1.95mmol)及びPMDA1.7014g(7.80mmol)を添加し、室温環境下で30時間反応させた。反応中に反応温度が上昇する場合は、反応温度を約70℃以下に抑えて反応させた。
[合成例5]
温度計、攪拌機、原料投入仕込み口及び窒素ガス導入口を備えた100mlの四つ口フラスコに、7Ch2Chを4.2820g(8.76mmol)及び脱水NMP60.0gを仕込み、乾燥窒素気流下で攪拌し、溶解させた。次に、CBDA1.7180g(8.76mmol)を添加し、室温環境下で30時間反応させた。反応中に反応温度が上昇する場合は、反応温度を約70℃以下に抑えて反応させた。
[比較合成例1]
温度計、攪拌機、原料投入仕込み口及び窒素ガス導入口を備えた100mlの四つ口フラスコに、DDMを2.8570g(14.41mmol)及び脱水NMP60.0gを仕込み、乾燥窒素気流下で攪拌し、溶解させた。次に、PMDA3.1430g(14.41mmol)を添加し、室温環境下で30時間反応させた。反応中に反応温度が上昇する場合は、反応温度を約70℃以下に抑えて反応させた。
[比較合成例2]
温度計、攪拌機、原料投入仕込み口及び窒素ガス導入口を備えた100mlの四つ口フラスコに、BAPPを3.9181g(9.544mmol)及び脱水NMP60.0gを仕込み、乾燥窒素気流下で攪拌し、溶解させた。次に、PMDA2.0819g(9.544mmol)を添加し、室温環境下で30時間反応させた。反応中に反応温度が上昇する場合は、反応温度を約70℃以下に抑えて反応させた。
[実施例1]
95gのPA1と、5gのPA3の混合液S1をスピンコート塗布し、グローブボックスにおいて、280℃で1時間焼成を行い、膜厚約200nmのポリイミド材料を得た。
[実施例2]
95gのPA1と、5gのPA4の混合液S2をスピンコート塗布し、グローブボックスにおいて、280℃で1時間焼成を行い、膜厚約200nmのポリイミド材料を得た。
[参考例3]
100のPA2からなる液S3をスピンコート塗布し、グローブボックスにおいて、280℃で1時間焼成を行い、膜厚約200nmのポリイミド材料を得た。
[実施例4]
95gのPA2と、5gのPA5の混合液S4をスピンコート塗布し、グローブボックスにおいて、280℃で1時間焼成を行い、膜厚約200nmのポリイミド材料を得た。
[実施例5]
95gのPA2と、5gのPA5と、p−ヒドロキシピリジン(イミド化触媒)1gの混合液S5をスピンコート塗布し、グローブボックスにおいて、220℃で1時間焼成を行い、膜厚約200nmのポリイミド材料を得た。
[実施例6]
95gのPA2と、5gのPA5の混合液S4をスピンコート塗布し、グローブボックスにおいて、220℃で1時間焼成を行い、膜厚約200nmのポリイミド材料を得た。
[比較例1]
100gのPA7からなる液S5をスピンコート塗布し、グローブボックスにおいて、280℃で1時間焼成を行い、膜厚約200nmのポリイミド材料を得た。
<体積抵抗率の評価>
図8に体積抵抗率の評価装置の構成を示した。電極15としては、蒸着により成膜した直径1mmのAu電極を用いた。
<移動度の評価>
図9に電子素子の形状及び移動度の評価装置の構成を示した。ソース電極4及びドレイン電極5としては、蒸着により成膜したAu電極を用い、チャネル長は、50μm±5μmとした。ゲート電極2としては、Al電極を用いた。半導体層6は、構造式
<パターニング性の評価>
S1、S3及びS4を塗布し、所定の成膜条件で成膜した絶縁体層3上に、移動度測定時のソース電極4及びドレイン電極5(第二の電極層)のAu電極の代りに、第二の電極層に相当するパターンを、波長250nmのUV光(9mW/cm2)を用いてマスク露光し、その露光部にインクジェットでポリエチレンジオキシチオフェンからなる第二の電極層をパターニングし、そのパターニング状態を光学顕微鏡で観察した。なお、マスクパターン通りにパターニングできるものを○、マスクパターン通りにパターニングできない場合があるものを△、マスクパターン通りにパターニングできないものを×として、判定した。この結果を表1に示した。
2 ゲート電極
3、3A、3B 絶縁体層
4 ソース電極
5 ドレイン電極
6 半導体層
7 第一のポリイミド材料
8 第二のポリイミド材料
9 紫外線照射部
10 階調信号線
11 走査線
12 コンデンサー
13 液晶セル
14 電子素子
15 電極
16 ポリイミド材料
17 第一の電源
18 第二の電源
19、20 電流計
Claims (13)
- 基板上に、電極層、半導体層及び絶縁体層が積層されている電子素子において、
前記絶縁体層は、第一のポリイミド材料及び第二のポリイミド材料を含有し、
前記第一のポリイミド材料は、テトラカルボン酸二無水物及び該テトラカルボン酸二無水物の誘導体からなる群より選択される一種以上の第一のテトラカルボン酸二無水物系化合物と、第一のジアミン化合物とを反応させて得られるポリアミック酸及び該ポリアミック酸の誘導体をイミド化させて得られ、
前記第一のテトラカルボン酸二無水物系化合物は、構造式
前記第二のポリイミド材料は、テトラカルボン酸二無水物及び該テトラカルボン酸二無水物の誘導体からなる群より選択される一種以上の第二のテトラカルボン酸二無水物系化合物と、第二のジアミン化合物とを反応させて得られるポリアミック酸及び/又は該ポリアミック酸の誘導体をイミド化させて得られ、
前記第二のテトラカルボン酸二無水物系化合物は、構造式
前記第二のジアミン化合物は、側鎖を有するジアミンを含有することを特徴とする電子素子。 - 前記側鎖を有するジアミンは、一般式
