JP4875386B2 - 低応力導電性接着材 - Google Patents
低応力導電性接着材 Download PDFInfo
- Publication number
- JP4875386B2 JP4875386B2 JP2006057140A JP2006057140A JP4875386B2 JP 4875386 B2 JP4875386 B2 JP 4875386B2 JP 2006057140 A JP2006057140 A JP 2006057140A JP 2006057140 A JP2006057140 A JP 2006057140A JP 4875386 B2 JP4875386 B2 JP 4875386B2
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- conductive
- silver
- epoxy
- present
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- 239000000853 adhesive Substances 0.000 title claims abstract description 44
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 44
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 17
- 239000004593 Epoxy Substances 0.000 claims abstract description 13
- 239000011231 conductive filler Substances 0.000 claims abstract description 9
- 229920001897 terpolymer Polymers 0.000 claims abstract description 9
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 31
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- 239000003822 epoxy resin Substances 0.000 claims description 18
- 239000000654 additive Substances 0.000 claims description 13
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 238000004377 microelectronic Methods 0.000 claims description 3
- 239000006254 rheological additive Substances 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
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- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 239000012948 isocyanate Chemical group 0.000 claims description 2
- 150000002513 isocyanates Chemical group 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims 1
- 229920001002 functional polymer Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- 239000004615 ingredient Substances 0.000 abstract description 2
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- 229910000679 solder Inorganic materials 0.000 description 14
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
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- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
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- 229920000459 Nitrile rubber Polymers 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
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- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
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- 239000005041 Mylar™ Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- IRLQAJPIHBZROB-UHFFFAOYSA-N buta-2,3-dienenitrile Chemical compound C=C=CC#N IRLQAJPIHBZROB-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BXVMOCCLLZXYSZ-UHFFFAOYSA-N butyl prop-2-enoate;2-methylidenebutanenitrile Chemical group CCC(=C)C#N.CCCCOC(=O)C=C BXVMOCCLLZXYSZ-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
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- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- IRCAZSRWCCDLJN-UHFFFAOYSA-N ethyl prop-2-enoate;prop-2-enenitrile Chemical compound C=CC#N.CCOC(=O)C=C IRCAZSRWCCDLJN-UHFFFAOYSA-N 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
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- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01C—PLANTING; SOWING; FERTILISING
- A01C1/00—Apparatus, or methods of use thereof, for testing or treating seed, roots, or the like, prior to sowing or planting
- A01C1/02—Germinating apparatus; Determining germination capacity of seeds or the like
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G31/00—Soilless cultivation, e.g. hydroponics
- A01G31/02—Special apparatus therefor
- A01G31/06—Hydroponic culture on racks or in stacked containers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01—ELECTRIC ELEMENTS
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29301—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/29311—Tin [Sn] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Spectroscopy & Molecular Physics (AREA)
