JP4857239B2 - ウェハ保持装置 - Google Patents
ウェハ保持装置 Download PDFInfo
- Publication number
- JP4857239B2 JP4857239B2 JP2007277162A JP2007277162A JP4857239B2 JP 4857239 B2 JP4857239 B2 JP 4857239B2 JP 2007277162 A JP2007277162 A JP 2007277162A JP 2007277162 A JP2007277162 A JP 2007277162A JP 4857239 B2 JP4857239 B2 JP 4857239B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- carrier
- height position
- support surface
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
11 装置本体部
12 検査ステージ
13 検査ステージ
14 ウェハ
14a 周縁部
15 キャリア
15c 環状空間
17 チャック台盤
17b 周縁部
18 (筒状部材としての)吸着パッド
18b 上端
19 ウェハ受座
21 受け面
23 ウェハ吸引孔
26 (キャリア支持手段であり吸引機構としての)キャリア吸引孔
B 初期高さ位置
P (キャリア支持手段であり吸引機構としての)吸引装置
Claims (5)
- 装置本体部に設けられた柱状のチャック台盤の周縁部に沿ってリング状のウェハ受座が形成され、前記ウェハ受座に置かれたウェハの周縁部を複数の固定手段によって前記ウェハ受座に固定することにより前記ウェハを保持可能なウェハ保持装置であって、
前記ウェハは、前記ウェハ受座に固定される前は前記ウェハの周縁部を下方から支持する環状を呈しその環状空間で前記チャック台盤を受け入れ可能とされたキャリアに載置されており、
前記装置本体部は、前記ウェハ受座の受け面と前記ウェハとが平行な状態で前記キャリアを支持可能な支持面を形成し、かつ該支持面の高さ位置を前記受け面と直交する方向に変位自在であり、さらに前記支持面に前記キャリアが載せられた状態では前記ウェハを前記ウェハ受座に当接させる受渡高さ位置に前記支持面を位置させるキャリア支持手段を有し、
前記受渡高さ位置の前記支持面に載せられている前記キャリアに載置されて前記ウェハ受座に置かれた前記ウェハを前記固定手段で固定することに伴って、前記キャリア支持手段が前記支持面を前記受渡高さ位置から下降させて前記ウェハを前記キャリアから分離することを特徴とするウェハ保持装置。 - 前記キャリア支持手段は、前記支持面に前記キャリアが載せられていない状態では、前記受渡高さ位置よりも高い高さ位置である初期高さ位置に前記支持面を位置させ、前記初期高さ位置にある前記支持面に前記キャリアが載せられると前記支持面を前記受渡高さ位置以下まで下降させて前記ウェハを前記ウェハ受座に置くことを特徴とする請求項1に記載のウェハ保持装置。
- 前記キャリア支持手段は、弾性変形可能な部材からなり伸縮自在とする蛇腹状を呈し前記装置本体部に設けられた筒状部材と、該筒状部材の内方空間の空気を前記装置本体部側で吸引可能な吸引機構とを有し、
前記筒状部材は、前記初期高さ位置にある前記支持面に前記キャリアが載せられると該キャリアの重さにより前記支持面を前記初期高さ位置から前記受渡高さ位置まで下降させ、前記吸引機構の吸引により前記支持面を前記受渡高さ位置から下降させることを特徴とする請求項2に記載のウェハ保持装置。 - 前記キャリア支持手段は、前記筒状部材の開放された上端で前記支持面を形成するとともに、該支持面に前記キャリアが載せられることで封止された前記内方空間の空気を前記吸引機構が吸引することにより前記支持面を前記受渡高さ位置から下降させることを特徴とする請求項3に記載のウェハ保持装置。
- 前記固定手段は、前記受け面を開放し、前記ウェハが前記ウェハ受座に置かれることにより封止可能とされ、前記吸引機構による空気の吸引が可能とされたウェハ吸引孔を有していることを特徴とする請求項3または請求項4に記載のウェハ保持装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007277162A JP4857239B2 (ja) | 2007-10-25 | 2007-10-25 | ウェハ保持装置 |
US12/288,284 US7923990B2 (en) | 2007-10-25 | 2008-10-17 | Wafer holder |
TW097140908A TW200919626A (en) | 2007-10-25 | 2008-10-24 | Wafer holder |
KR1020080104839A KR100998552B1 (ko) | 2007-10-25 | 2008-10-24 | 웨이퍼 홀더 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007277162A JP4857239B2 (ja) | 2007-10-25 | 2007-10-25 | ウェハ保持装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009105295A JP2009105295A (ja) | 2009-05-14 |
JP2009105295A5 JP2009105295A5 (ja) | 2010-12-02 |
JP4857239B2 true JP4857239B2 (ja) | 2012-01-18 |
Family