R1は、単結合、オキシ基、カルボニル基、−COO−、−OCO−、−CONH−、−CH2O−、−CF2O−又は−(CH2)e−であり、
R2は、ステロイド骨格を有する基、一般式
R3は、それぞれ独立して水素原子又はメチル基であり、
R4は、それぞれ独立して水素原子又は炭素数が1以上20以下のアルキル基であり、
R5は、それぞれ独立して単結合、カルボニル基又はメチレン基であり、
R6及びR7は、それぞれ独立して水素原子、炭素数が1以上20以下のアルキル基又はフェニル基であり、
R8は、水素原子又は炭素数が1以上20以下のアルキル基であり、
R9は、それぞれ独立してオキシ基又は炭素数が1以上6以下のアルキレン基であり、
R10及びR11は、それぞれ独立して水素原子、炭素数が1以上20以下のアルキル基又はパーフルオロアルキル基であり、
R10及び/又はR11は、炭素数が3以上のアルキル基又はパーフルオロアルキル基であり、
R12は、それぞれ独立してオキシ基又は炭素数が1以上6以下のアルキレン基であり、
R13、R14及びR15は、それぞれ独立して単結合、オキシ基、−COO−、−OCO−、−CONH−、炭素数が1以上4以下のアルキレン基、炭素数が1以上3以下のオキシアルキレン基又は炭素数が1以上3以下のアルキレンオキシ基であり、
R16及びR17は、それぞれ独立して水素原子、フルオロ基又はメチル基であり、
R18は、水素原子、フルオロ基、クロロ基、シアノ基、炭素数が1以上20以下のアルキル基、炭素数が1以上20以下のアルコキシ基、炭素数が2以上20以下のアルコキシアルキル基、フルオロメチル基、ジフルオロメチル基、トリフルオロメチル基、フルオロメトキシ基、ジフルオロメトキシ基又はトリフルオロメトキシ基であり、
環Aは、1,4−フェニレン基又は1,4−シクロヘキシレン基であり、
環B及び環Cは、それぞれ独立して1,4−フェニレン基又は1,4−シクロヘキシレン基であり、
aは、0又は1であり、
bは、0以上2以下の整数であり、
cは、それぞれ独立して0又は1であり、
dは、それぞれ独立して0又は1であり、
eは、1以上6以下の整数であり、
f、g及びhは、それぞれ独立して0以上4以下の整数であり、
i、j及びkは、それぞれ0以上3以下の整数であり、
i、j及びkの和は、1以上であり、
l及びmは、それぞれ独立して1又は2であることを特徴とする請求項1に記載の電子素子。 - 前記第二のジアミン化合物に対する前記側鎖を有するジアミンのモル比が0.3以上1以下であることを特徴とする請求項1又は2に記載の電子素子。
- 前記第二のポリイミド材料は、前記ポリアミック酸及び/又は前記ポリアミック酸誘導体を、イミド化触媒を用いてイミド化させて得られることを特徴とする請求項1乃至3のいずれか一項に記載の電子素子。
- 前記半導体層は、有機半導体を含有することを特徴とする請求項1乃至4のいずれか一項に記載の電子素子。
- 前記基板上に、第一の電極層、前記絶縁体層、離間配置された一対の電極を有する第二の電極層及び前記半導体層が順次積層されていることを特徴とする請求項1乃至5のいずれか一項に記載の電子素子。
- 前記基板上に、前記第一のポリイミド材料及び前記第二のポリイミド材料を含有する第一の絶縁体層、離間配置された一対の電極を有する第一の電極層、前記半導体層、第二の絶縁体層及び第二の電極層が順次積層されていることを特徴とする請求項1乃至5のいずれか一項に記載の電子素子。
- 請求項6に記載の電子素子を製造する方法であって、
前記絶縁体層に紫外線でパターン露光する工程と、
該絶縁体層のパターン露光された領域に前記第二の電極層を形成する工程を有することを特徴とする電子素子の製造方法。 - インクジェット法を用いて前記第二の電極層を形成することを特徴とする請求項8に記載の電子素子の製造方法。
- 請求項7に記載の電子素子を製造する方法であって、
前記第一の絶縁体層に紫外線でパターン露光する工程と、
該第一の絶縁体層のパターン露光された領域に前記第一の電極層を形成する工程を有することを特徴とする電子素子の製造方法。 - インクジェット法を用いて前記第一の電極層を形成することを特徴とする請求項10に記載の電子素子の製造方法。
- 請求項1乃至7のいずれか一項に記載の電子素子を有することを特徴とする演算素子。
- 請求項1乃至7のいずれか一項に記載の電子素子を有することを特徴とする表示素子。
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US11/287,325 US20060124925A1 (en) | 2004-11-30 | 2005-11-28 | Electron device, operational device and display device |
TW094141924A TWI281743B (en) | 2004-11-30 | 2005-11-29 | Electron device, operational device and display device |
KR1020050115960A KR100723325B1 (ko) | 2004-11-30 | 2005-11-30 | 전자 소자, 연산 소자 및 표시 소자 |
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Cited By (1)
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