- Soil Sciences (AREA)
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- Adhesives Or Adhesive Processes (AREA)
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Description
本発明は、電気的に安定な相互接続を与えるために超小型電子デバイス又は半導体パッケージにおいて導電性材料として使用されるのに適した組成物に関する。
超小型電子デバイス及び半導体パッケージの作製及び組立において、導電性組成物が様々な目的に使用されている。例えば、導電性接着材は、集積回路チップを基板に接着するために(ダイ取り付け用接着材)又は回路アセンブリを印刷配線基板に接着するために(表面実装導電性接着材)使用される。
本発明は低応力、等方性、導電性のフィルム又はペースト接着材に関し、その接着材はa)1以上の官能性アクリルコポリマー又はターポリマー;b)エポキシ樹脂;及びc)導電性フィラーを含む。接着促進剤、硬化剤、導電性向上剤等の追加の成分も利用できる。本発明の導電性フィルム接着材は従来のフレキシブル導電性フィルム接着材よりも高い接着強度を与え、現存する高接着強度導電性フィルムよりも被接着部品間の低い応力を与える。
本発明の導電性接着材は、a)1以上の官能性アクリルコポリマー又はターポリマー;b)エポキシ樹脂;及びc)導電性フィラーを含む。好ましい態様において、1以上の接着促進剤、硬化剤及び導電率添加剤も含むことができる。ここで、官能性アクリルコポリマーに関して言及される場合、官能性アクリルコポリマーはターポリマーを含んでもよいと理解される。
本発明の官能性アクリルコポリマーは表1中の成分で配合処方された。
2 RSL-1462 DGEGA epoxy(Resolution Performance Productsから商業的に入手可能)
3 Dicyanex 1400B(Air Productsから)
4 導電性促進剤及び銀充填剤は専売材料(proprietary materials)である。
表1の配合物Aの性能は商業的に入手できる高接着強度エポキシ樹脂及び低応力エポキシ樹脂の性能と共に試験した。試験された高接着強度エポキシ樹脂(比較例A)はCF3350(Emerson & Cumingから商業的に入手可能)であり、試験された低応力エポキシ樹脂(比較例B)は845OWL(AI Technologiesから商業的に入手可能)であった。これら試験の結果を表2に示す。
Claims (14)
- 超小型電子デバイス用組成物であって、
a)30℃〜−40℃の範囲内のTgを有する官能性アクリルコポリマー又はターポリマー;
b)エポキシ樹脂;
c)導電性フィラー;及び
d)前記組成物を熱硬化させるための硬化剤;
を含み、
(a)前記官能性アクリルコポリマー又はターポリマーが4〜19重量%の量で存在し;
(b)前記エポキシ樹脂が1〜8重量%の量で存在し;
(c)前記導電性フィラーが60〜95重量%の量で存在する;
組成物。 - 1以上の導電率添加剤をさらに含む請求項1の組成物。
- 1以上の導電率添加剤が0.01〜1重量%の量で存在する、請求項2の組成物。
- 1以上の硬化剤をさらに含む請求項1の組成物。
- 1以上の硬化剤が0.1〜3重量%の量で存在する、請求項4の組成物。
- 官能性アクリルコポリマー又はターポリマーがヒドロキシル、カルボン酸、イソシアネート又はエポキシ官能基を有する、請求項1の組成物。
- 官能性アクリルコポリマー又はターポリマーが200,000〜900,000の範囲内の分子量を有する、請求項1の組成物。
- 導電性フィラーが銀、銅、金、パラジウム、白金、カーボンブラック、カーボンファイバー、グラファイト、アルミニウム、インジウム錫酸化物、銀コートされた銅、銀コートされたアルミニウム、ビスマス、錫、ビスマス−錫合金、金属コートされたガラス球、銀コートされたファイバー、銀コートされた球、アンチモンドープされた錫酸化物、カーボンナノチューブ、導電性ナノフィラー、導電性酸化物、及びそれらの混合物からなる群から選ばれる、請求項1の組成物。
- エポキシ樹脂がビスフェノールA及びビスフェノールFの単官能性及び多官能性グリシジルエーテル類、脂肪族及び芳香族エポキシ類、飽和及び不飽和エポキシ類、脂環族エポキシ樹脂、エポキシ官能性ポリマー、コポリマー、ターポリマー又はこれらの混合物の群から選ばれる、請求項1の組成物。
- 流動添加剤、接着促進剤及びレオロジー改質剤からなる群の1以上をさらに含む請求項1の組成物。
- 組成物が低応力フィルム導電性接着材である、請求項1の組成物。
- 組成物が導電性の接着性ペーストであり、低応力フィルム導電性接着材にB段階処理できる、請求項1の組成物。
- 請求項1の組成物を使用して電子部品を接着する方法。
- 請求項1の組成物を使用して電子部品を接着するためのフレキシブルフィルム又はペーストを提供する方法。
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US11/073,778 | 2005-03-07 | ||
US11/073,778 US7326369B2 (en) | 2005-03-07 | 2005-03-07 | Low stress conductive adhesive |
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JP2006249426A JP2006249426A (ja) | 2006-09-21 |
JP4875386B2 true JP4875386B2 (ja) | 2012-02-15 |
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US (1) | US7326369B2 (ja) |
EP (1) | EP1701361B1 (ja) |
JP (1) | JP4875386B2 (ja) |
KR (1) | KR101325083B1 (ja) |
CN (1) | CN1831073B (ja) |
AT (1) | ATE465497T1 (ja) |
DE (1) | DE602006013734D1 (ja) |
TW (1) | TWI382076B (ja) |
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2005
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- 2006-03-03 JP JP2006057140A patent/JP4875386B2/ja active Active
- 2006-03-06 TW TW095107344A patent/TWI382076B/zh active
- 2006-03-06 EP EP06004488A patent/EP1701361B1/en active Active
- 2006-03-06 KR KR1020060020908A patent/KR101325083B1/ko active IP Right Grant
- 2006-03-06 DE DE602006013734T patent/DE602006013734D1/de active Active
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KR101325083B1 (ko) | 2013-11-06 |
US7326369B2 (en) | 2008-02-05 |
TW200704743A (en) | 2007-02-01 |
EP1701361A1 (en) | 2006-09-13 |
US20060197066A1 (en) | 2006-09-07 |
CN1831073A (zh) | 2006-09-13 |
ATE465497T1 (de) | 2010-05-15 |
CN1831073B (zh) | 2012-01-18 |
KR20060097610A (ko) | 2006-09-14 |
EP1701361B1 (en) | 2010-04-21 |
DE602006013734D1 (de) | 2010-06-02 |
TWI382076B (zh) | 2013-01-11 |
JP2006249426A (ja) | 2006-09-21 |
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