ID=40583061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007277162A Expired - Fee Related JP4857239B2 (ja) | 2007-10-25 | 2007-10-25 | ウェハ保持装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7923990B2 (ja) |
JP (1) | JP4857239B2 (ja) |
KR (1) | KR100998552B1 (ja) |
TW (1) | TW200919626A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107039308A (zh) * | 2015-10-22 | 2017-08-11 | 朗姆研究公司 | 前开式环形盒 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011029217A (ja) * | 2009-07-21 | 2011-02-10 | Okawa Kanagata Sekkei Jimusho:Kk | ウェーハ用ホルダ |
JP6051523B2 (ja) * | 2009-12-18 | 2016-12-27 | 株式会社ニコン | 基板ホルダ対、基板接合装置およびデバイスの製造方法 |
RU2523356C2 (ru) * | 2012-10-16 | 2014-07-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Новгородский государственный университет имени Ярослава Мудрого" | Конструкция электродов для снятия электрокардиограммы |
TW201714243A (zh) * | 2015-10-05 | 2017-04-16 | Els System Technology Co Ltd | 承載裝置 |
JP6842948B2 (ja) * | 2017-02-24 | 2021-03-17 | リンテック株式会社 | 位置決め装置および位置決め方法 |
EP3422396B1 (de) * | 2017-06-28 | 2021-08-04 | Meyer Burger (Germany) GmbH | Vorrichtung zum transport eines substrats, behandlungsvorrichtung mit einer an einen substratträger einer solchen vorrichtung angepassten aufnahmeplatte und verfahren zum prozessieren eines substrates unter nutzung einer solchen vorrichtung zum transport eines substrats sowie behandlungsanlage |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07201948A (ja) * | 1993-12-29 | 1995-08-04 | Dainippon Screen Mfg Co Ltd | 基板搬送治具 |
US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
JP4128023B2 (ja) * | 2002-04-26 | 2008-07-30 | 株式会社トプコン | ウェーハ保持装置 |
JP4471747B2 (ja) * | 2004-06-24 | 2010-06-02 | アピックヤマダ株式会社 | 半導体装置の製造装置 |
JP2007109771A (ja) * | 2005-10-12 | 2007-04-26 | Matsushita Electric Ind Co Ltd | プラズマ処理装置用のトレイ |
-
2007
- 2007-10-25 JP JP2007277162A patent/JP4857239B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-17 US US12/288,284 patent/US7923990B2/en not_active Expired - Fee Related
- 2008-10-24 TW TW097140908A patent/TW200919626A/zh unknown
- 2008-10-24 KR KR1020080104839A patent/KR100998552B1/ko not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107039308A (zh) * | 2015-10-22 | 2017-08-11 | 朗姆研究公司 | 前开式环形盒 |
CN107039308B (zh) * | 2015-10-22 | 2020-01-03 | 朗姆研究公司 | 前开式环形盒 |
Also Published As
Publication number | Publication date |
---|---|
KR100998552B1 (ko) | 2010-12-07 |
US20090110521A1 (en) | 2009-04-30 |
KR20090042191A (ko) | 2009-04-29 |
JP2009105295A (ja) | 2009-05-14 |
TW200919626A (en) | 2009-05-01 |
US7923990B2 (en) | 2011-04-12 |
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